Features :*Low power consumption *Small efficiency.V ersatile mounting on p.c board Unit :mmdimensions are in millimeters (inches).Tolerance is ±0.25mm (.010”)unless otherwise Specifications are subject to change without2(+)G 3(+)R 1(+)B 5(-)4(-)6(-)5(-)4(-)6(-)2(+)G3(+)R1(+)BAbsolute Maximum Ratings at Ta=25℃Parameter Rating UnitPower Dissipation(Pd)70mW Peak Forward Current(1/10Duty Cycle0.1mspulse Width100mAForward Current(IF)20mAReverse V oltage(VR)5V Operating Temperature Range-20℃~+80℃Storage Temperature Range-30℃~+100℃Lead Soldering Temperature210℃for5SecondsSelection Guide`Parameter Min Tvo Max Unit Test ConditionLuminous Intensity(IV)Red750----Mcd If=20mA Green1600——Mcd If=20mA Blue350450Mcd If=20mAThe wavelengthRed620----630nm If=20mA Green517——530nm If=20mA Blue460——475nm If=20mAForward V oltage(VF)Red 1.8---- 2.4V If=20mA Green 3.0---- 3.4V If=20mA Blue 3.0 3.4V If=20mAReverse Current(IR)----5µA Vr=5V Selection Guide：Lens color ChipWater clearMaterial Emittedcolorλp(nm) InGaN/GaNRed620Green525Blue472１９００900Typical Electrical/Optical Characteristics Curves (R):：Typical Electrical/Optical Characteristics Curves (G):LabeP/N:The product model IV:Luminous intensity rank VF:Forward voltage rank TC:Color temperature Q`T:numberQC:Production orderMoisture Resistant PackagingNote:unless mentioned,tolerance of +/-0.1mm,unit:LableAluminum moisture-proof bagDesiccantSMDThe produc ts take note1；Graph one ：Hands material taking ：1.Hand have sweat ，Sweat on silicon surface existing optical pollution ，Influence luminous 。
2.Filling glue for silica gel ，Silica gel is relatively soft ，Hand hard squeeze will cause 、breakline Crushed wafbreak Cause death light products2；Figure 2Tweezers surface material taking ：1.Product packaging glue for silica gel ，Silica gel is relatively soft ，Use tweezersextrusionCan lead to break 、Broken wafer causing death light products 。
2.Tweezers will scratch product surface,light Angle effect 。
3；FIG.3SMT material taking:when the suction nozzle diameter less than products can lead to suction nozzle stamping silica gel ，Can cause gold thread breakage and chip extrusion,cause products die lamp and so on。
4；Figure 4:Blanking:product fell on the ground,can lead to foot a deformation,can cause welding plate position is differ 。
5；Figure 5：Welding plate after put ：1.Welding plate after ，Directly after the welding of plate overlap ，Can damage the product surface ，Will affect light Angle very scratch the surface2.Welding plate after ，Welding plate and product overlap there will be asqueeze ，Extrusion can cause wafer and gold thread damage and fracture can lead to produce light。
SM D；Product dehumidification and baking1；The experimental result：1；After test,found that the SMD series accord with IPC/JEDECJ-STD-020-c plasticintegrated circuit(IC)SMD wet/return sensitivity classification criteria。
2.Reflow soldering SMD instructions before：If the open seal moisture bag after packing，But in before welding，SMD exposure to the damp environment，In the welding process，Meet high temperature SMDDamage may occur,such as dead lamp。
.3Stored instructions：Stored in the temperature less than30℃,relative humidity less than30%of the environment in the reflow soldering SMD don't need before baking dehumidification。
4Baking conditions required to meet：There is no need to all SMD dehumidification for baking,only the following list is not stored good SMD didn't have toFor baking dehumidification.From the original has been out of the vacuum packing LED。
Has not yet been reflow soldering SMD(after reflow soldering,there is no need to bake dehumidification)。
5Baking method suggested as follows：a.From already open vacuum packing out of the SMD or SMD reel。
.SMD can in its original reel on baking1；.The SMD or SMD reel in the ℃baking 3-5hours 。
2；.Please note that don't above sixty ℃temperature baking LED reelrighterrorE SD；protection1；Electrostatic generation：Friction:in daily life,any two different material object contact after the separation,can produceStatic,and the static electricity of the most common method,is triboelectrification.The insulation material,the better，The more easily triboelectrification.In addition,any two different material object contact after the separation,can also produce electrostatic。
Induction:in view of the conductive material is concerned,because the surface of the electronic can free flow,such as the electric field in the gay repellent,opposites attract,are negative ions can transfer,in its surface can produce charge。