防静电环氧地坪施工Anti-static Epoxy Self-leveling system 抗静电环氧自流平地面The proposal ：3mm Anti-static Epoxy Self-leveling system方案: 3mm抗静电环氧自流平地面Sikafloor®239EDFAntistatic epoxy self-leveling system抗静电环氧自流平系统Approx. 3 mm coating thickness涂装厚度约 3 mmSikafloor® 239EDF is a seamless, self-smoothing, flooring system based on advanced solvent-free epoxy system and selected graded fillers. The cured floor exhibits excellent electrostatically dissipative behavior. The smooth, impervious surface can be easily maintained in a hygienic condition.Sikafloor® 239EDF 是一种无接缝、自流平环氧系统，它以一种先进的无溶剂环氧树脂为基料，并采用专门级配的填充料。
该地面具有优异的防静电性能，其表面形成光滑的无渗透的地面，易于保持卫生状态。
Performance 性能:☆Electrostatically dissipative (Resistance to ground 106＜R G＜109 Ohm) 防静电性能(106＜R G＜109欧姆)☆High level of aesthetics and easy to clean 高度美观，易清洗☆Comfort and care 舒适，安全☆Smooth and seamless 光滑，无缝Structure Profile 系统结构图:System Description 系统介绍： Step 步骤 Product & Consumption 产品和用量 Application Method施工方法Surface Preparation: 基层处理 Cleaning, grinding and shot blasting 清理，研磨和喷砂处理Primer: 底漆 Sikafloor 161+石英砂 @ 0.3-0.4 kg/m 2 Trowel,roller刮板，滚筒Epoxy Leveling mortar 环氧找平层 Sikafloor 161 @ 0.9 kg/ m 2 +适量石英砂 @ 0.9kg/m 2 Trowel刮板Conductive Copper Tape 导电铜带 Adhibit粘贴Conductive Layer 导电层 Sikafloor 220W @ 0.1 kg/m 2 Roller滚筒Top-coat 面层 Sikafloor 239EDF @ 1.8 kg/m 2 +SikaDur 505 @ 0.6 kg/m 2 Trowel 刮板Material Description 材料说明:导电层Conductive Layer 底漆Primer混凝土Concrete防静电面层Anti-static Top-coat找平层 Level ayerSikafloor® 161 is a 2 component epoxy resin based, solvent free primer.Sikafloor® 161 是一种双组分环氧树脂基无溶剂型底油Sikafloor® 220W is a two part water dispersed, epoxy resin with high electrostatic conductivity是一种双组分水性环氧树脂，具有较高的导电性能。
Sikafloor® 239EDF is a two part, self-smoothing, coloured epoxy resin coating. Decorative and protective dissipative self-smoothing system for concrete or cement screeds with normal up to medium heavy wear.Sikafloor® 239EDF 是双组份的彩色的环氧树脂，作为一种在混凝土表面和水泥地面导静电，装饰和保护的涂层Sikadur® 505Q is a dried fine quartz aggregate, 0.1 -0.3 mm for filling self-leveling floors and as filler in Sikafloor® 156/263/264 as leveling mortar or scrape layer.Sikadur® 505Q是一种干燥细颗粒骨料，0.1 - 0.3 mm ，用于填充自流平地面及用作Sikafloor®161/263/264自流平砂浆或刮磨层的腻子层。
Thinner DS or Thinner C is a solvent for cleaning purpose.Thinner DS or Thinner C 是用于清洁的溶剂Application Method 施工工艺Inspection Substrate Quality 基面质量检查The concrete substrate must be sound and of sufficient compressive strength (minimum 25 N/mm2) with a minimum pull off strength of 1.5 N/mm2.混凝土基面必须密实和有足够的抗压强度（最小25 N/mm2），最小抗拉强度为1.5 N/mm2。
Substrate needs to be dry, moisture content ≤4%. Test method: Sika®-Tramex meter or CM - measurement. A waterproofing layer must be installed under the concrete base，or vapor going up will result in epoxy layer bubbling and delamination. 2 mm Sikafloor 81 EpoCem system need to be applied as a moisture barrier.基层须干燥，含水率≤4%，测试方法：Sika®-Tramex仪或CM测量法。
混凝土基层下须设置防水层，否则存在水汽上升导致环氧层起泡、脱落风险。
建议施工2mm Sikalfoor 81 EpoCem 系统作为防潮层。
The substrate must be clean and free of all contaminants such as dirt, oil, grease, coatingsand surface treatments, etc.基面必须清洁、无任何污染物，如：灰尘、油、油脂、涂层和表面处理等。
Measure Application Conditions 施工条件测量Substrate Temperature: +10℃min. / +30℃max.基面温度：最低+10℃/最高+30℃Ambient Temperature +10℃min. / +30℃max.环境温度：最低+10℃/最高+30℃Relative Air Humidity: 80% R.H. max.相对空气湿度：最高80%相对湿度Dew Point: The substrate and uncured floor must be at least 3℃above dew point to reduce the risk of condensation or blooming on the floor finish.露点：基面和未固化的地面温度必须至少高于露点3℃，以防水汽凝结形成斑点。
Substrate Preparation 基面处理re-clean the floor surface, degrease agent will be used where necessary.清洁地表，必要时使用清洁剂；Carry out surface preparation by using shot blasting machine (dust free self enclosed steel shot blasting unit) and hand tools to remove surface laitance and to provide sound and textured surface.使用自动无尘喷砂设备和手动工具进行表面预处理，去除混凝土表面翻沫及松散结构，并提供涂装所需的必要的粗糙度；Remove all remaining dust and debris by dry brushing and vacuum cleaning.扫除残留的钢丸及灰尘，并真空吸尘；Repair all floor defects such as honey combs, scratches, working joints and so on by using SikaDur® and Sikaflex® range of materials. .使用SikaDur® 与Sikaflex®等系列产品对地面缺陷如蜂窝麻面、划痕、施工缝等进行修补；Mixing of material材料混合:In general, all products must be mechanically mixed using an electrical power stirrer with 300 ～400 rpm, prior to mixing stir part A mechanically. When all of part B has been added to part A, continuously mix for 2 minutes until a uniform mix has been achieved. Depending on the product ad in the filler or C component and mix for another 2 minutes until a uniform mix has been achieved.通常，在机械搅拌A组分之前，所有产品必须用电动搅拌器以300 ～400 转速/分机械搅拌。