PPT文档演模板
杜邦产品介绍(3)
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Dielectric Substrates
•Property
Polyester Polyimide Fluorocarbon Aramid Paper Composite
•Tensile Strength
•Flexibility
•Dim. Stability •Dielectric Str. •Solderibility •C.O.T. (C) •Thermal Exp.
– A film which provides electrical insulation between conductors.
– A film which provides mechanical strength of the circuit.
PPT文档演模板
杜邦产品介绍(3)
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Dielectric Substrates
•Dielectric Substrate
杜邦产品介绍(3)
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軟性電路板之主要基材
– Adhesive-Less C.C.L. .(無膠銅箔基材)
PPT文档演模板
•Conductor •Dielectric Substrate
杜邦产品介绍(3)
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軟性電路板之主要基材
• Coverlay(覆蓋膜)
PPT文档演模板
杜邦产品介绍(3)
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Substrates
• Aramid Paper:
– Sold under DuPont trade name “Nomex” – Used in specialized application – Good thermal insulation material
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簡報大綱 (continue)
• 杜邦產品
– 壓克力膠系列(Modified WA Acrylic)之基材 – 環亞樹脂膠系列(Modified Epoxy)之基材
• 杜邦 料號解說
– Pyralux® – Telcam®
PPT文档演模板
杜邦产品介绍(3)
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軟性電路板之主要基材
• Copper Clad Laminates (銅箔基材)
– Dry Film – Fine-Line Application
• Camera • Automotive
• Others
PPT文档演模板
杜邦产品介绍(3)
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Dielectric Substrates
• Definition
– A base film on which the printed conductors are laid.
• Bondply
•Adhesive
•Adhesive •Dielectric Substrate
•Mylar •Adhesiv e •Kapton
•Adhesiv e
PPT文档演模板
杜邦产品介绍(3)
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軟性電路板之主要基材
• Sheet Adhesive • PhotoImageable Coverlay (PIC)
杜邦产品介绍(3)
PPT文档演模板
2020/11/18
杜邦产品介绍(3)
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簡報大綱
• 軟性電路板基材之介紹 • 基材的主要Composition
– Dielectric Substrates (絕緣體) – Adhesive (膠質) – Conductor (導體)
PPT文档演模板
杜邦产品介绍(3)
PPT文档演模板
杜邦产品介绍(3)
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Substrates
• Polyester:
– Popularized by DuPont under “Mylar” – Also known as PET – Lowest cost dielectric material – Mostly used in low-cost consumer application – Good mechanical properties – Bad thermal properties
Excellent Excellent
Excellent Excellent
Fair/Good Good
Good
Good
Poor Excellent Nhomakorabea105
200-230
Low
Low
Fair
Excellent
Fair Very Good
• Polyimide:
– Popularized by DuPont under “Kapton” – Also known as PI – First choice of film in most FPC – Infusible and flame retardant – High Tg (約 260C - 280C) – Good dimensional stability
•Adhesiv •Dielectric Substrate e
•離型紙
•Adhesiv e
•Kapton
PPT文档演模板
杜邦产品介绍(3)
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軟性電路板之主要基材
• Stiffner (補強材)
•Dielectric Substrate
PPT文档演模板
•Adhesive
杜邦产品介绍(3)
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軟性電路板之主要基材
PPT文档演模板
杜邦产品介绍(3)
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Dielectric Substrates
• Substrates 之種類
– Polyimide – Polyester – Fluorocarbon – Aramid Paper – Composite
PPT文档演模板
杜邦产品介绍(3)
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Substrates
• 必備之特性
– Mechanical Strength – Flexibility – Dimensional Stability – Dielectric Properties – Thermal Properties – Chemical Resistance – Moisture Absorption – Cost
– Single-Sided C.C.L.(單面銅箔基材)
PPT文档演模板
•Conductor •Adhesive •Dielectric Substrate
杜邦产品介绍(3)
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軟性電路板之主要基材
– Double-Sided C.C.L. .(雙面銅箔基材)
PPT文档演模板
•Conductor •Adhesive