本科毕业论文写作格式要求（模版） 1. 基本要求 理工科类本科毕业论文不少于7000字（不含图∕表）。摘要部分应有200~300字，关键词4~5个，参考文献5~8篇，其中含2篇以上英文参考文献。 2. 打印要求 论文一律用 A4标准复印纸打印，采用双面打印，分别用塑料封皮夹住，不得自己装订，论文将由学校统一装订。版面页边距上空2.5cm，下空2.5cm，左空2.5cm，右空2.5cm，装订线1cm，装订线位置：左边。页码位于页面底端（页脚），居中对齐，首页显示页码。行距为1.5倍行距，字符间距为标准。 毕业论文章、节的编号一律按阿拉伯数字分级编号。 3.论文装订顺序 毕业论文封面→目录→正文→指导教师评阅意见→评阅教师评阅意见→成绩评定表→设计任务书 5. 摘要写作要求 摘要是论文内容不加注释和评论的简短陈述，应以第三人称陈述。它应具有独立性和自含性，即不阅读论文的全文，就能获得必要的信息。 6. 参考文献要求 文献类型的标识代码：普通图书 M ；会议录 C ；汇编 G ；报纸N ；期刊J；学位论文D；报告R ；标准S ；专利P；数据库DB ；计算机程序 CP ；电子公告 EB 7．写作格式要求 （见后范例） 阜阳职业技术学院

毕 业 论 文（设计）

论文题目 ×××××× 姓 名 ××× 学 号 ×××××× 院 系 建筑工程系 专 业 建筑工程管理 指导教师 ****** 职 称 ******** 中国·阜阳 二o一七 年 六 月 目 录（黑体三号、居中） 1 引言 ············································································································ 1 2 设计思想 ······································································································ 2 3系统的硬件设计······························································································ 3 3.1 模拟量采集模块 ······················································································· 4 3.2 模-数转换模块 ························································································· 7 3.3 串行通信模块 ·························································································· 8 3.4 控制面板模块 ·························································································· 9 3.5 显示模块 ······························································································ 10 3.6 报警模块 ······························································································ 10 3.7 控制模块 ······························································································ 10 3.8 电源模块 ······························································································ 11 3.9 电路图的绘制 ························································································ 12 3.9.1 电路原理图的绘制 ············································································ 12 3.9.2 电路PCB图的绘制 ············································································ 12

4 系统的软件设计 ··························································································· 13 4.1 通信协议设计 ························································································ 13 4.2 单片机程序设计 ····················································································· 14 4.2.1主程序设计 ························································································· 4.2.2 定时中断模块 ·················································································· 15 4.2.3 串口中断模块 ·················································································· 15 4.3 PC机串口程序设计 ·················································································· 16

5单片机程序调试及其遇到的问题 ······································································ 17 6 结束语 ······································································································· 18 参考文献 ······································································································· 18 英文摘要 ······································································································· 19 致谢 ············································································································· 19 附录1 ··········································································································· 19 附录2 ··········································································································· 20 附录3 ··········································································································· 21智能化温度监控系统的研究与设计（黑体三号、居中） 学生：×××，指导教师：×××（宋体小四号、居中） (安徽农业大学 信息与计算机学院 合肥 230036) （宋体小四号、居中） 摘 要（宋体小四号、加粗、顶格）：本文介绍了基于AT89C51单片机的智能化温度监控系统。给出了系统硬件电路的设计，讨论了通信规约、单片机程序和PC机通信程序的研制。本系统为增强其实用性设置了下位操作、PC远程监控及红外遥控三种控制模式，并实现了自动监控及越界报警等功能。（中文用楷体小四号、英文用Times New Roman

小四号、两端对齐） 关键词（宋体小四号、加粗、顶格）：温度传感器，A/D转换器，AT89C51，通信规约（楷

体小四号、两端对齐）（关键词间，用逗号隔开）

1 引言（中文用宋体四号、英文用Times New Roman四号、加粗，顶格、两端对齐，序号后空1格，不

用标点符号） 随着计算机技术、半导体制作技术的不断发展，单片机的运用已经渗透到当今社会的各个方面，其价格也随着半导体集成电路制作技术的不断进步而降低，单片微处理器的使用摆脱了以前的繁杂的外扩系统，提高了应用的可靠性，真正的实现了“嵌入式”的设计和“单片”式微机的应用[1]（引文序号用Times New Roman小

四号，上标）。本文通过一个实际的温度控制系统的设计过程，详细地介绍了基于单片机的温度控制系统的设计方法。（中文用宋体小四号、英文用Times New Roman小四号、段前缩

进2个汉字，1.5倍行距，两端对齐） 图1-1 智能温室 图1-2 庭院温室 （图题：中文用宋体五号、英文用Times New Roman五号、加粗，居图中，序号后空1格，不用标点符号） 3 系统的硬件设计（中文用宋体四号、英文用Times New Roman四号、加粗，顶格、两端对齐，序