Fair
Very Good
Good Excellent
Good
Good Good
Adhesion Excellent Excellent Excellent Good
Good
Flexibility Excellent Good
Cost
Low Moderate
Moisture Fair
Poor
Fair High Good
Aging Copper Roll
Kapton Roll
Liquid Adhesive
m
Part III: (~ 15 minutes)
Introduction to
DuPont Products
DuPont Product Family
• Pyralux
– Pyralux FR – Pyralux LF – Pyralux AP – Pyralux PC
m
Dielectric Substrates
• Substrates 之種類
– Polyimide – Polyester – Fluorocarbon – Aramid Paper – Composite
m
Substrates
• Polyimide:
– Popularized by DuPont under “Kapton” – Also known as PI – First choice of film in most FPC – Infusible and flame retardant – High Tg (約 260C - 280C) – Good dimensional stability
Excellent
Fair Good Best
Excellent Fair
Very
Fair
Good
Good Good
Fair/ Good
Excellent
Very Good
Good
Excellent Excellent
m
軟板基材製造過程
Copper Clad Laminate
Heater 2 Heater 1
220 Moderate
Best
Fair/Good
Fair/Good Good
Excellent 105-180
Low
Chem. Resist. Moisture Absorp. Cost Trade Name
Good Very Low
Low Mylar
Good High High Kapton
Excellent Very Good
Fair Very High
Poor
Good Moderate
Fair
m
Conductors/Foil
• Major types of conductors
– Metals – Metal alloys – conductive inks
• Copper (the most commonly used conductor in FPC)
– Electrolytically deposited copper (ED) – Rolled Annealed copper (RA)
m
Conductors/Foil
• 必備之特性
– Current-carrying capacity – Flexibility – Service temperature – Chemical resistance – Mechanical strength – Cost
m
Adhesive
• 必備之特性
– Adhesion Strength – Flexibility – Chemical Resistance – Thermal Resistance – Moisture Absorption – Electrical Properties – Cost
m
Adhesive
Excellent
Excellent
Fair/Good Good Poor 105 Low
Excellent
Excellent
Good Good Excellent 200-230 Low
Fair
Excellent
Fair Very Good
Fair 150-180
High
Good
Good
Good Very Good Excellent
– A film which provides electrical insulation between conductors.
– A film which provides mechanical strength of the circuit.
m
Dielectric Substrates
• 必備之特性
time (400 to 450 F)
m
Adhesive
• Polyimide:
– Used in adhesiveless ccl and coverlay – Used where dimension stability is critical – Used in high temperature application – High moisture absorption
Very Low Very High
High
Moderate
Teflon/Tedlar Nomex
Fair Low Moderate
m
Adhesive
• Definition
– Material that bonds layers together – Thermosetting – Thermoplastic
軟性電路板之主要基材
• Stiffner (補強材)
Dielectric Substrate
Adhesive
m
軟性電路板之主要基材
• Bondply
Adhesive
Adhesive Dielectric Substrate
Mylar Adhesive Kapton
Adhesive
m
軟性電路板之主要基材
m
Adhesive
Polyester Acrylic Epoxy Polyimide Butyral Phenolic
Temp.Resist. Fair Very Good Good Excellent
Good
Chem.Resit. Good Elec.Prop. Excellent
Good Good
• Sheet Adhesive • PhotoImageable Coverlay (PIC)
– Dry Film – Fine-Line Application
• Camera • Automotive
• Others
m
Dielectric Substrates
• Definition
– A base film on which the printed conductors are laid.
– Most popular acrylic system is Pyralux by DuPont
– Excellent adhesion
m
Adhesive
• Epoxy:
– Widely used adhesive system – Generally lower cost than acrylic – Able to stand wave soldering – Good in high temperature for long period of
– Mechanical Strength – Flexibility – Dimensional Stability – Dielectric Properties – Thermal Properties – Chemical Resistance – Moisture Absorption – Cost
• Teclam
– Teclam FNC – Teclam DNC
m
Pyralux ®
• FR - series (Acrylic Based)
– Copper-Clad Laminates
• Panel Form Packaging. (24” x 36”) • UL Approved. (File# E124294) • Very Good Flexure Endurance • Ex. FR9111, FR9110, FR8510, FR8515
m
Substrates
• Aramid Paper:
– Sold under DuPont trade name “Nomex” – Used in specialized application – Good thermal insulation material
m
Dielectric Substrates
• Adhesive之種類
– Polyester – Acrylic – Epoxy – Polyimide – Butyral Phenolic
m
Adhesive
• Polyester:
– Used where the dielectric is also polyester – Used where no soldering is needed – Typical application:
m
簡報大綱 (continue)
• 杜邦產品
– 壓克力膠系列(Modified WA Acrylic)之基材 – 環亞樹脂膠系列(Modified Epoxy)之基材