电子元器件封装图示大全LQFP 100LMETAL QUAD 100LPQFP 100LQFPQuad Flat Package QFPQuad Flat Package TQFP 100L RIMMRIMMFor Direct Rambus SBGASC-70 5LSDIPSIMM30SIMM30PinoutSIMM30Single In-line Memory ModuleSIMM72SIMM72PinoutSIMM72Single In-line Memory ModuleSIMM72Single In-line Memory ModuleSIPSingle Inline PackageSLOT 1For intel Pentium II Pentium III & Celeron CPU SLOT AFor AMD Athlon CPUSNAPTKSNAPTKSNAPZPSO DIMMSmall Outline Dual In-line Memory ModuleSOSmall Outline PackageSOCKET 370 For intel 370 pin PGA Pentium III & Celeron CPU SOCKET 423 For intel 423 pin PGA Pentium 4 CPU SOCKET 462/SOCKET A For PGA AMD Athlon & Duron CPU SOCKET 7For intel Pentium & MMX Pentium CPUSOHSOJ 32LSOJSOP EIAJ TYPE II 14L SOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323 SOT25/SOT353 SOT26/SOT363 SOT343SOT523 SOT89 SOT89 SSOP 16L SSOPSocket 603 FosterLAMINATE TCSP 20L Chip Scale Package TO18TO220TO247TO252TO263/TO268 TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThin Small Outline Package TSSOP or TSOP IIThin Shrink Outline PackageLAMINATE UCSP 32L Chip Scale Package uBGAMicro Ball Grid ArrayuBGAMicro Ball Grid ArrayVL BusVESA Local BusXT Bus8bitZIPZig-Zag Inline PackageGull Wing Leads HSOP28ISAIndustry Standard Architecture ITO220ITO3pJ-STDJ-STDJoint IPC / JEDEC Standards JEPJEPJEDEC PublicationsJESD JESDJEDEC StandardsJLCCLCCLDCCLGALLP 8LaLQFPPCDIPPCI 32bit 5V Periphera l Compone nt Interconn ectPCI 64bit 3.3V Periphera l Compone nt Interconn ectPCMCIAPDIPPGAPlastic Pin GridArrayPLCCPQFPPS/2PS/2 mouseport pinoutPSDIPDIMM 168DIMM DDRDIMM168 Dual In-line Memory Module DIMM168DIMM168PinoutDIMM184 For DDR SDRAM Dual In-line Memory ModuleDIPDual InlinePackageDIP-tab Dual Inline Packagewith Metal HeatsinkEIAEIA JEDEC formulated EIA Standar dsEISA Extende d ISAFBGAFDIPFTO220Flat PackAC'97AC'97v2.2 specification 详细规格AGP 3.3V Accelerated Graphics Port Specification 2.0 详细规格AGP PRO AcceleratedGraphics Port PRO Specification 1.01 详细规格AGP Accelerated Graphics Port Specification 2.0 详细规格AMR Audio/ModemRiserAX078AX14C-Bend LeadCERQUADCeramic Quad FlatPackCLCCCNRCommunication and Networking Riser Specification Revision 1.2CPGACeramic Pin Grid ArrayCeramic CaseLAMINATE CSP 112LChip Scale PackageBGABall Grid Array EBGA 680L LBGA 160L PBGA 217L Plastic BallGrid ArraySBGA 192LTSBGA 680LCLCC CNR Communication and Networking RiserCPGA Ceramic Pin Grid Array DIP Dual Inline PackageDIP-tab Dual Inline Package with Metal HeatsinkFBGAFDIP FTO-220 Flat Pack HSOP-28 ITO-220 ITO-3P JLCC LCC LDCC LGA LQFP PCDIPPGA Plastic Pin Grid ArrayPLCC PQFPPSDIPLQFP 100LMETAL QUAD 100LPQFP 100LQFP Quad Flat PackageSOT143SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353 SOT26/SOT363SOT343SOT523SOT89SOT89Socket 603 FosterLAMINATE TCSP 20L Chip Scale PackageTO252TO263/TO268QFP Quad Flat Package TQFP 100LSBGASC-70 5LSDIPSIP Single Inline PackageSO Small Outline Package SOJ 32LSOJSOP EIAJ TYPE II 14LSOT220SSOP 16LTO247SSOPTO18 TO220TO264 TO3 TO5 TO52 TO71TO72TO78TO8TO92TO93TO99TSOP Thin Small Outline Package TSSOP or TSOP II Thin Shrink Outline PackageuBGA Micro Ball Grid ArrayuBGA Micro Ball Grid Array ZIP Zig-Zag Inline Package BQFP132C-Bend LeadCERQUAD Ceramic Quad Flat PackCeramic CaseLAMINATE CSP 112L Chip Scale PackageGull Wing LeadsPDIPPLCCSNAPTKSNAPTKSNAPZPSOHAGP 3.3VAcceleratedGraphics Port Specification 2.0详细规格AGP PROAcceleratedGraphics Port PRO Specification 1.01 详细规格AGPAcceleratedGraphics Port Specification 2.0详细规格AMRAudio/Modem Riser AX078AX14BGA Ball Grid ArrayBQFP132EBGA 680L 详细规格LBGA 160L 详细规格 PBGA 217L Plastic Ball Grid Array 详细规格SBGA 192L 详细规格 TEPBGA 288LTEPBGA 288L 详细规格 TSBGA 680L 详细规格C-Bend LeadCERQUAD Ceramic Quad Flat Pack CLCCCNR Communication and Networking Riser Specification Revision 1.2 详细规格CPGA Ceramic Pin Grid ArrayCeramic CaseLAMINATE CSP 112L Chip Scale Package 详细规格DIMM 168 详细规格 DIMM DDR 详细规格DIMM168 Dual In-line Memory Module详细规格 DIMM168 DIMM168Pinout详细规格 DIMM184For DDR SDRAM Dual In-line Memory Module 详细规格 DIPDual Inline Package详细规格DIP-tabDual Inline Package with Metal HeatsinkEIA EIAJEDECformulatedEIAStandards EISAExtended ISA 详细规格FBGAFDIPFTO220Flat PackGull Wing LeadsHSOP28ISA Industry Standard ArchitectureITO220ITO3p J-STD J-STD Joint IPC / JEDECStandards JEP JEPJEDECPublications JESD JESDJEDECStandardsJLCCPCDIPPCI 32bit 5V Peripheral Component Interconnect 详细规格PCI 64bit 3.3V Peripheral Component Interconnect 详细规格PCMCIAPDIPPGA Plastic Pin Grid Array 详细规格 PLCC 详细规格 PQFP PS/2PS/2 mouse port pinout PSDIP LQFP 100L 详细规格 METAL QUAD 100L 详细规格 PQFP 100L详细规格QFP Quad Flat PackageQFP Quad Flat Package TQFP 100L详细规格SBGASC-70 5L详细规格SDIPSIMM30 SIMM30Pinout 详细规格SIMM30Single In-line Memory Module SIMM72SIMM72Pinout 详细规格SIMM72Single In-line Memory Module SIMM72Single In-line Memory ModuleSIPSingle Inline PackageSLOT 1For intel Pentium II Pentium III & Celeron CPU SLOT A For AMD Athlon CPUSNAPTKSNAPTKSNAPZPSO DIMMSmall Outline Dual In-line Memory Module SOSmall Outline PackageSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPU SOCKET 423For intel 423 pin PGA Pentium 4 CPU SOCKET 462/SOCKET AFor PGA AMD Athlon & Duron CPU SOCKET 7For intel Pentium & MMX Pentium CPU SOHSOJ 32L详细规格SOJSOP EIAJ TYPE II 14L详细规格SOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353 SOT26/SOT363 SOT343SOT523SOT89SOT89SSOP 16L详细规格SSOPSocket 603 Foster LAMINATE TCSP 20L Chip Scale Package 详细规格 TO18 TO220 TO247TO252 TO263/TO268 TO264 TO3 TO5 TO52 TO71 TO72TO78 TO8 TO92 TO93 TO99 TSOP Thin Small Outline Package TSSOP or TSOP II Thin Shrink Outline PackageLAMINATE UCSP 32L Chip Scale Package 详细规格 uBGA Micro Ball Grid Array uBGA Micro Ball Grid Array VL Bus VESA Local Bus XT Bus 8bit ZIP Zig-Zag Inline Package。