16
ASTM B32
QQ-S-571ANSI/J-STD-006JIS-Z-3284
SOLDER ALLOYS AND AVAILABLE FORMS
(TIN-LEAD)°F °C WIRE BAR SOLDER PASTE SOLDERFORM ®Sn63Pb37361183X X X X
Most common, tin-lead eutectic used in PCB assembly applications.
Sn60Pb40361~374183~190X X X
Used in single sided board soldering and solder dipping operations.
Sn50Pb50361~420183~214X X X
Intended use for bit soldering and sweat soldering iron, steel, and copper.
Sn40Pb60361~460183~238X X X
Higher temperature applications, common in automobile radiator soldering.
Sn30Pb70361~496183~258X X X
Higher temperature applications, common in automobile radiator soldering.
No. 123366~503186~262X X
Low drossing alloy used in high temperature wire tinning operations.
Sn20Pb80361~536183~280X X X
Not commonly used, solder for automotive body or radiator work.
Sn10Pb90514~576268~302X X X
Alloy of choice for solder spheres and columns used in ceramic BGA/CGA fabrication.
Sn05Pb95574~597301~314X
High temperature alloy used infrequently in specialty applications.
(LEAD-FREE)
Sn96.5Ag3.5430221X X X X
High temperature, eutectic alloy provides high joint strength.
Sn96Ag04430~444221~229X X X
This alloy is used in applications where high joint strength is required.
Sn95Ag05430~473221~245X X X
This alloy is used in applications where high joint strength is required.
100%Sn 450232X X X
Sometimes referred to as Sn99, is used for making tin additions to solder pots.
Sn95Sb05450~464232~240X X X X
For applications where connections see peak temperatures near 204 °C (400 °F).
SAF-A-LLOY 426~454219~235X X X
Special alloy developed for general use where lead free solder is mandated.
Sn96.5Ag3.0Cu0.5424~430218~221X X X X
(#5042)Special alloy developed for general use. Most common lead free alloy.
Sn99.3Cu0.7 441227X X X (#5020)High temperature eutectic alloy provides high reliable joint.
Sn94.8Ag1.2Cu4423~662217~350X
(#5046)Used in high temperature applications, prevents copper leaching.
Sn93.5Ag0.5Cu6423~734217~390X
(#5140)Used in high temperature applications, prevents copper leaching.
Sn89Zn8Bi3376~388191~198X
(#6020)Used in applications where middle temperature soldering is required.
Sn*Ag3Cu0.5Ge*424~430218~221X X (SS#5042)For good solderability and less oxides. *Please call Kester Customer Service Team for specific alloy percentage.
(OTHER ALLOYS)
Sn62Pb36Ag02354~372179~189X X X X
Used on silver coated ceramics and PdAg substrates, prevents silver leaching.
Sn60Pb36Ag04354~475179~246X X X
Used on silver coated ceramics and PdAg substrates, prevents silver leaching.
Sn10Pb88Ag02514~570268~299X X X X
Used in products that operate in high ambient temperature environments.
Sn05Pb93.5Ag1.5565~574296~301X X
Used in products that operate in high ambient temperature environments.
Sn05Pb92.5Ag2.5536280X X X
The highest temperature, eutectic alloy available from Kester.
Sn43Pb43Bi14 291~325144~163X X X X
Use in low temperature applications.
Sn46Pb46Bi8325~352163~178X X X (#2072)Bismuth contained solder, used in low temperature applications.
Sn57Pb40Bi3 347~358175~181X X X (#2090)Bismuth contained solder, used in low temperature applications.
Alloy 46352~365178~185X X X
Provides high strength to solder joints.
Shinsolder 361~363183~184X X
This alloy provides good solderability and less oxide.。