VSQF
Very Small Quad Flatpack
封裝型式
Shape
Typical Features
Material Lead Pitch No of I/O
Ceramic
1.27 mm (50miles) j-shape bend 4 direction
lead
18~124
Ceramic
0.5 mm
半导体设备供应商介绍-前道部分
PROCESS
DIE BOND
CURE OVEN WIRE BONDER
PLASMA CLEAN Mold
VENDOR
HITACHI ESEC ASM C-SUN K&S SKW ASM MARCH TEPLA TOWA ASA
MODEL
DB700 ESEC2007/2008
WireBonding (焊线)
Lithography (微影)
Wafer Inspection (晶圆检查) 前段結束
Molding (塑封)
Laser mark (激光印字)
Laser Cut & package saw Testing
(切割成型)
(测试)
Package (包装)
製造完成
Through Hole Mount
Plastic
2.54 mm (100miles) 1 direction
lead
3~25
Through Hole Mount
ZIP
Zigzag In-line Package
S-DIP
Shrink Dual In-line
Package
封裝型式
Shape
Typical Features
Material Lead Pitch No of I/O
半导体封装制程及其设备介绍
半导体封装制程概述
半导体前段晶圆wafer制程 半导体后段封装测试
封装前段（B/G-MOLD）－封装后段（MARK-PLANT）－测试
封装就是將前製程加工完成後所提供晶圓中之每一顆IC晶粒獨立分離，並外 接信號線至導線架上分离而予以包覆包装测试直至IC成品。
半导体制程
IC制造开始
8 ~40
Plastic
1.0, 0.8, 0.65 mm 4 direction
lead
88~200
Surface Mount
FPG
Flat Package of Glass
LCC
Leadless Chip
Carrier
封裝型式
Shape
Typical Features
Material Lead Pitch No of I/O
1.27, 0.762 mm (50, 30miles)
Ceramic 2, 4 direction lead
20~80
Ceramic
1.27,1.016, 0.762 mm (50, 40, 30
miles)
20~40
Surface Mount
PLCC
Plastic Leaded Chip Carrier
DIP
Dual In-line Package
封 裝 型 式 (PACKAGE)
Shape
Typical Features
Material Lead Pitch No of I/O
Ceramic Plastic
2.54 mm (100miles)
8 ~64
SIP
Single In-line Package
Shape
Typical Features
Material Lead Pitch No of I/O
Ceramic Plastic
2.54 mm (100miles) half-size pitch in the
width direction
24~32
Ceramic Plastic
2.54 mm (100miles)
32~200
SMT (Optional)
Taping (Optional)
Die Saw
Assembly Main Process
Grinding (Optional)
Die Bond
Detaping (Optional)
Die Cure (Optional)
Wafer Mount
Plasma
UV Cure (Optional)
Wire Bond
Molding
Post Moldackage Saw
Cleaner
Memory Test
Card Asy
Card Test
Packing for Outgoing
半导体设备供应商介绍-前道部分
PROCESS
SMT - PRINTER SMT – CHIP MOUNT
Wafer Cutting (晶圆切断)
Wafer Reduce (晶圆减薄)
Etching (蚀刻)
后段封装开始
Diffusion Ion
Implantation (扩散离子植入)
Grind & Dicing (晶圓研磨及切割)
Die Attach (上片)
Oxidization (氧化处理)
Deposition (沉积)
ASM889898 QDM-4S
K&S MAXUM ULTRA UTC-2000 Eagle60 AP1000 TEPLA400
Plastic
2.54 mm (100miles) 1 direction
lead
16~24
Plastic
1.778 mm (70miles)
20 ~64
Through Hole Mount
SK-DIP
Skinny Dual In-line
Package
PBGA
Pin Grid Array
封裝型式
Surface Mount
SOP Small Outline Package
QFP Quad-Flat
Pack
封裝型式
Shape
Typical Features
Material Lead Pitch No of I/O
Plastic
1.27 mm (50miles) 2 direction
lead
TAPING INLINE GRINDER & POLISH
STANDALONE GRINDER DETAPING
WAFER MOUNTER DICING SAW
VENDOR
DEK SIMENS NITTO ACCRETECH DISCO NITTO NITTO DISCO
TSK
MODEL
HOR-2I HS-60 DR3000-III PG300RM 8560 MA3000 MA3000 DFD 6361 A-WD-300T