Solderability
IEC60115-1-4.17 JIS-C5201-4.17
245±5℃, 2±0.5sec
High Temperature Exposure JIS-C5201-4.23.2 Low Temperature Storage Substrate Bending Insulation Resistance
Series RLP45
L 11.65±0.25
W 6.85±0.25
C 1.85±0.25
T 1.10 ±0.25 UNIT : mm
深圳捷比信－－高品质精密元件供应商
ｗｗｗ．ｊｅｐｓｕｎ．ｃｏｍ
Document No Issued date page TRLP-450S001A 2015/11/20 2/8
2. Type Designation：
RLP45 Series No. 45→4527
F Tolerance F = ± 1% G = ± 2% J = ± 5%
E Packaging E=Embossed
J Power J = 5W
R010 Resistance
R010=10mΩ
3. Construction and Dimension ：
5
Lead (Pb )-Free Assembly 3℃ / second max. 150℃ 200℃ 60 -150 seconds 217℃ 60-120 seconds 260℃ 10 seconds 6℃/second max. 8mimutes max.
Temperature (tp)2 Ramp-down Rate Time 25℃ to Peak Temperature
深圳捷比信－－高品质精密元件供应商
ｗｗｗ．ｊｅｐｓｕｎ．ｃｏｍ
Document No Issued date page TRLP-450S001A 2015/11/20 1/8
Lead-Free Current Sensing Resistors RLP45 ( Halogen-Free )
1. Scope：
Lead-Free Current Sensing Resistors RLP45 ( Halogen-Free )
6. Recommended Solder Pad Dimension
B
L
A
Cu Trace
Sensing Trace
Unit: mm
Series
Resistance (mΩ)
A
B
L
RLP45
6 ≦ R ≦ 50
8.0
4.0
7.6
Note: *The copper foil minimum thickness of PCB needs 3 oz
深圳捷比信－－高品质精密元件供应商
ｗｗｗ．ｊｅｐｓｕｎ．ｃｏｍ
Document No Issued date page TRLP-450S001A 2015/11/20 5/8
深圳捷比信－－高品质精密元件供应商
ｗｗｗ．ｊｅｐｓｕｎ．ｃｏｍ
Document No Issued date page TRLP-450S001A 2015/11/20 8/8
Lead-Free Current Sensing Resistors RLP45 ( Halogen-Free )
15. Recommend Wave-Solder profile : (solder : Sn96.5 / Ag3 / Cu0.5)
5.0
6 ~ 50 mΩ
-55℃~+170℃
±75ppm/℃
±1% ±2% ±5%
5. Reliability Tests: Reference standard Test Limits
Refer 4.0
Test Items
Condition of Test
+25℃ ~ +125℃
Temperature Coefficient IEC60115-1-4.8 JIS-C5201-4.8 of Resistance Load Life Short Time Overload Moisture no Load Temperature cycle Resistance to Soldering Heat
This specification applied to the products of Lead-Free current sensing resistor of metal strip for Lead-Free RLP45 manufactured by TA-I TECHNOLOGY CO.,LTD.
Lead-Free Current Sensing Resistors RLP45 ( Halogen-Free )
10. Reel Specification
Series RLP45
ψA 178 ±2.0
ψB 60 ±1.0
ψC 13.0±1.0
W 25.0±1.0
T 27.4±1.0
11. Peeling Strength of Top Cover Tape
100
70 C
o
Rated Power in %
80 60 40 20 0
-50
-25
0
25
50
75
100
Ambient Temperature in C
o
125
150 170
5.2 Rated Current & Voltage
The rated Current and Voltage are calculated by the following formula:
深圳捷比信－－高品质精密元件供应商
ｗｗｗ．ｊｅｐｓｕｎ．ｃｏｍ
Document No Issued date page TRLP-450S001A 2015/11/20 3/8
Lead-Free Current Sensing Resistors RLP45 ( Halogen-Free )
5.1Derating Curve
IEC60115-1-4.25.1 JIS-C5201-4.25.1 IEC60115-1-4.13 JIS-C5201-4.13 IEC60115-1- 4.24.2.1a) JIS-C5201- 4.24.2.1a) IEC60115-1-4.19 JIS-C5201-4.19 IEC60115-1-4.18 JIS-C5201-4.18
16. ECN
Engineering Change Notice: The customer will be informed with ECN if there is significant modification on the characteristics and materials described in Approval Sheet.
Lead-Free Current Sensing Resistors RLP45 ( Halogen-Free )
14. Recommend IR – Reflow profile : (solder : Sn96.5 / Ag3 / Cu0.5)
Alloyed Re-flow times : 3 times Remark : To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace . Iron Solder:350±10℃ , 3+1/-0 sec, 1 time Profile Feature Average ramp-up rate (Tsmax to Tp) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax ) (ts) Time maintained above : - Temperature (TL) - Time (TL) Peak Temperature (Tp) Time within 0 ℃ of actual Peak
Test Condition: 0.1 to 0.7 N at a peel-off speed of 300 mm / min.
top cover tape 10 ~15∘ carrier tape
pull 300 mm/min standard: 0.1 ~ 0.7 N
12. Storage Conditions:
Temperature: 5℃~35℃,Humidity:40%~75%
13. Shelf Life:
2 years from manufacturing date.
深圳捷比信－－高品质精密元件供应商
ｗｗｗ．ｊｅｐｓｕｎ．ｃｏｍ
Document No Issued date page TRLP-450S001A 2015/11/20 7/8
I= ������ ÷ ������
I: Rated Current(I) P: Rated Power(W)
V= ������ × ������
V: Rated Voltage(V) R: Resistance Value(Ω)
深圳捷比信－－高品质精密元件供应商
ｗｗｗ．ｊｅｐｓｕｎ．ｃｏｍ
Document No Issued date page TRLP-450S001A 2015/11/20 4/8
1000hours at rated power, 70℃, < ±1% 1.5hours “ON”, 0.5hour “OFF” 5 X rated power for 5s 85℃, 85%RH, 1000hrs -55℃ & +155℃, 300cycle, 15min per extreme condition 260±5℃ for 10±1 sec < ±1% < ±1% < ±1% < ±0.5% At least 95% of surface area of electrode shall be covered with new solder < ±1% <±1% < ±0.5% >100 MΩ