Before opening the package: The LEDs should be kept at 5~30°C and 60%RH or less. The LEDs should be used within a year. After opening the package: The LED must be used within 24 hours, else should be kept at 5~30℃ and 30% RH or less. The LEDs should be used within 7days after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again.
Connect with a power IF=15mA
5
Operating Life Test
Ta=Under room temperature
Test time=1000HRS(-24HRS,+72HRS)
-40±5℃→100±5℃
6
Thermal Shock
(15min，15min) 100 Cycles
Criteria for judgement
Min.
Max.
/
U.S.L*1.1
/
15uA
L.S.L*0.7
/
/
U.S.L±2nm
No mechanical damage
* U.S.L: Upper standard level
L.S.L: Lower standard level
Page 6 of 8
Unit:mm Electrodes: Ag Plating
Tolerence±0.1
Page 1 of 8
◆ Absolute Maximum Rating （Ta=25℃）
Parameter
Symbol
Max.
Unit
Power Dissipation
PM
60
Mw
Pulse Forward Current
李忠
Customer Confirmation 客户确认
采购部Pur Dept By 品质部QA Dept By 工程部Eng Dept By
深圳市鑫光硕科技有限公司
SHEN ZHEN XIN GUANG SHUO TECHNOLOGY CO.,LTD
公司地址：广东省深圳市宝安区沙井万丰村前路31号8楼
NO
Test Item
Test Conditions
Ac/ Sample
Re
-40±5℃→25±5℃→100±5℃→25±5℃
1
Temperature Cycle
20
0/1
(30min，5min，30min，5min) 100 Cycles
2
High Temperature Storage
Ta：100±5℃ Test time=1000HRS(-24HRS,+72HRS)
Customer confirm Approved by Checked by
Issued by
Part No. Emitted Color Chip Material
XGS-PB3010AG-02
Green
Len's Color
AlGaInP
--
Water Clear --
◆ Features:
IFP
100
mA
DC Forward Current
IF
25
mA
Reverse Voltage
VR
5
V
Operating Temperature Range
Topr
-40℃～85℃
℃
Storage Temperature Range
Tstg
-40℃～100℃
℃
* IFP condition: pulse width ≤1ms ,duty cycle ≤1/10
Page 2 of 8
◆Soldering Pad Dimensions:
◆ Soldering Conditions (Maximum allowable soldering conditions)
Reflow soldering profile
<Pb-free solder>
Temperature
Test
Symbol Min Typ. Max. Unit Condition
IV
25
--
120 mcd IF =20mA
VF
1.8
--
2.4
V
IF =20mA
IR
--
--
10
uA
VR=5V
λd
565
--
575 nm IF=20mA
Δλ
--
25
--
nm IF=20mA
2θ1/2
--
120
--
Deg. IF =20mA
Notes: 1.Tolerance of Luminous Intensity ±10%
2.Tolerance of Dominant Wavelength ±2nm 3. Tolerance of Forward Voltage ±0.05V 4. Luminous Intensity is measured by XGSLED’s equipment on bare chips
XGS-PB3010AG-02 For:
IF=20mA
Contents 1.Features 2.Applications 3.Package dimensions 4.Absolute maximum rating 5.Electrical optical characteristics 6.BIN range 7.Package label 8.Soldering pad dimensions 9.Soldering conditions 10. Package tape specifications 11.Typical electro-optical characteristics curves 12.Reliability test items and conditions 13.Cautions 14.Note
◆ Electrical Optical Characteristics（Ta=25℃）
Parameter Luminous Intensity Forward Voltage Reverse Current Dominant Wavelength Spectral Line Half Width Viewing Angle
40
30
20
10 0
0 20 40 60 80 100 Ambient Temperature Ta (° C)
Relative Luminosity(%)
200 175 150 125 100 75 50 25
0 0
Forward Current Vs Relative Luminosity
Ta=25℃
3℃/sec.
210℃ Pre-heating 120~160℃
3℃/sec.
260℃ Max. 10sec.Max.
60~120sec.
-4℃/sec.
120se.c.Max.
Time
• Reflow soldering should not be done more than two times. • Do not stress its resin while soldering. • After soldering,do not warp the circuit board.
20
0/1
20
0/1
20
0/1
20
0/1
20
0/1
① 80 ℃② 100 ℃③ 120 ℃④ 160 ℃⑤
7 IR-Reflow Pb-Free Process 170℃⑥235℃⑦270℃⑧255℃，
20
0/1
60cm/min，2 times
(2)Criteria of judging the damage
Compatible with automatic placement equipment Compatible with reflow solder process Low power consumption and wide viewing angle This product doesn’t contain restriction Substance, comply ROHS standard.
◆ Cautions
1、Package When moisture is absorbed into the package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. So the moisture proof package is used to keep moisture to a minimum in the package. 2、Storage