DENKI KAGAKU KOGYO .日本电气化学工业有限公司DENKAThe field suitable for Hybrid IC适用与混合集成电路领域Classification of printed circuit board 印刷线路板的分类Flexiuble substrate 柔性基板Ceramic substrate 陶瓷基片Insulated Metal Substrate 绝缘金属基材Substrate with thick film circuit.厚膜陶瓷线路板Substrate with thin circuit.薄膜陶瓷线路板 Substrate Multi-layer 多层陶瓷线路板 Metal Base Substrate ( Al, Cu, Fe) 金属基材(铝,铜,铁)Metal Core Substrate (Al, Cu, Fe)金属芯基材(铝,铜,铁)Metal Base Substrate with Multi-Layer (FR-4)多层环氧树脂金属基材Paper based material (phenol) 纸基板(酚基材)Glass cloth based material (epoxy, polyimide)玻璃基材（环氧树脂，聚酰亚胺）Rigid substrate 刚性基板Organic substrate 有机基板Composite (combination with different materials)复合材料（与不同的材料结合）Thermoplastic resin 热塑性树脂Film material (polyimide, polyester)薄膜材料（聚酰亚胺，聚酯）Comparison of properties with each substrate 每种基材的性能对照*Al base type基本类型Typical structure of IMS 标准层的典型结构Conductor (Cu foil, etc.) 导体（铜箔等）Insulator绝缘层Metal Base（Al, Cu, Fe, etc.)金属基材（铝，铜，铁等）Typical structure of HIC 典型的混合集成电路结构Ni plating 镍层Al wire铝丝Plastic case塑胶外壳Semiconductor半导体Chip resistance贴片电阻Resin树脂Lead terminal引线端子Insulator绝缘层Aluminum board 铝板IMS 标准层Development performance of IMS 标准层的发展方向Improvement of Insulator 绝缘层的改善→Higher thermal conductivity, higher reliability and higher heat resistance.更高的导热系数，高可靠性和高耐热性.R a t e d v o l t a g e (V )额定电压Field of each substrate 每种基材的领域 K-1 一般型性型TH-1高耐热高导型B-1超高导热型Industrial machine 工业机器Air conditioner500空调设备HITT PLATE(IMS)高导热铝基板Alumina substrate 氧化铝层AlN substrate 氮化铝层Audio 音频50100Rated current(A)额定电流Market request 市场需求Cost down, down sizing and Higher thermal conductivity 低成本小型化高导热系数Thermal 2W/mK conductivity 导热系数4W/mK8W/mKT h e r m a l c o n d u c t i v i t y (W /m K ) 导热系数Lineup of HITT PLATE’s insulator 绝缘高导热铝基板的应用范围Heat cycle reliability 长期可靠性T h e r m a l r e s i s t a n c e o C /W 热变电阻Comparison of HITT PLATE 高导热铝基板对照1Alumina substrate氧化铝层50 100 150 200 600 650Thickness of insulator 绝缘层厚度The results of thermal resistance by thermal viewerIMS B-1(8W/mK) type IMS B-1类型热变电阻耐热测试的结果Alumina DBC氧化铝合基板Test sample测试样品基材substrateTO-220Low低High高（2SC2233) .最高温度℃℃Typical properties of super high thermally conductive type典型的超高导热类型性能DENKA HITT PLATE in Automotive 日本电气化学公司高导热铝基板在汽车上的应用DC/DC converter 直流/直流转化器ECU电气转化装置Generator发动机ＨＩＴＴPLATE 高导热铝基板EPS应急电源Suspension controller悬浮控制器Technical trend of EPS应急电池的技术趋势Replace to EPS应急电源的替代Fuel efficient will be better3% compared withhydromechanical power steering与流体动力转向相比较燃烧性提高了3% Rapid diffusion to 1000cc ~ 2000cc car迅速提高了1000cc-2000cc卡路里<Inquiry>查询High thermal conductivityHigh heat resistance高导热系数高耐热性Large current 大电流reliability against solder crac k可靠性防焊裂Improvement to decrease solder cracks of bear chip改善了芯片的焊裂A shape of substrate under heat cycle test 基材热循环测试的模拟Case of cool down在容器中冷却Chip resistor贴片电阻Solder 焊盘Aluminum plate铝板Case of heat up在容器中加热Aluminum plate铝板Solder crack 测量条件等TMA method or DMA method机械方法和动态力学方法高导热高耐热TH-1一般型K-1耐焊裂型EL-1resistivity (Ohm cm)体积电阻率Dielectric constant 介电常数Dielectric loss tangent 介电损耗Thickness of dielectric layer (um)介电层厚度Thermal resistance (℃/W) 热变电阻ａｔ1MHz 在1兆赫兹ａｔ1MHz 在1兆赫兹SEM 扫描式电子显微镜Denka method 便携式PH分析仪X 1016125(Y type)ａｔ25 ℃在25度下X 1015 100(Y type) ｘ1015 110strength(N/cm)剥离强度Normalcondition：Based onJISC6481 正常状态：基于日本工业标准C6481Glass transition point ( C) TMA method or DMA method 165(TMA): Step by step increasing 96 hrs after PCT压力锅煮（121 ℃,2atm）treatment 96小时（121℃,2大气压）情况下Dielectric breakdown voltage（KV）Normal condition正常状态*1voltage method 介质击穿电压KV 逐步增加电压1000hrs after 85℃,85%RH,DC100V treatment 1000个小时85℃,85湿度直流电压100V%*11000hrs after 150℃,DC100V treatment 在150℃，电压100V情况下1000小时后*1*1*1*1*1 Crack at solder after heat-cycle焊盘开裂在焊后加热Liquid-Liquid 液液层分析-40℃(7min.) +125℃（7min.)500 cycles 500个循环，Rate of Grade-C,D(%) 比率和等级1000 cycles 1000个循环，－－63100312125 chip resistor mounted 2125贴片电阻安装All figures in the tables are typical values.所有的表格里是平均值*1 Measured with comb-shaped pattern. 测量都是用梳型模式*2 50hrs after PCT treatment.压力锅煮实验50小时后Rate of Grade-C,D(%) 比率和等级Temperature measurementTO-220 (2SC2233)温度测量Grade-A A等级的没有开裂No crack2125 Tip resisto r 2125小电阻Grade-B B等级芯片和焊盘连接处开裂Crack at connection between chip and solder. Silicone grease硅层Heatsink（Water-cooled）散热器(水冷)Dielectric layer介电层Al plate铝板Eutectic solder共熔焊接Grade-C Grade-DCrack extending from the connection between chip and solderC等级从芯片和焊盘连接处延伸出去开裂.Crack开裂Broken electrical 等级导电破坏Crack开裂Crack 开裂Measurement for thermal conductivity 引1:测量导电率Size of Cu land under Tr. : 10 X 15mm,铜面的尺寸:10×15mmSize of substrate : 30 X 30mm,基材的尺寸:30×30mm Grade of cracks after heat cycle 引2.在热循环之后开裂的等级I n c i d e n c e o f s o l d e r c r a c k (%) 焊裂的发生率Comparison of solder crack property 焊盘开裂的性能比较: -40℃–125℃1000Number of heat cycle 热循环次数Items 项目Maximam Operating Temperture（℃）by UL 在紫外线烘烤下,最大操作温度High heat resistant typeM-2高耐热型(Under developing显影后）1) 155Traditional TypeK-1一般型115High heat resistant type “M-2”高耐热型”M-2”of the dielectric layers 介电层的表单数值+05+04+031)It is a recognition acquisition schedule in June-2005.在2005年六月测试识别进度表+02250 200 150 100Oven Temperture烤箱温度Fig1．Heat resistant test 引1.耐热测试(Dielectric Strength)绝缘强度New substrate has the high MOT(UL specification) and the excellent reliability.新的基材有很高的关键性(UL规格下)和卓越的可靠性High heat resistant type “M-2”高耐热型M-2Table 1. Characteristics of the dielectric layers表一 . 介电层的特性Samples AL base plate: ,Cu foil: 70um,dielectric layer: 150 um铝基板样品:毫米, 铜箔: 70微米, 介电层: 150微米1)It is a recognition acquisition schedule in June-2005在2005年六月测试识别进度表D E N K AHigh heat resistant type “M-2”高耐热型M-2Table 2. Durability test result (typical values)1)Measured with Φ20mm circle pattern. In accordance with JIS C2110.根据日本工业标准C2110用Φ20mm测量.2)In accordance with JIS C6481.依据日本工业标准C6481.D E N K A。