IPC-A-610国际标准中英文对照4.6.2 Heat sink-Contact散热片――接触片arget-Class 1,2,3目标——等级1,2,3· Component and heatsink are infull contact with themounting surface.组件和散热片与安装表面完全接触· Hardware meets specified attachment requirements.部件满足规定的接触要求。
Figure图4-641. Heat sink散热片Acceptable-Class 1,2,3可接受的——等级1,2,3· Component not flush.组件不平齐· Minimum 75% contact withmounting surface.至少有75%与安装表面接触· Hardware meets mountingtorque requirements ifspecified.如果有规定，部件满足安装的转距要求Figure图4-651. Gap2. Heat sink间隙散热片Defect-Class 1,2,3缺点——等级1,2,3· Component is not in contactwith mounting surface.组件没有接触到安装表面· Hardware is loose and can bemoved.部件松弛可以移动。
Figure图4-661. Heat sink2. Gap散热片间隙5.1 Orientation方向5.1.1 Orientation-Horizontal方向——水平Target-Class 1,2,3目标——等级1，2，3•Components are centered betweentheir lands.组件位于焊盘中央•Component markings arediscernible.组件标识清晰可见•Nonpolarized components are oriented so thatmarkings all read the same way (left-to-rightor top-to-bottom).Figure图5-1 无极性组件的方向应使其标识都能按同样方式进行辨识（从左到右或从上到下）Acceptable-Class 1,2,3可接受的——等级1，2，3•Polarized and multileadcomponents are orientedcorrectly.有极性和多引脚的组件应按正确方向安装。
•When hand formed andhand-inserted, polarization symbols are discernible.当手工成型及手插件时，极性符号可以辨识。
•All components are as specified and terminate toFigure图 5-2 correct lands.所有组件都符合规定并连接到正确的焊盘上。
•Nonpolarized components do n ot need to be oriented so that markings all read the same way(left-to right or top to-bottom).无极性的组件不需要按同样的方向，只要标识可按相同方向辨识即可（从左到右或从上到下）.5.1.1 Orientation-Horizontal(cont.)方向——水平（续）Defect-Class 1,2,3缺点——等级1，2，3•Component is not as specified(Wrong part).组件不符合规定（组件错误）•Component not mounted incorrect holes.组件没有安装在正确的孔中。
•Polarized component mounted backwards.有极性组件安装方向相反。
•Multileaded component not oriented correctly.Figure图 5-3 多引脚组件的安装方向不正确。
5.1.2 Orientation-Vertical方向——垂直Target-Class 1,2,3目标——等级 1，2，3•Nonpolarized componentmarkings read from the topdown.无极性组件的标识可以从上至下辨识•Polarized markings arelocated on top.极性标识位于顶部.Figure图 5-4Acceptable-Class 1,2,3可接受的——等级 1，2，3•Polarized part is mounted with a long ground lead.极性组件安装时有长的接地引脚•Polarized marking hidden.极性标识被隐藏起来•Nonpolarized component markings read from bottom to top.无极性组件标识可以从底至上辨识。
Figure图 5-5Defect-Class 1,2,3缺点——等级 1，2，3•Polarized component is mountedbackwards.极性组件安装反向。
Figure图 5-65.2 Mounting安装5.2.1 Mounting-Horizontal-Axial Leaded-Supported Holes安装——水平——轴向引脚——有支撑孔Target-Class 1,2,3目标——等级1，2，3•The entire body length of thecomponent is incontact with the boardsurface.整个组件本体长度与线路板表面完全接触•Components required to be mounted off the board are ,at least 1.5mm[0.059 in]from the board surface; e.g., high heat dissipating.需要离开线路板表面安装的组件至少要离开线路板Figure图 5-7 平面1.5mm（0.059 in），如高散热器件.Figure图 5-85.2.1Mounting-Horizontal-AxialLeaded-Supported Holes(cont.)安装——水平——轴对称引脚——有支撑孔Acceptable-Class 1,2可接受的——等级1，2，3•The maximum space between thecomponent and theboard surface does not violate the requirements forlead protrusion(see 5.2.7)or component height(H).Figure图 5-9 ((H) is auser-determined dimension.)组件与线路板平面之间的最大间距不应违反引脚突出（见5.2.7）或组件高度（H）的要求。
（高度（H）是由使用者决定的尺寸）Process Indicator-Class 3程序指示——等级 3•The farthest distance between the component body and the board(D)is larger than 0.7mm[0.028 in].组件本体与线路板之间的最大的距离（D）超过0.7mm（0.028 in）。
Defect-Class 1,2,3缺点——等级1，2，3•Components required to be mounted above the board surface are lessthan 1.5mm[0.059 in]要求离开线路板表面安装的组件与线路板的距离小于1.5mm（0.059in）.5.2.2 Mounting-Horizontal-AxialLeaded-Unsupported Holes安装——水平——轴向引脚——无支撑的孔Target-Class 1,2,3目标——等级 1.2.3•The entire body length of the component is incontact with the board surface.整个组件本体长度与线路板表面完全接触.•Components required to be mounted off the board areat minimum 1.5mm[0.059 in] from the boardFigure图 5-10 surface ;e.g. ,high heatdissipating.1.No Plating in barrel 需要离开线路板表面安装的组件至少要离开线路板平孔壁上没有电镀面1.5mm（0.059 in），如高散热器件.Components required to be mounted off the board are provided with lead forms at the board surface or other mechanical support to prevent lifting of solder land.需要离开线路板安装的组件在线路板表面利用引脚形状或其它机械支撑来防止焊盘的翘起。
Figure图 5-11 Figure图 5-121.Lead forms引脚形状Defect-Class 1,2,3缺点——等级1，2，3•Components required to be mountedoff the board arenot provided with lead forms atthe board surfaceor other mechanical support to prevent lifting ofsolder land.Figure图 5-13需要离开面板安装的组件在线路板表面未利用引脚的形状或其它机械支撑来防止焊盘翘起•surface Components required tobe mounted above the board areless than 1.5mm[0.059 in].要求离开线路板表面安装的组件与线路板的距离小于1.5mm（0.059in）Figure图 5-145.2.3Mounting-Horizontal-RadialLeaded安装——水平——径向引脚Target-Class 1,2,3目标——等级1，2，3•The component body is in flatcontact withthe board's surface.组件本体与线路板表面平贴接触• Bonding material is present, if required .See4.4.若需要，则可存在粘贴的物质，见4.4Figure图 5-15Acceptable-Class 1,2,3可接受的——等级1，2，3•Component in contact with boardon at least oneside and/or surface.组件与线路板至少有一边和/或面接触。