– 可装配性能 (Assembly Properties)
• 溢胶(Bleed) • 挥发(Outgassing) • 粘结(Adhesion)
– 可靠性能 (Reliability Properties)
• 空洞(Voids) • 热/电传导(Thermal / Electrical Conductivity) • 离子污染(Ionic Contamination) • 应力(Stress)
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He detector
Why He? •质量最轻的惰性气体,能穿透微 小的细缝 •大气中背景值最低, 只有5ppm •没有毒性,无可燃性,不会爆炸 •分子量小,被检测出的速度快
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TO TO 5 TO 8 TO 18 TO 38 TO 39 TO 41 TO 46 TO 56 Profile Shelled Stamped A Shelled Stamped B Stamped A Stamped A Plateau Dia. 7.6 11.7 4.2 n⁄a 7.5 3.1 4.2 n⁄a Outside Dia. 9.1 13.9 5.4 3.8 9.1 4.1 5.6 5.6 Compatibl e Cap TO 5 TO 8 TO 18 TO 52 TO 38 TO 5 TO 56
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Leak Tester
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Main Material of TO-CAN
金线
银胶
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TO 管帽
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LIV tester
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LIV test parameter
Ith : 阈值电流 Vf: 正向电压 Vop: 工作电压 Pf: 正向光功率 Pop: 工作光功率 Im-pf: 正向光功率下的背光电流 Im-pop:工作光功率下的背光电流 Rs: 电阻 Iop: 工作电流 Ikink: 弯折电流 Pkink: 弯折功率 S.E. : 斜度效率 PD-Sensitivity: 探测器响应度 PD-Id: 探测器暗电流 PD-Vf: 探测器正向电压
高純度（５Ｎ：９９．９９９％）生金上添加特定的不 純物、再经过加工行程調質処理（熱処理： Anneal）、作成具备各种特性的Wire。
寸法的精度要高（用0.1um制御可能） 表面要圆滑、金属要有光泽 表面不能有灰尘、污染 具有拉伸强度、要有一定的弹性 Curl（卷曲性）要小 Ａｕ Wire前端形成的 Ball的形状要有一定的真圆性
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Submount
客户化定制 材质 : Aluminum Nitride Au plating
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Can Welding
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TO-CAN PROCESS
贴片 (DIE ATTACH) 全自动贴片机 贴片工具 打线 (WIRE BOND) 全自动打线机 Plasma 瓷嘴 封帽 (CAN Welding) 封帽机 充填及测漏(Leak Test) 氦气充填机 测漏机 LIV 测试 (LIV Test) LIV tester 老化测试(Burn In ) Burn In tester
在光电子领域中，管帽实现了两大基本功 能。首先，它们对传输和接收应用领域中的光 学元件提供了持久可靠的保护。其次，作为光 学接口，它们还确保了光学信号的顺利传输。 因此，安装在管帽中的窗口或透镜的光学性质 必须达到相当高的要求。
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TO 管座
TO 管座为安装半导体、激光二极管或简单电路等电 子和光学元件提供了机械基础，同时通过引线为封装元件 提供电信号。探测器和激光器等光学元件特别容易受到环 境的破坏。尤其是湿度，可致使半导体元件迅速腐蚀，导 致整个器件出现故障。因此这些元件需要被提供可靠持久 的保护。
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全自动贴片机(FT and Accuratus DA)
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Plasma
工作原理
等离子清洗机产生等离子体的装置是在密封容器 中设置两个电极形成电场，用真空泵实现一定的真空 度，随着气体愈来愈稀薄，分子间距及分子或离子的 自由运动距离也愈来愈长，受电场作用，它们发生碰 撞而形成等离子体，这时会发出辉光，故称为辉光放 电处理。 辉光放电时的气压大小对材料处理效果有很 大，另外影响与放电功率，气体成分及流动速度、材 料类型等因素也有关。 电浆在真空条件下,将产品表面暴露在放电的气体 中,使气体在产品表面反应. 当所使用为非聚合性气体( 如N2,O2,Ar….)时,将使产品表面有被蚀刻其它化学性质 之效果 .
Collet lower down to pick position
Collet lower down to bond position
Die is picked up
Mylar delaminate from die Vacuum to hold substrate Vacuum to hold substrate
Die ready, Vacuum apply
Ejector pin up
Ejector pin back to home
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Typical Die Bonding Sequence
Epoxy dispensed on L/F L/F x Pad x Wafer Die is picked up Die is bonded onto L/F L/F index to bond position
Collet at home position Epoxy dispensed from syringe
Stamped A
Stamped B
TO 18 TO 52
TO 56
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主动元件
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银胶 (Silver epoxy)
– 可操作性能 (Handling Properties)
• 流动性 (Rheology) • 固胶条件 (Cure Condition)
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