规范内容为江苏格立特电子有限公司财产，未经正式许可不得复印 , 透露或转换成其他形式使用.
THIS SPEC IS THE PROPERTY OF JIANGSUGELITE AND CANNOT BE REPRODUCED, COPIED OR TRANSFORMED TO ANY OTHER FORM WITHOUT
PERMISSION OF JIANGSU GELITE
Document No. PPQ-L-XXXX.2015-XXX Resp. Team Quality Team Report Prsn. XXX
Report Date 2015.XX. XX Approval Prsn.
XXX
Docu Title Pre Product Qualification Report
Exec. Period Mar 05TH, 2015 ~ May05TH, 2015
1. Purpose
The purpose of this document is to Qualify XXX (SOPXX_150mil) in Manufacturing Process and
Inform to XXX so that Process and Product is qualified with Gelite Qualification Spec.
2. Tested Package Information
PKG Type Part No. Wafer Size Chip Size Chip Thickness
SOP_14
150mil IL324 4” 0.99*0.96 350㎛
Mark Code Wafer(Run) # Chip ID MSL
IL324D
IKS LFWW
3. Material(BOM) and Machine Summary
3.1 Material List
Type Model Spec Maker Remark
Saw blade 27HDDC ------ DISCO
Lead frame A194 80-80 LEAD
Ag Epoxy 833C-LW --- Bonotec
Collet RT-030-FT[Rubber] Ø30mil 铭沣
Capillary CE-FB-1351-G36 Normal/Ruby 库力索法 [K/S]
Cu wire FG-A08-20-01 0.8mil NICHE-TECH
Compound EMEG630AY 14mm*4.2g SUMITOMO
Tube SOP 150MIL 腾源
3.2 Machine List
Type Model Serial No Maker Machine No
Tape Mount DM200 苏州斯尔特 WM01
Wafer Saw DFD641 HL1311 DISCO WS02
Die Attach ESEC2008 hs Plus ESEC DA01
Wire Bond Connx Plus KS WB05
Mold FSTM250-7HS FUSHISANJIA MD02
Cure Oven JH-841 吴江精华 PMC02
Laser Mark K511A King Tech MK01
Trim-Form YAMADA SANJA YAMADA TF02
Test SHF3000
MTS737 FLEX 东莞华越
上海宏测 Handler24
Tester 18
规范内容为江苏格立特电子有限公司财产，未经正式许可不得复印 , 透露或转换成其他形式使用.
THIS SPEC IS THE PROPERTY OF JIANGSUGELITE AND CANNOT BE REPRODUCED, COPIED OR TRANSFORMED TO ANY OTHER FORM WITHOUT
PERMISSION OF JIANGSU GELITE 4. PPQ Data & Summary
▣ Tape Mount
Machine Parameter(s)
Items Spec Actual
Chuck Temp 40-70℃ 45℃
The appearance of data &results
Items S/S Criteria Data&Result A/R Remarks Min Max AVG CPK
Visual 1 Wafer 0/1 0/1 A
▣ Wafer Saw
Machine Parameter(s)
Items Spec Actual
Spindle RPM 40000±5000 40000
Feeding Speed Max50 35
DI Water Pressure 2-4 3.5
DI Water Flow 0.5-1.0 0.7
Drying Time Max 100 50
The appearance of data & results
Items S/S Criteria Data & Result A/R Remarks Min Max AVG CPK
Visual 125EA 0/1 No Defect
Kerf width 10EA --- 36.5 46.5 41 --- A
SAWING TOP SAW BOTTOM
▣ Die Attach & Cure Oven
Machine Parameter(s)
Items Spec Actual
Bond weight 0.6-1 0.8
Pick-up Weight 0.6-1 0.6
Cure Temp 175±5 175
Cure Time 1hrs 1hrs
The appearance of data &results
Items S/S Criteria Data & Result A/R Remarks Min Max AVG CPK
Visual 140EA 0/1 No Defect A
Chip 3EA No Damage No Defect A
规范内容为江苏格立特电子有限公司财产，未经正式许可不得复印 , 透露或转换成其他形式使用.
THIS SPEC IS THE PROPERTY OF JIANGSUGELITE AND CANNOT BE REPRODUCED, COPIED OR TRANSFORMED TO ANY OTHER FORM WITHOUT
PERMISSION OF JIANGSU GELITE backside
Epoxy
Coverage 3EA 四面出胶且长度大于75%周长 No Defect A
BLT 5EA 5-25um 8 13 8.8 0.41 A
DST 10EA Min：30g 49 70 58.5 1.56 A
Die Tilt 5EA ＜25．4um 6 10 6.8 3.11 A
75.067.560.052.545.037.530.0LSLLSL30目标*USL*样本均值58.5样本 N10标准差（组内）6.10717标准差（整体）7.21495过程数据Cp*CPL1.56CPU*Cpk1.56Pp*PPL1.32PPU*Ppk1.32Cpm*整体能力潜在（组内）能力PPM < LSL0.00PPM > USL*PPM 合计0.00实测性能PPM < LSL1.53PPM > USL*PPM 合计1.53预期组内性能PPM < LSL39.05PPM > USL*PPM 合计39.05预期整体性能组内整体DST 的过程能力
▣ Wire Bond
W/B Machine Parameters
Items Spec Actual
Pad Lead Pad Lead
Time SEG1:
SEG2:
SEG3:
SEG4: 14±2 SEG1:5
SEG2:5
SEG3:5
SEG4:16 13
Power SEG1:
SEG2:
SEG3:
SEG4: 140±30 SEG1:0
SEG2:15
SEG3:65
SEG4:58 135
规范内容为江苏格立特电子有限公司财产，未经正式许可不得复印 , 透露或转换成其他形式使用.
THIS SPEC IS THE PROPERTY OF JIANGSUGELITE AND CANNOT BE REPRODUCED, COPIED OR TRANSFORMED TO ANY OTHER FORM WITHOUT
PERMISSION OF JIANGSU GELITE Force SEG1:
SEG2:
SEG3:
SEG4: 95±20 SEG1:160
SEG2:30
SEG3:15
SEG4:15 115
Temp 210-230 210-230 220 220
The appearance of data&results
Items
S/S Criteria Data &Results A/R Remarks Min Max AVG CPK
Visual 一条框架 0/1 No Defect A
Ball Placement 一条框架 0/1 100% on pad A
Ball Diameter 14Ball 40-80um 61 67 64 ---- A
Ball Height 14Ball 0/1 10.9 17.8 14.0 ---- A
BST 70EA ＞20g 38.4 58.9 47.8 3.16 A
Loop Height 14 Wires 130-330um 164 183 174.9 2.39 A
BPT 70EA ＞5g 5.1 9.6 8.13 1.43 A
1098765LSLLSL5目标*USL*样本均值8.12714样本 N70标准差（组内）0.728492标准差（整体）0.890354过程数据Cp*CPL1.43CPU*Cpk1.43Pp*PPL1.17PPU*Ppk1.17Cpm*整体能力潜在（组内）能力PPM < LSL0.00PPM > USL*PPM 合计0.00实测性能PPM < LSL8.83PPM > USL*PPM 合计8.83预期组内性能PPM < LSL222.17PPM > USL*PPM 合计222.17预期整体性能组内整体BPT 的过程能力 60544842363024LSLLSL20目标*USL*样本均值47.82样本 N70标准差（组内）2.93324标准差（整体）5.31401过程数据Cp*CPL3.16CPU*Cpk3.16Pp*PPL1.75PPU*Ppk1.75Cpm*整体能力潜在（组内）能力PPM < LSL0.00PPM > USL*PPM 合计0.00实测性能PPM < LSL0.00PPM > USL*PPM 合计0.00预期组内性能PPM < LSL0.08PPM > USL*PPM 合计0.08预期整体性能组内整体BST 的过程能力
▣Molding
Machine Parameters
Items Spec Actual CRATER TEST