Wire Bond
DB Glue Cure WB QC Visual MD PMC
8
Function
To bond wires on the die and on the package leads, in order to connect die and leads to realize electrically link.
Products Application Overview
Advance
- Powertrain (动力传动） - Safety (安全） - Car Multimedia （汽车） - Lighting （灯塔） - Alarm （报警） - Navigation System （逻辑系统）
4
Home Entertainment & Display (HED)
SOP
DIP
SOP
DIP
SOT
SOT
Unit with Wire bonding
Molding Compound
Machine Type： FUSHI SANJIA ( SKMP250) Machine Characteristic 1. Half-automated 2. High Capacity (Dip and Sot: 12 pcs / per mold; Sop: 8 pcs / per mold ) 3. Easier for in process control
Machine Type： ASM iHAWK Machine Characteristic： 1. Good flexibility: suitable for all dimension Cu and Ag on lead frame and die. 2. Bonding at room temperature. 3. Protect atmosphere not need.
Not included in factory Not included in factory
Visual/ Mechanical 100%
Flow
Flow
Included in factory Included in factory Not included in factory
QC Visual / Mechanical
Individቤተ መጻሕፍቲ ባይዱal Units
12
Testing （only for Dip package)
DB Glue Cure WB QC Visual MD PMC Trim /Form (dip) Test (dip) Marking (dip) Visual/Packi ng (dip) QC visual (dip)
Role of SMC COMPANY
3
Our role on semiconductor manufacturing
Wafer from CRM Our company (Assembly + Testing) Final Products Customer
Assembly
Test
Material (e.g. Frames Resin)
Molded units on the lead frame
10
Post Mold Curing
DB Glue Cure WB QC Visual MD PMC
11
Function
PMC --- To cure the molding compound 8hours under the environment of 175+/-5º C, in order to stabilize cohesion between resin and lead frame and enhance structural strength of molding compound.
Un-tested unit
Machine Type： DES&MFG (CT S8002) PowerTECH (QH-11000) Machine Characteristic： 1. Fully automated 2. HV,LV testing module individually
12
Function
To form and singularize each unit from strip, so that they can be proceed test process individually.
Lead Frame
Machine Type： PROPER (Trim / Form systemDip 4) Machine Characteristic： 1. Fully automated
SOP
DIP SOT
Lead frame
SOP DIP SOT
Machine Type： Sliver glue
CANON (BESTEM-D11) for SOP package HOSON (GS850P-L) for DIP package ASM (AD838) for SOT package
Glue Characteristic： 1. Weight loss under high temperature 2. More strength cohesion after Weight loss. 3. NO DMA after weight loss
Machine Type： ETOMA PMC Machine Characteristic： 1. Use N2 Gas to protect production from oxidation 2. Machine panel showing device for temperature and time control. 3. High Capacity
Die
Sliver glue Lead frame 6
Glue Cure
DB Glue Cure WB QC Visual MD PMC
7
Function
To cure the sliver glue 1hours under the environment of 175+/-5º C, in order to stabilize cohesion between die, glue and frame and enhance structural strength of glue, so that make sure enough force to perform die shearing, and no DMA.
100%
50%
0%
Machine Type： PUHUA PMC (PHT-640) ESPEC (PH201) Machine Characteristic： 1. Use N2 Gas to protect production from oxidation 2. Machine Proving Device for temperature and time control. 3. High Capacity
Frame with Die
Wafer (Dice)
Machine Characteristic： 1. The adhesive have two kinds (Electrically and no electrically conductive) 2. The protect atmosphere in the oven is H2+N2
Box filled lead frame with wires
Machine Type： Stereo Microscope visual inspection under microscope (1 lead frame / per box)
Without defects units
Molding
Silver glue cure
Cu Wire Bond
De-flashing
Post Mold Curing
Molding
QC Visual Gate
Plating
Baking
DIP4
Trim / Form
Testing
Marking
Sot / Sop
Marking
Trim / Form
Visual/ Mechanical 100% QC Visual / Mechanical
Before WB
Capillary
After Wire bonding
Wire (Cu / Ag)
8
QC Visual Gate
DB Glue Cure WB QC Visual MD PMC
9
Function
Visual inspection, wire pull test and shear test to monitor good devices, so that make sure bonding wire perfect.
- High definition DVD - Digital & HD TV - Audio （高清晰DVD，
数字电视，音频设备）
SOP 8
SOT23 - 3/5/6
DIP 4
Industrial & Others
- Welding （焊接） - Industry Robots （工业机器人） - Power supply （电源） - Motor control （马达控制） - 3-Phase Driver （3线电驱动）
Testing
Warehouse
5
Die Bond