Adhesion 附着力Annular Ring 孔环AOI（automatic optical inspection）自动光学检测AQL（acceptable quality level）可接受的质量等级B²it(buried bump interconnection technology) 埋入凸块焊点互连技术BBH(buried blind hole) 埋盲孔BGA(ball grid array) 球栅阵列Blister 起泡Board Edges 板边Burr 毛头/毛刺BUM(Build-up multilayer) 积层式多层板BVH（buried/blind via hole）埋/盲导通孔CAD(computer aided design) 计算机辅助设计CAM(computer aided manufacturing) 计算机辅助制造Carbon oil 碳油CEM(composite epoxy material) 环氧树脂复合板材chamfer 倒角Characteristic impedance 特性阻抗CNC（computerized numerical control）计算机化数字控制Conductor Crack 导体破裂Conductor Spacing 导线间距connector 连接器Copper foil 铜箔（皮）Crazing 微裂纹(白斑)Delamination 分层Dewetting 半润湿(缩锡)DFM（design for manufacturing）可制造性设计DIP(dual in-line package) 双列直插式组件Dk（dielectric constant）介电常数DRC(design rule checking) 设计规则检查drawing 图纸ECN(engineering change notice) 工程更改通知ECO(engineering change order) 工程更改指令E glass 电子级玻璃entek OSP处理Epoxy resin 环氧树脂ESD(electrostatic discharge) 静电释放Etched Marking 蚀刻标记Flatness 翘曲度Foreign Inclusion 外来夹杂物Flame resistant 阻燃性FR-2(flame-retardant 2)耐燃酚醛纸基板FR-3(flame-retardant 3) 耐燃环氧纸基板FR-4(flame-retardant 4) 耐燃环氧玻璃布基板FR-5(flame-retardant 5) 耐燃多功能环氧玻璃布基板ground 地面（层）Haloing 晕圈HDI(high density interconnection) 高密度互连技术HASL(hot air solder leveling) 热风焊料整平（整平）IC(integrated circuits) 集成电路Ink Stamped Marking 盖印标记Insulation resistance 绝缘电阻Ion cleanliness 离子清洁度IPC(the institute for interconnecting and packaging of electronic circuits) 印制电路互连与封装协会ISO(International organization for standardization) 国际标准化组织Laminate Voids 压合空洞laser 激光LDI(laser direct imaging) 激光直接成像legend 文字标记、符号Lifted Lands 焊盘浮起logo 标志LPI(liquid photoimageable) 液态感光成像LPISM(liquid photoimageable solder mask) 液态感光阻焊膜marking 标记Measling 白斑Microvoids 微坑mil 密耳（千分之一英寸）MIL-STD(military standard) 美国军用标准Negative Etchback 欠蚀Nicks 缺口Nodules 镀镏Nonwetting 不润湿(拒锡)open 开路OSP(organic solderability preservatives) 表面抗氧化oxides 氧化物pad 焊盘panel 拼板pattern 板面图形PCB(printed circuit board) 印制电路板Pcs(pieces) 件、片、只Peeling 剥落pinhole 针孔Pink Ring 粉红圈Pits 凹坑pitch 中心距Plating Voids 镀层破洞plug 塞Positive Etchback 过蚀power 电源层prepreg 半固化片PTFE(polytetrafluoroethylene) 聚四氟乙烯PTH(plated through-hole) 金属化孔PWB(printed-wiring board) 印制线路板Registration 对准QA(quality assurance) 质量保证QC(quality control) 质量控制QE(quality engineering) 质量工程QFP(quad flat package) 方形扁平组件repair 修理RCC(resin coated copper) 已涂覆树脂的铜箔Reference dimension 参考尺寸registration 对准度resin 树脂rejection 拒收revision 修订版RF(radio frequency) 射频Ripples 纹路rout 外形铣scratch 划伤Screened Marking 纲印标记scoring 刻槽short 短路signal 信号Silk screen 丝网Skip Coverage 漏印slot 开槽SMD(surface mount device) 表面安装器件SMOBC(solder mask over bare copper) 裸铜覆盖阻焊膜SMT(surface mount technology) 表面安装技术smear 毛刺solder 焊锡S/M(solder mask) 绿油solderability 可焊性Soda Strawing (汽水)吸管式浮空SPC（statistical process control）统计过程控制spacing 间距Tape test 胶带实验TCE（thermal coefficient of expansion）热胀系数TDR（time-domain reflectometry）时域反射测试tolerance 公差Tenting 盖孔Texture Condition 显布纹Tg(glass transition temperature) 玻璃软化温度THT(through hole technology) 通孔（插装）技术trace 线路（条）UL(underwriters laboratories) 安全实验所NPTH 非金属化孔UV(ultraviolet) 紫外线辐射v-cut V刻Via hole 导通孔（过线孔）void 空洞warp 板弯Waves 波浪Weave Exposure 露织物wetting 沾锡Wicking 灯芯效应（渗铜）Wrinkles 起皱五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：rectangle pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。