3.2 Centering Unit
• High accuracy Wafer Centering • Safe handling for thin wafer • No need conversion
Simple & Convenience
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Wafer hand
Cutter width -Tool free
Auto conversion Ring frame Buffer
Wafer & frame transfer
In/outlet Rail width
Tape width Simple & Convenience
ID Camera position
Simple & Convenience
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1.Feature 1. All process in a single machine 2. Safe handling for thin wafer 3. Stable tape removing device 4. Small Footprint 5. Easy conversion
Peeling bar position
OCR bar code position
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5. Special function (Dynatech Patent)
Chuck cleaning unit
Simple & Convenience
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6. MDS Capability Comparison Chart
No 1 2 3 4 5 6 7 8 9 10 Comparison Items Footprint Tape Changeover Time Chuck Surface Cleaner Tape Width Adjustment Cutter Blade Lifetime Tape Consumption Set Up Time UPEH Conversion Time Remove Bar (Tape rem oval) Chuck Table Remove Tape Air Locker Convenience DYNATECH (Lapmaster) 1830(d) x 2400(w) x 2240(h) mm 10 minutes Built in Automated 20,000 times 8”(per １pc) ― 300mm 12”(per １pc) ― 400mm 1 week 8” : 30pcs 12” : 28pcs Within 15 minutes Special function to prevent wafe r breakage (Patent Pending) Reasonable price（Less than 6 0％ approx.） Available Easy changeover Tape (10 minutes) Available to individual T 2345(d) x 2230(w) x 2100(h) mm 15～20 minutes Not available Manual 10,000 times 8”(per 1pc) ― 320mm 12”(per 1pc) ― 430mm More than 1 week 8” : 20pcs 12” : 18pcs More than 30 minutes Easy wafer breakage D 2050(d) x 3700(w) x 1900(h) mm 30 minutes Not available Manual No Cutting Function 8”(per 1pc) ― 290mm 12”(per 1pc) ― 390mm More than 1 week 8” : 22pcs 12” : 20pcs More than 30 minutes No data
Simple & Convenience
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3.Function of each unit
Wafer Mount
OCR Bar code (Optional item)
Tape remove Robert hand
END
MAGAZINE CHECK
END
Simple & Convenience
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4. Conversion process
Manual conversion
Mount & Detape chuck - Tool free
3.6 OCR Bar code printing System (Option)
• CCD Camera reads wafer ID. • Bar code prints wafer ID • Attach label to frame tape
3.7 Unload Frame Cassette
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4. Conversion Process
RECIPE BUTTON
Auto conversion
MANUAL CONVERSION
RING FRAME PICKER
RING FRAME BUFFER
Unloader
Frame transfer
Simple & Convenience
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3.1 Wafer Transfer Robot hand
• Auto balance function • Robot transfers wafer from CMG
Table of Contents
1. Feature 2. MDS process 3. Function of Each Unit 4. Conversion process 5. Special function (Dynatech patent) 6. MDS Capability Comparison Chart 7. Goal 8. Utility
• After label printing, frame placed on the rail • Pusher slides finished frame into frame cassette • 2 Floors elevator loads dual frame cassettes
Simple & Convenience
11 12 13
High price Not available Narrow space to change Tape Not easy De-Tape Roll Not available to use Stand Alone No data
High price Available No data
3. Wafer Alignment : < 0.05mm 4. No wafer broken rate & Zero Void 5. Precut, Normal and UV tape capability 6. The operation system can be select in-line 7. Air cleaning function to eliminate the particle of chuck table 8. Easy conversion
START
RAIL WIDTHቤተ መጻሕፍቲ ባይዱ
MOUNTER CHUCK
TAPE WIDTH DETAPE CHUCK OCR PRINT POSITION WAFER HAND I.D CAEMRA POSITION CUTTER POSITION
BOND ROLLER POSITION
PEER BAR POSTION
5. Special function (Dynatech Patent)
Tape remove unit
- No need to parameter adjustment depend on wafer thickness - Automatic adjustment depend on wafer condition from CMG (Wafer size & thickness) - Prevent wafer damage & breakage (Spring tension control)
- Clean the chuck surface before wafer loading - Prevent wafer damage & breakage
Simple & Convenience
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Simple & Convenience
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3.4 Wafer Mount
• Attach dicing tape to wafer after air blower and suction cleaning • Round cutting • Turn over(180˚)mounted frame after over(180˚ mounting