1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments.
over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT
VCC Supply voltage range VI Input voltage range(2) VO Voltage range applied to any output in the high-impedance or power-off state(2) VO Voltage range applied to any output in the high or low state(2) (3)
IIK Input clamp current
VI < 0
IOK Output clamp current
VO < 0
IO Continuous output current
Continuous current through VCC or GND
DBV package
–0.5
6.5 V
–0.5
6.5 V
SN74LVC1G14

SCES647A – SEPTEMBER 2005 – REVISED JUNE 2011
SINGLE SCHMITT-TRIGGER INVERTER
Check for Samples: SN74LVC1G14
FEATURES
1
•2 Available in the Texas Instruments NanoStar™ and NanoFree™ Packages
FUNCTION TABLE
INPUT A
OUTPUT Y
H
L
L
H
LOGIC DIAGRAM (POSITIVE LOGIC) (DBV, DCK, DRL, DSF, DRY, and YZP Package)
A2
4Y
LOGIC DIAGRAM (POSITIVE LOGIC) (YZV Package)
–0.5
6.5 V
–0.5 VCC + 0.5
V
–50 mA
–50 mA
±50 mA
±100 mA
206
DCK package
252
θJA Package thermal impedance(4)
DRL package DRY package DSF package
142 234 °C/W 300
YZP package
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
GND 3 4 Y
YZP PACKAGE (BOTTOM VIEW) GND 3 4 Y
A2 DNU 1 5 VCC
DNU − Do not use
YZV PACKAGE (BOTTOM VIEW)
GND 2 3 Y A 1 4 VCC
DSF PACKAGE (TOP VIEW)
NC 1 6 VCC A 2 5 NC
Reel of 3000
SN74LVC1G14YZVR
____ CF
SOT (SOT-23) – DBV
Reel of 3000 Reel of 250
SN74LVC1G14DBVR SN74LVC1G14DBVT
C14_
SOT (SC-70) – DCK
Reel of 3000 SN74LVC1G14DCKR
• Ioff Supports Live Insertion, Partial Power Down Mode, and Back Drive Protection
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101)
CF
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at /sc/package.
(2) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2 has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
DBV PACKAGE (TOP VIEW)
DCK PACKAGE (TOP VIEW)
DRL PACKAGE (TOP VIEW)
NC
1
A
2
5
VCC
NC
1
5
VCC
NC 1
5
GND 3 4 Y
GND
3
4
Y
DRY PACKAGE (TOP VIEW)
NC 1 6 VCC A 2 5 NC
2
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
GND 3 4 Y
NC − No internal connection
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This single Schmitt-trigger inverter is designed for 1.65-V to 5.5-V VCC operation.
• Supports 5-V VCC Operation • Inputs Accept Voltages to 5.5 V
• Max tpd of 4.6 ns at 3.3 V • Low Power Consumption, 10-μA Max ICC • ±24-mA Output Drive at 3.3 V
PACKAGE (1)
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
SN74LVC1G14YZPR
_ _ _CF_
NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZV (Pb-free)
Copyright © 2005–2011, Texas Instruments Incorporated
SN74LVC1G14