工程變更通知單ENGINEERING CHANGE NOTICE******** 目錄********項目(Item) 內容(Description) 頁次(Page)目錄/content 1修訂履歷revision 21 目的/Purpose 12 使用範圍/Scope 13 機台簡介/Machine introduction 14 機台操作/Machine operator 1-25 注意事項/Caution statement 26 設備保養/Maintenance 27 錫膏的使用/Solder paste usage 38 鋼板擦試/Cleaning screen 39 附表/An attached table 3-4-510 關鍵備件/Key parts list 5修訂履歷Revision History质量保证操作系统DEK 印刷機操作手冊/DEK printermachine operating instructionsPAGE 1/5REV A1.目的/Purpose為了使操作員更好的瞭解印刷機的基本操作,並給初學者以指導. /In order to make the opereator to know more of the printer basic opereate,and give a direct to the beginner.2.使用範圍/ScopeDEK265印刷機./DEK265 printer3. 機台名稱與參數簡介/equipment appellation and parameter introduceMODEL:DEK265AC:220V 50/60HZ 20A AIR:5~7kg f/cm² BOARD WIDTH:42.5~508.5mmPRESSURE:0~20kg SPEED:2~150mm/s BOARD LENGTH:50~510mm4.機台操作/equipment opereation4.1 開機/start machine4.1.1 將AVR 的開關置ON./Take the AVR switch to ON.4.1.2 將Mains Lsolator Switch 置ON./Take Mains Lsolator Switch to ON. 4.1.3 開機進入主書面後根據提示按亮電腦下方的藍色按鈕(Systen Switch)./According to the suggestion to press light the blue button in the lower of computer(System Switch ) after enter the 注:"Mains Lsolator Switch"是DEK 印刷機正前方右門左上角的旋鈕./"Mains Lsolator Switch "is left the botton that on the top of the front right door . 4.2 印刷機換線/Printer changeing line.4.2.1 將支撐Pin 移至安全處./Take the support Pin to safe place. 4.2.2 量測PCB 板的長.寬.高./Survey the long,wide and depth of PCB board.4.2.3 調整/Adjust Stencil(PCB 板的寬度等於印刷機Stencil 架右側手輪的數值,換新版次更換Stencil). 4.2.4 點擊Load Data 換新版次選擇Edit Data 並參照4.3)選擇檔案名./Attack to Load data change new edition ,choose Edit Data and files name (and refer to 4.3). 4.2.5 將支撐Pin 調好(並參照5.3)/Adjust to the support Pin. 4.2.6 加錫膏(並參照7)/Add paste. 4.2.7 點擊Run./Attack RUN.4.3 新程式製作/Edit new program.4.3.1 開機進入主書面./Start machine and enter the main panel.4.3.2 點擊Setup 選擇Edit Data 可進入編輯書面./Attack Setup and choose Edit Data to enter the edit panel. 4.3.3 根據提示進行編輯(輸入檔案名,PCB 板的長寬高,Mark 點的X, Y 座標,前後刮刀的壓力以及印刷速度.擦拭的模式.頻率和速度)/Edit according to the suggestions.(import files name ,the long,wide and depth of the PCB board,the X,Y coordinate of Marks pressure and printing speed of scraper,the clean mode ,frequency and speed. 4.3.4 Save Flie 並Exit./Save Files and Exit.质量保证操作系统DEK 印刷機操作手冊/DEK printermachine operating instructionsPAGE 2/5REV A4.3.5 點擊Setup 選擇Mode 使印刷模式為Step./attack Setup and choose Mode to make the printing mode to Step.4.3.6 點擊Exit./Attack Exit. 4.3.7 點擊Run.Attack Run.4.3.8 點擊Auto Board 選擇Step(點擊兩下)./Attack Auto Board and choose Step (attack twice). 4.3.9 根據提示矯正Mark 的Fiducial Type and Background and Accept Score 參數./Adjust Fiducial Type and Background and Accept Score parameter of the Mark according by the suggestion.4.3.10 點擊LiaernFiducial 並根據提示輸入資料(Mark 的直徑以及直徑的內外偏差)./Attack Liaern Fiducial and input data according by the suggestion( Mark's diameter and the declination of diameter both at home and abroad). 4.3.11 Exit 並點擊Locate Fiducial./Exit and attack Locate Fiducial.4.3.12 無OK 對以上資料進行修改直到OK(OK 是指Locate 中的Score 參數Accept Score 參數)./Revise the data until it's OK(OK is the Score parameter and Accept Score parameter in the Locate).4.3.13 OK 後點擊Exit 選擇Step 進行下一個Mark 點的編輯(根據4.3.9 ~ 1.3.12)./After it's OK,attack Exit and choose Step to edit the next Mark (According to 4.3.9 ~ 1.3.12). 4.3.14 剩餘兩個Mark 點依照4.3.9 ~ 4.3.13./The other two Marks according by 4.3.9 ~ 4.3.13. 4.3.15 Mark 點OK 後點擊Step 進行Mark 點的矯正./After the Mark is OK,attack Step to adjust the Marks. 4.3.16 Mark 點矯正OK,編輯完畢./The Mark is adjusted Ok ,and the edition is finished. 4.3.17 Exit 點擊Setup 選擇Mode 使印刷模式為Auto(連接4.2.5)./Exit and attack Step to choose Mode ,in order to make the print mode become Auto.4.4 關機/Shut off the machine.4.4.1 點擊CLOSE SYSTEM./Attack CLOSE SYSTEM.4.4.2 根據提示將Mains lsolator Switch 置OFF./Take the Mains lsolator Switch to OFF according bythe suggestion. 4.4.3 將AVR 的開關置OFF./Take the switch of the AVR to OFF.注/Remark:"Mains lsolator Switch"是DEK 印刷機正前方右門左上角的旋鈕./"Mains Lsolator Switch "is left the botton that on the top of the front right door . "CLOSE SYSTEM"在電腦書面的下方./"CLOSE SESTEM" is in the button of the computer panel.5. 注意事項/Attention5.1 不要擅自修改系統檔./Don't revise the system files to take upon yourself.5.2 不要擅自按不理解的鍵./Don't attack the button that you don't know the use to take upon yourself.5.3 支撐Pin 距軌道3-5mm 且均勻放置,反面有零件的要避開零件./The support Pin away from the track 3-5mmand lay up even, if there are many components on the back and avoid it. 5.4 鋼板擦試時和換線時避免撞壞刮刀./Avoid to hit the scraper in the cleaning stencil and changing line.6. 印刷機的保養./The maintenance of printer.6.1 印刷機的保養請參照<<DEK 印刷機保養手冊>>進行.质量保证操作系统DEK印刷機操作手冊/DEK printermachine operating instructionsPAGE 3/5REV A0 /The maintenance of printer according by "DEK printer maintenance opereation".7. 錫膏的使用./The use of paste.7.1 錫膏使用前須迥溫4-12小時./It must in the normal temperature 4-12 hours before to use the paste.7.2 使用時先進先出,新舊不混(使用後),新舊融合(使用中)./When you use it ,you must use the earlier one. When you finish add paste, the earlier one is not mix to the last .It must blend the earlier one and the last one the time you using it.7.3 機器攪拌2min,手工攪拌3-5min./The machine mix 2min, manual mix 3-5min.7.4 錫膏點點滴滴的添加./Add the paste dribs and drabs.7.5 錫膏保存時間要小於6個月./The preserve time of paste must under 6 month.8.鋼板擦試/Cleaning screen8.1 目的/Purpose將殘留錫膏擦拭清潔,不堵塞孔./Clean up the residual paste in order to not jam the holes.8.2 工具/Tools.沒有毛屑的紙和布,酒精,毛刷,氣槍./The paper and cloth that have no dust ,alcohol,comb and pneumatic gun.8.3 禁忌/Forbidden.8.3.1 鋼板孔切記不可用金屬物去碰撞或勾挖./It can't to take metal to collide and dig the stencil's hole.8.3.2 置放於突出物上./Don't take the stencil on salient.8.3.3 鋼板摔撞./Don't collide the stencil.9.附表/An attached table<<DEK 印刷機保養手冊>>/ "DEK printer maintenance opereation".DEK 印刷機保養手冊/DEK printer maintenance opereation保養類型/Mainten ance kind 保養部位/Maintenanceposition保養內容及方法/Maintenance contents and operation日保養/Daily maintenance 上升工作臺部位/Rise table position清潔表面的灰塵及殘留物/Clean the dust and residual on the surface鋼板固定機構/Stencil immovablemechanism清除固定鋼板夾上的灰塵/Clean the dust on the clip that immovable the Stencil 軌道皮帶/Track belt確認軌道皮帶沒有損壞,沒有油污,張力合適,PCB搬運順暢./Check the track belt is not damage and not greasy.And the tension is fit,PCB boardthrough smoothly.出入口處感應器確認感應器良好及清潔感應器表面之髒物质量保证操作系统DEK印刷機操作手冊/DEK printermachine operating instructionsPAGE 4/5REV A/The sensor of exit andentrance/Check the sensor is fine and clean the dust of the sensor surface.周保養/Weeklymaintenance刮刀組/Scraper forms清潔刮刀表面及其檔板,確認刮刀有無損傷或變形/Clean scraper surface and its board,check the scraper is not losses and become deformed 印刷滑動機構/Print slidemechanism確認其動作是否順暢/Confirm it is slide smoothly.相機/Camera清潔確認鏡面及支撐架無髒物/Clean and confirm there are no dirty in the mirror andsupport shelf.機器表面/Machinesurface機台烤漆及壓克力表面之清潔,用幹凈的布除去灰塵./Clean the dust on the surfaceof machine.刮刀組/Scraper forms確認刮刀有無損傷或變形,上下移動是否順暢./Confirm the scraper is not losses and become deformed,slide to low and below is smooth.月保養/Monthmaintenance印刷滑動機構/Print slide mechanism確認其皮帶及皮帶輪線性關係(是否變形)./Confirm the belt and its wheel linear relation(if it become deformed).相機/Camera確認其X/Y皮帶及皮帶輪線性關係(是否變形),鏡面無髒物,線性導軌工作順暢./Confirm the X/Y belt and its wheel linear relation(if it become deformed),there are nodust in the mirror and linear track work smoothly.軌道及氣閥/Track and valves of a tire確認軌道搬運順暢,檢查氣閥是否正常./Confirm the track and valves of a tire are OK 鋼板擦拭機構/Stencil clean mechanism確認其線性關係及電磁閥機構是否正常./Confirm its linear relation andelectromagnetic mechanism is OK.印刷滑動機構/Print slide mechanism擦乾凈其表面油污,加潤滑油;確認皮帶有無破裂或斷裂﹐移動動作是否順暢平穩./Clean the greasy dirt on the surface, add lubricating oil.Confirm if the belt is comeapart orbreak off,whether the print smooth.軌道系統/Track system清潔軌道及螺紋上的殘留物並加潤滑油;檢查PCB Clamp動作和皮帶傳輸狀況;清潔檢查出入口處感應sensors/Clean the residual of track and screw,and then addlubricating oil. Confirm PCB Clamp movement and blet transmission status.Clean andcheck the sensor of exit and entrance.刮刀組/Scraper forms擦乾凈螺杆導軌表面油污,加潤滑油;確認刮刀各個動作是否順暢平穩./Clean upthe greasy dirt of pole slideway surface,add lubricating, confirm all movement of thescraper is smooth.相機X/Y軸/Camera X/Y axle擦乾凈螺杆導軌表面油污,加潤滑油;確認皮帶和連線有無破損;用鏡頭紙擦拭相機鏡頭;移動動作是否順暢平穩../Clean up the greasy dirt of pole slideway surface,addlubricating. Confirm if the belt and line have demaged,. Clean the camera lens by thecamera lens paper. If the movement is smooth.鋼板擦拭機構/Stencil clean mechanism擦乾凈導軌,並潤滑軌道;清潔擦拭元件上的殘留物﹔檢查確認電線,氣管,馬達,溶劑/真空供給器及擦拭機構的動作是否順暢./Clean slideway, and lubricate track.Clean and wipe out the residual of the module.Check and confirm the electricwire ,windpipe,motor,solvent/vacuumsupply machine and clean mechanism movement issmooth.上升工作臺部位/Rise table position清潔擦乾凈導軌上的殘留物並加潤滑油;檢查上升Table部位brake狀況./Clean up the residual of slideway surface,add lubricating. Check the rise table brakestatus.Screen Actuators清潔軸承及導軌表面的殘留物,並加潤滑油/Clean the residual of the bearing and slideway surface, and then add lubricating.季保養/Quartermaintenance機器電控電源箱/Machine power box清潔表面的殘留物及內部,風扇的灰塵./Clean the residual of the surface and the dust of inside and electric fan .印刷滑動架系統/相機X/Y/Print slide mechanism/Camera X/Y axle檢查確認皮帶的張力.Check and confirm the tension of blet.质量保证操作系统DEK印刷機操作手冊/DEK printermachine operating instructionsPAGE 5/5REV A其它/Other 確認各部電氣線路接觸良好./Confirm the electric line is OK. 年保養/Yearmaintenance季保養內容/Quartermaintenance contents10.關鍵備件/Key parts list序號NO.適用機台型號To suit machinePartNumber品名Name規格Specifications廠家Supplier庫存數量Stocks number（PCS）1 DEK 137516 夾邊DEK 42 DEK 157729 DEK MOTOR DEK 13 DEK 133584 刮刀片250 MM DEK 44 DEK 129925 刮刀片200 MM DEK 15 DEK 133585 刮刀片300 MM DEK 2。