Package
Cache Size
FrequencyMax
FX51 939 Pin Lidded OµPGA FX53 939 Pin Lidded OµPGA FX55 939 Pin Lidded OµPGA FX57 939 Pin Lidded OµPGA
1MB 1MB 1MB 1MB
2200 MHz 2400 MHz 2600 MHz 2800 MHz
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MT2 Chassis

MT2
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Noise Test

Test Configuration Reference Mic. Distance Mic. Height Mic. Angle ISO 7779 50cm 120cm 30∘
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噪音測試平台

Test Platform Diagram
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Idle 定義

BACKGUARD Environmental Condition Ambient Relative Humidity Background Mode 22℃ 72% 16.2 dB(A) Idle
940 939 M2
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M2 CPU LIST
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AMD CPU THERMAL SPEC
AMD Athlon 64 FX Processor Model Number Options HyperTransport Frequency Model Num ber Thermal Design Power Thermal Resistance (caseamb)
Mainstream 3
Mainstream 2
PSC FMB1
TDP = 89W Iccmax = 78A VR_TDC = 68A
Mainstream 1 Value 3 Value 2 Value 1
2004 Mainstream / Value FMB
TDP = 84W Prescott Tc = [P x 0.28] + 44.2 Iccmax = 78A VR_TDC = 68A
4
INTEL測試平台

平台測試
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INTEL THERMAL REQUIREMENT 2H’03 1H’04 2H’04 1H’05
LGA775
2004 Universal Performance FMB
TDP = 115W Prescott Tc = [P x 0.25] + 44.0 Iccmax = 119A VR_TDC = 101A
1.MAINBOARD *2 2.HDD *1 3.VGA CARD *1 4.GHOST CD *1

1.AVC FAN 9225 *2 1700RPM 2.AVC FAN 9225 *2 2300RPM 3 AVC INTEL SMITHFIELD 3.0 Ghz 4.AVC Z9M741L001 3600RPM 5.AVC Z9M740P001 3600RPM
串fin
如fin有脫落時要點膠

串fin 熱管串FIN，不用銲接，無環保問題，成本低。
Tower heat pipe for FSC
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扣fin
連續模一次成型

扣fin 用連續模生產一條龍。
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鋁擠&銅擠

擠型品與鋁鑄造、鋁鍛造不同的地方，是它將鋁（合金）加熱至可塑溫 度（400℃~500℃）之後，以擠壓機利用油壓力量將鋁擠錠擠壓通過擠 型模具而變成所需要之型材。形狀依模具不同而有所差異，包括型材、 線材、管材、棒材等等！ 凡是物品各橫斷面完全一致，均可利用擠型方 式製造！
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測試結果

看結果與INTEL要求
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CPU List 1 thermal management
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CPU List 2 thermal management
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CPU List 3 thermal management
2005 Mainstream / Value FMB
TDP = 95W Dual Core Tc = [P x 0.22] + 44 Cedar Mill Tc = tbd Iccmax= 100A VR_TDC = 85A
NWD FMB2 NWD FMB1
• Segmented design envelope will continue into 2006 • Design-in performance FMB for platform leadership and best flexibility in support of performance and mainstream processors
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Test report
Horizontal
B3 C3-3pipe B3 LOW COST Horizontal 42°C 4480 104.2 42.5 65.2 0.217
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Cooler Horizonta Horizontal Horizontal Horizontal Position l 25°C 25°C 42°C 42°C Cooler Speed W Ta Tc THETA ca 3080 108.6 25.6 59.5 0.312 5820 106.9 42.6 65.1 0.216 3200 109.07 25.5 58.1 0.299

MSI
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Socket 939 Retention Module & Back Plate Change To Socket M2
New four stand off Four new hole for new clip
SOCKET M2
Original two stand off
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6300 106.9 42.5 65.7 0.217
系統測試?

BTX12.7L
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系統測試?

各溫度測試
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系統測試?
Chamber 35℃ 40% 85% ZGH703Z DS09238B12HPFAF 4820 Z9M740X001 DS09238B12HPFAF 4824 Shin Etsu G-762 70.78 37.36 46.37 53.9 69.97 53.16 51.3 55.6 52.67 58.18 45.5 46.02 43.99 AVC Confidential 73.18 37.38 45.35 55.93 69.17 50.55 49.66 52.4 50.2 57.31 45.43 46.88 44.11 72.18 36.87 48.87 55.99 69.99 49.73 49.11 52.1 49.35 57.31 44.56 47.03 43.32 22 Z9M740X002 DS09238B12HPFAF 4828
AMD Athlon 64 X2 Dual Core Processor Model Number Options Package Cache Size FrequencyMax
939 Pin Lidded OµPGA 939 Pin Lidded OµPGA 939 Pin Lidded OµPGA 939 Pin Lidded OµPGA 939 Pin Lidded OµPGA 939 Pin Lidded OµPGA
Radeon X1300(VGA)

3/13 OE will send the new cooler for this VGA Card The card on hand
The new cooler for test
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The New Part For Test


結果
RH P4maxpower Model Fan Cooler Speed (RPM) TIM Tcase Chassis Inlet Heat Sink Exhaust North Bridge South Bridge RAM 1 RAM 2 RAM 3 RAM 4 HDD Case PSU Air Inlet PSU Air Outlet Chassis Rear Vent
INTEL 測試平台

CPU
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INTEL 測試平台

TTV
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INTEL ATX 775 測試平台

TTV
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SEVER DEMPSY FOR SOCKET 771 PRELOAD
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Socket 1207
Power(Watt) 120 95 68 55 95 110 110 125
Tcase(degC) 69 72 72 70 68 65 65 63