工程圖檔資料中常見的英文縮寫匯總¾AOI : Automatic Optical Inspection 自動光學檢測¾SMD : Surface Mount Devices 表面安裝設備¾SMB : Surface Mount Board 表面安裝板¾SMT : Surface Mount Technology 表面安裝技術¾MIL : Military Standard 美國軍用標准¾LPI : Liquid Photo Imageable Solder Mask 液態感光阻焊油¾SMOBC : Solder Mask On Bare Copper 裸銅覆蓋阻焊工藝¾OSP : Organic Solderability Preservative 焊錫性有機保護劑¾PTI : Proof Tracking Index 耐電壓起痕指數¾CTI : Comparative Tracking Index 相對漏電起痕指數¾HASL : Hot Air Solder Leveling 噴錫HAL : Hot Air Leveling 噴錫¾PCB : Printed Circuit Board 印制電路板¾PWB : Printed Wiring Board 印制線路板¾CCL : Copper-clud laminat 覆銅箔層壓板¾FPC： Flexible printed board 柔性线路板简称，又称软板¾CAD : Computer Aided Design 計算機輔助設計¾CAM : Computer Aided Manufacturing 計算機輔助制造¾CAT : Computer Aided Testing 計算機輔助測試¾PTH : Plated Through Hole 鍍通孔¾IC : Integrated Circuit 集成線路¾UL : Under Writers Laboratories 美國保險商實驗室¾CNS : Chinese National Standards 中國國家標准¾BGA : Ball Grid Array 球柵陣列¾BUM : Build-up Multilayer 積層法多層板¾CFR : Code of Federal Regularations 聯邦法規全書¾AQL : Acceptable Quality Level 允收品質水准¾LDI : Laser Direct Imaging 鐳射直接成像¾HDI : High Density Interconnection –-Build-up Multilayer 高密度互連積層多層板1.依照標准(in according with related standards)：IPC : The Institute for International and Packaging Electronic Circuit美國電路互連與安裝學NEMA : National Electronic Manufacturing Association 國家電子制造協會/美國電氣制造協會2.基本材料 ( base material)：natural color 自然色 external copper weight 外層銅厚copper clad覆銅箔prepreg 預浸材料（指半固化膠片）Tg rating 玻璃化溫度laminate 基板cross-section切片cutout 切口Metal core 金屬芯type of board 板類 (single sided 單面 double sided 雙面 multilayer 多層)epoxy glass fiber 環氧玻璃纖維flammability rating/class 防火等級dielectric material 介質材料temperature 溫度Resin Content 膠含量Glass Transition Temperature (由”玻璃态”转化为”橡皮态”简称为TG!)base copper (基銅)3.偏差及公差(deviation & tolerance) :registration 對位(重合度) dimension (長/寬/高)尺寸大小 radius &diameter半徑/直徑hole size/aperture孔徑 width 寬度length 長度 depth深度height 高度thickness 厚度spacing間距axis軸coordinate坐標parameter參數copper foil 銅箔board outline/contour 板輪廓圖 edge to edge 邊到邊heat sink plane 散熱層stack up 疊層 $ 疊放 finish(ed) thickness 完成厚度trace = track = line = pattern = conductor ＝rail = circuit 線路top layer 上層& bottom layer 下層 layer to layer registration 層與層對位inter layer & external layer 內層&外層clearance 空隙、間空、間隔 & gap 間隙guide hole = pilot hole導引孔tangency 切線、相接觸＆diagonal對角線、對頂線signal plane 信號層voltage plane電源層 ground plane 接地層C/S＝component side 元件面 S/S=solder side 焊接面Primary side 主層secondary side 輔層 supporting plane 支撐面Film 底片/菲林master film 主稿片artwork 底稿片master drawing布設總圖4. 工藝（process）:surface finishing = surface treatment = finish 表面處理hard gold 重金Entek / Flux 防氧化Immersion Ag 化银gold plating 鍍金immersion gold 沉金flash gold 閃金tin / lead plating 鍍鉛錫electroless gold (plating)（無電）鍍金nickel /gold plating 鍍鎳金HASL : Hot Air Solder Leveling 噴錫 HAL : Hot Air Leveling 噴錫NPTH : Not Plated Through Hole 非鍍通孔（非電鍍孔）Flat package type平裝型SMOBC : Solder Mask On Bare Copper 裸銅覆阻焊工藝 plug through hole 塞孔Void 空洞slot 開槽 / 槽孔 tented vias掩孔 / 導通孔 annular ring 孔環mounting hole安裝孔 tooling hole 管位孔（定位孔）wet solder mask濕膜dry film /dry solder mask干膜preflux & postflux 預塗助焊劑&後塗助焊劑carbon ink 碳油silkscreen legend 絲印字符 non-conductive 非導電的Permanent 耐久的Solder resist阻焊劑 & solder mask 阻焊油（膜）Flow soldering 流焊Reflow soldering 再流焊 Wave soldering 波焊Dip soldering 浸焊Drag soldering 曳焊Float soldering 浮焊withdrawal lacquer = peelable solder mask 藍膠2. 25mm window around fiducial without solder resistOverall diameter of solder resist free area = 6.0mm5. 標識(marking ):vender’s identification (賣主身份) = manufacture’s identification (制造商名)= company name (公司名稱)date code 生產周期 UL logo (denotation) UL標識trademark 商標type designation 型號標志 revision letter 版本字母dustbin symbol 垃圾箱標志stamp 蓋印、壓印short /open test 短/斷路測試 liable to read易於辯认6．彎曲與扭曲 (bow and twist or twist and warp )：not exceed 不超過7. 外形（profiling）:mechnical outline 外形圖 countersink 鑽孔route bit 鑼鑽頭score 劃痕、刻痕、劃線 score line分割線 slot 開槽 / 槽孔& cutouts 切口panelization detail 拼板圖cosmetic =appearance外觀keepout area 保留區域breakaway rails 沖破導線array size 拼板尺寸punch 沖床drill 鑽孔route 鑼板V-cut 切割、分割8. 清潔度（clealiness）:Finished circuit board shall be free of dirt ，oil ，ionic contaminates or other foreign matter which could affect solderability circuit performance ，lift or appearance 。
譯文：成品電路板應無污塵、油污、微粒污染及可能影響到阻焊性能、線路性能、翹度及外觀的異物。