Copyright(c) 2012 All rights reserved by KST CO.,LTD.
KST CO.,LTD
1 A t Gl h & UV M/C 1.Auto Glass Att Attach
1-2 M/C Configuration (Top View)
3. HOUSING VISION Housing location Align Y-axis Moving 2. TRAY FEEDER Feeding Pin way of Ball Screw feeding type 4.PICK-UP HEAD X,Y,Z DIGITAL CONTRL
KST CO.,LTD
2 H i R t ti M/C 2.Housing Rotation
2-3 Specification
■ SYSTEM CONFIGURATION 1. 1 M/C PERFORMANCE - CAPACITY : 1times product quantity Min 5ea ~ Max 10ea (only UPH product (HOUSING) status, working conditions and other matters may vary by) 2 SYSTEM LAY OUT 구성 : MAGAZINE TO MAGAZINE STAND ALONE TYPE 2. 3. UTILITY - POWER : AC220V, 1Φ, 50/60Hz - AIR : 4∼6kg/㎠ - VACUUM : 500mmHg - (USER UTILITY apply) ■ APPLICATION 1. Apply to PACKAGE : CCD MODULE HOUSING - (USER refer to the provided drawing) 2. TRAY SIZE : 150mm(W)* 150mm(L) * 10mm(T) or (USER provide specification standards) 3 MAGAZINE : USER provide application spec (USER 사급품) 3.
6.MAGAZINE UNLOADER 1-Magazine Elevator way 7.WAFER VISION IR Glass Vision Align
KST CO.,LTD
1 A t Gl h & UV M/C 1.Auto Glass Att Attach
1-3 Specification
KST CO.,LTD
CCM M/C SUMMARY
1. Auto Glass Attach & UV M/C (Model No:TIB-420G) 2. Hosing Rotation M/C (Model No:TIR-400R) 3. Inspection & Housing Attach M/C (Model No:TIB-400H) 4. IR Filter Inspection system (Model No: TVI-930) 5. IR Glass Attach M/C (Model No:TIB-400G) 6. CCM Lens (Model No:TLA-400) 7. Post Air Blow System (Model No:TIC-400P) 8. Semi-Auto Housing Attach M/C (Model No:TIB-410SM) 9. Solder System (Model No: TSD-400) 10. Snap Cure System (Model No: TCU-900) 11. Snap Cure System (Model No: TCU-900H) 12. Cure Oven (Model No : HS-3650-2, HS-3650-4, HS-2000-1, HS-2000-2)
PCB Inspection Wire & Chip fore checking PCB Magazine Unloader Cross feed ways 1,200 1,500 Tray Magazine Loader Tray stage 1,100 PCB Feeder PCB Shuttle Distribution of PCB 2 Block
Curing
Shuttle 분배
Housing Bonding
Copyright(c) 2012 All rights reserved by KST CO.,LTD.
KST CO.,LTD
3 I ti & H i Att h M/C 3.Inspection Housing Attach Model No: TIB-400H
Model No: TIB-420G
5.SPOT UV Cured materials 10EA
1.MAGAZINE LOADER 1-Magazine Elevator way 8.WAFER STAGE X Y DIGITAL X,Y (6~8”combination) Copyright(c) 2012 All rights reserved by KST CO.,LTD.
Model No: TIB-420G
Wafer Moving
IR Glass Align Camera Vision
IR Glass Gl Ej Eject t & Pick Up
Magazine Insert Magazine loading type
UV경화 Spot UV
IR Glass Bonding
KST CO.,LTD
2 H i R t ti M/C 2.Housing Rotation
2-2 M/C Configuration (Top View)
3. Pick Up Robot JIG on Housing 5 pick up concu rrent inverted supply function 4. Inverting Tray Jig reversal Ago,the reverse action 180 degree rotation Tra Tray Jig with inverted dev ith in erted de ice
3-1 Process
PCB Loading PCB Inspection Adhesive Dispenser PCB Feeding
Tray(Housing) Moving
Housing Pick Up
Housing Under Vision
PCB Vision Align
Magazine Insert
Copyright(c) 2012 All rights reserved by KST CO.,LTD.
KST CO.,LTD
1 A t Gl h & UV M/C 1.Auto Glass Att Attach
1-1 Process
y( g) Tray(Housing) Loading Magazine loading type Tray Feeding Screw Robot feeding Work Position
KST CO.,LTD
CCM SYSTEM
CCM SYSTEM
We have made the total solution for semiconductor assembly
Introduction
Copyright(c) 2012 All rights reserved by KST CO.,LTD.
Model No: TIR-400R
5. Housing Push D evice
1. Housing g Tray y Feed Storage Magazine from Housing Tray auto supply 7. Tray Magazine Stacker Housing Insert Tray Magazine are automaticall y stored into the device 1,000 2. Housing Pick up Zone Work location for Housing Rotation Pick Up 6. Insert Tray Auto Insert Tray stor age and inversion Ji g supply l function f ti 1,400 Copyright(c) 2012 All rights reserved by KST CO.,LTD.
KST CO.,LTD
2 H i R t ti M/C 2.Housing Rotation
2-1 Process
Tray Magazine Loading Tray 1 sheet Push Loading Tray Gaugeing
Model No: TIR-400R
Housing Pick Up
Housing Push Reject
Tray(Housing) Rotate
Empty Tray Loading
Housing Jig Tray Insert
Tray y Magazine g Insert
6
Copyright(c) 2012 All rights reserved by KST CO.,LTD.
■ SYSTEM CONFIGURATION 1. M/C PERFORMANCE - CYCLE TIME : 2.0sec
Model No: TIB-420G
- UPH : 1,800ea - (only UPH, the products glass status working condition and other matters may vary by) - MONTHLY CAPACITY : 1,800ea(UPH) * 20Hr * 25Day * 0.90(utilization rate) = 810,000ea - BONDING ACCURACY : ±30㎛, θ : ±2 2. BONDING METHOD : ADHESIVE MULTI BONDING 3. UTILITY - POWER : AC220V, 1Φ, 50/60Hz - AIR : 4∼6kg/㎠ - VACUUM : 500mmHg - (USER UTILITY apply) ■ APPLICATION 1. APPLY TO PACKAGE : CCD MODULE HOUSING - (USER refer to the provided drawing) 2. IR GLASS SIZE : 3×3mm - 7×7mm 3. WAFER RING SIZE : 6”~ 8“ apply (USER RING specification standards) 4. COLLET, EJECT PIN : USER selected recommendations or provide specifications 5. MAGAZINE : USER provide application spec Copyright(c) 2012 All rights reserved by KST CO.,LTD.