Laser Cut
Package Saw
Cleaner
Memory Test
Card Asy
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Card TeΒιβλιοθήκη tPacking for Outgoing
10
半导体设备供应商介绍-前道部分
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11
半导体设备供应商介绍-前道部分
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12
常用术语介绍
1. SOP-Standard Operation Procedure 标准操作手册 2. WI – Working Instruction 作业指导书 3. PM – Preventive Maintenance 预防性维护 4. FMEA- Failure Mode Effect Analysis 失效模式影响分析 5. SPC- Statistical Process Control 统计制程控制 6. DOE- Design Of Experiment 工程试验设计 7. IQC/OQC-Incoming/Outing Quality Control 来料/出货质量检验 8. MTBA/MTBF-Mean Time between assist/Failure 平均无故障工作时间 9. CPK-品质参数 10. UPH-Units Per Hour 每小时产出 11. QC 7 Tools ( Quality Control 品管七工具 ) 12. OCAP ( Out of Control Action Plan 异常改善计划 ) 13. 8D ( 问题解决八大步骤 ) 14. ECN Engineering Change Notice ( 制程变更通知 ) 15. ISO9001， 14001 – 质量管理体系
封裝型式
Shape
Typical Features
Material Lead Pitch No of I/O
Plastic
1.27 mm (50miles) 2 direction
lead
8 ~40
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Plastic
1.0, 0.8, 0.65 mm 4 direction
lead
88~200
Material Lead Pitch No of I/O
Ceramic
1.27 mm (50miles) j-shape bend 4 direction
lead
18~124
Ceramic
0.5 mm
32~200
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9
SMT (Optional)
Taping (Optional)
Die Saw
Shrink Dual In-line
Package
封裝型式
Shape
Typical Features
Material Lead Pitch No of I/O
Plastic
2.54 mm (100miles) 1 direction
lead
16~24
Plastic
1.778 mm (70miles)
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2
半导体制程
IC制造开始
Wafer Cutting (晶圆切断)
Wafer Reduce (晶圆减薄)
Etching (蚀刻)
后段封装开始
Diffusion Ion
Implantation (扩散离子植入)
Grind & Dicing (晶圓研磨及切割)
Die Attach (上片)
20 ~64
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5
Through Hole Mount
SK-DIP
Skinny Dual In-line
Package
PBGA
Pin Grid Array
封裝型式
Shape
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Typical Features
Material Lead Pitch No of I/O
Ceramic Plastic
2.54 mm (100miles)
8 ~64
SIP
Single In-line Package
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Plastic
2.54 mm (100miles) 1 direction
lead
3~25
4
Through Hole Mount
ZIP
Zigzag In-line Package
S-DIP
半导体封装制程与设备材料知识简介
Prepare By：William Guo 2007 . 11 Update
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1
半导体封装制程概述
半导体前段晶圆wafer制程 半导体后段封装测试
封装前段（B/G-MOLD）－封装后段（MARK-PLANT）－测试
封装就是將前製程加工完成後所提供晶圓中之每一顆IC晶粒獨立分離，並外 接信號線至導線架上分离而予以包覆包装测试直至IC成品。
Assembly Main Process
Grinding (Optional)
Detaping (Optional)
Die Bond
Die Cure (Optional)
Wafer Mount
Plasma
UV Cure (Optional)
Wire Bond
Molding
Post Mold Cure Laser mark
20~80
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Ceramic
1.27,1.016, 0.762 mm (50, 40, 30
miles)
20~40
8
Surface Mount
PLCC
Plastic Leaded Chip Carrier
VSQF
Very Small Quad Flatpack
封裝型式
Shape
Typical Features
(切割成型)
(测试)
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Package (包装)
製造完成
3
Through Hole Mount
DIP
Dual In-line Package
封 裝 型 式 (PACKAGE)
Shape
Typical Features
Material Lead Pitch No of I/O
Ceramic Plastic
7
Surface Mount
FPG
Flat Package of Glass
LCC
Leadless Chip
Carrier
封裝型式
Shape
Typical Features
Material Lead Pitch No of I/O
1.27, 0.762 mm (50, 30miles)
Ceramic 2, 4 direction lead
2.54 mm (100miles) half-size pitch in the
width direction
24~32
Ceramic Plastic
2.54 mm (100miles)
6
Surface Mount
SOP Small Outline Package
QFP Quad-Flat
Pack
Oxidization (氧化处理)
Deposition (沉积)
WireBonding (焊线)
Lithography (微影)
Wafer Inspection (晶圆检查) 前段結束
Molding (塑封)
Laser mark (激光印字)
Laser Cut & package saw Testing