Min.
Max.
/
U.S.L*1.1
/
15uA
L.S.L*0.7
/
/
U.S.L±2nm
No mechanical damage
* U.S.L: Upper standard level
L.S.L: Lower standard level
Page 7 of 9
◆ Cautions
1、Package When moisture is absorbed into the package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. So the moisture proof package is used to keep moisture to a minimum in the package. 2、Storage
20
0/1
①80℃②100℃③120℃④160℃⑤170
7 IR-Reflow Pb-Free Process ℃⑥235℃⑦270℃⑧255℃，
20
0/1
60cm/min，2 times
(2)Criteria of judging the damage
Item
Forward voltage Reverse current
Luminous intensity
Wave length
Appearance
Symbol VF IR IV
λD/λP /
Test condition IF=Test Current
VR=5V IF=Test Current
IF=Test Current View check
Criteria for judgement
◆ Features:
Compatible with automatic placement equipment Compatible with reflow solder process Low power consumption and wide viewing angle This product doesn’t contain restriction Substance, comply ROHS standard.
PN: XGS-PB3010AMUB-04
For: IF=20mA
Contents 1.Features 2.Applications 3.Package dimensions 4.Absolute maximum rating 5.Electrical optical characteristics 6.BIN range 7.Package label 8.Soldering pad dimensions 9.Soldering conditions 10. Package tape specifications 11.Typical electro-optical characteristics curves 12.Reliability test items and conditions 13.Cautions 14.Note
Customer confirm Approved by Checked by
Issued by
Part No. Emitted Color Chip Material
Amber AlGaInP
XGS-PB3010AMUB-04
Blue
Len's Color Water Clear
InGan
--
--
李忠
Customer Confirmation 客户确认
采购部Pur Dept By 品质部QA Dept By 工程部Eng Dept By
深圳市鑫光硕科技有限公司
SHEN ZHEN XIN GUANG SHUO TECHNOLOGY CO.,LTD
公司地址：广东省深圳市宝安区沙井万丰村前路31号8楼
承认书
SPECIFICATION FOR APPROVAL
客户 Customer：
客户品号 Customer P/N：
鑫光硕品号 Xgs Model：
规格 Specification :
XGS-PB3010AMUB-04 SMD 1204橙蓝双色 20MA
制作 Prepared By：
审核 Checked By：
3℃/sec.
210℃ Pre-heating 120~160℃
3℃/sec.
260℃ Max. 10sec.Max.
60~120sec.
-4℃/sec.
120se.c.Max.
Time
• Reflow soldering should not be done more than two times. • Do not stress its resin while soldering. • After soldering,do not warp the circuit board.
Page 2 of 9
◆ Soldering Pad Dimensions:
◆ Soldering Conditions (Maximum allowable soldering conditions)
Reflow soldering profile <Pb-free solder>
Temperature
20
0/1
Connect with a power IF=20mA
5
Operating Life Test
Ta=Under room temperature
20
0/1
Test time=1000HRS(-24HRS,+72HRS)
6
Thermal Shock
-40±5℃→100±5℃ (15min，15min) 100 Cycles
If the LEDs have exceeded the storage time, baking treatment should be performed more than 24hours at 60±5°C. 3、Soldering Iron Each terminal is to the tip of soldering iron temperature less than 300℃ for 3 seconds within once in less than the soldering iron capacity 25 W.Leave two seconds and more internals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 4、Repairing
Symbol
Test Min Typ. Max. Unit
Condition
Amber 55 IV
Blue 60
130 -135 --
mcd IF =5mA
Amber 1.7
--
2.5
VF
V
IF =5mA
Blue 2.7
--
3.0
Amber --
--
10
IR
uA
VR=5V
Blue --
--
10
Amber 600 605 610
Page 4 of 9
◆ Typical Electro-Optical Characteristics Curves：
Page 5 of 9
◆ Typical Electro-Optical Characteristics Curves：
Page 6 of 9
◆ Reliability
(1) Test Items and Conditions
NO
Test Item
Test Conditions
Ac/ Sample
Re
-40±5℃→25±5℃→100±5℃→25±5℃
1
Temperature Cycle
(30min，5min，30min，5min) 100 Cycles
20
0/1
2
High Temperature Storage
Ta：100±5℃ Test time=1000HRS(-24HRS,+72HRS)
一厂地址：广东省深圳市龙岗区嶂背创业二路18-1号
二厂地址：广东省东莞市石排镇庙边王村沙迳工业区
Tel: 13798585378
QQ:2373888283
Website ：
E-mail:xz@
· Customer:
Technical Data Sheet
◆ Package Tape Specifications: (4000 pcs/Reel)
Feeding,Direction
Dimensions of Reel (Unit:mm)ຫໍສະໝຸດ Feeding Direction
Page 3 of 9
A
4
2
3
1
A
Dimensions of Tape (Unit:mm) Arrangement of Tape(Unit:mm)
-40℃～100℃
℃
IFP condition: pulse width ≤1ms ,duty cycle ≤1/10