Solder Residue Stamp Not Clear Bent Pin Component Fall Off Component Distortion PCB Open Sunken Solder Block Hole Part On Side Label Damaged Label Scratch Label Indistinct Cable Broken Block Hole Icile No Body Marking/Discolored Label Placement Exposed Copper Solder Crack Pad Fall Off Panel Scratch PCB Scratch Incoming Defect BIOS Bad
FLEXTRONICS
缺陷（中文） 锡多 装配错误 分析错误 锡连/短路 肮脏 焊球 锡少 锡盘抬起 电子元件缺陷 脚长 元件错 多打元件 元件反向 元件高/元件倾斜 元件损坏 胶水多 胶水少 元件翻面 缺元件 竖立 漏焊 助焊剂残留板上 漏盖章 脚歪 冷焊 元件偏移 机械元件缺陷 脚未过板 软件错误 代分析 调整错误 安装不到位 铆接缺陷 脚翘 缺标签 标签不一致
锡渣 印章模糊 针歪 元件脱落 元件变形 印板开路 焊点凹陷 插孔堵塞标识/色差 标签偏移 露铜 锡裂 焊盘脱落 面板刮伤 印板刮伤 来料不良 BIOS不良
SR SNC BP CFO CD PO SUS BH POS LD LS LI CB BMH IC NBM LBP EC SC PFO PS PBS IND BB
常见缺陷中英文对照表
英文缺陷代号 ES AW AN SS FM SB IS LP EMD LL WP EP RP HP DP EG IG IP MP TP NS FL MS BL CS SK MMD LNP WS TA TE PA RD LF ML LNC 缺陷（英文） Excess Solder Assembled Wrong Analysis Incorrect Solder Short Foreign Material Solder Balls Insufficient Solder Lifted Pads Electrical Material Defect Long Lead Wrong Part Extra Part Reversed Part High Part Damaged Part Excess Glue Insufficient Glue Inverted Part Missing Part Toinbstone Part No Solder Flux On Board Missing Stamp Bent Lead Cold Solder Skewed/Misalignment/Misplacement Mechanical Material Defect Lead Not Protrusion Wrong Software To Be Analyzed Turning Error Poor Assembly Rivet Defects Lead Lift Missing Label Label Non-Conformity