Thermal grease for Infineon modulesWhat should be the behavior and how a grease has to look likeBaginskiIFAG AIM PMD ID AEInfineon modules with baseplate: Roughness of baseplateR Zmax. = 16 µm;R Ztyp. = 4 – 6 µmInfineon modules without baseplate: Roughness of ceramicR Zmax.= 9 µm; R Ztyp. = 3 – 4 µmHeatsink: Specification of roughness regarding Application Note Modules with and without baseplate: R Zmax.= 10 µmThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beExample of roughness of baseplate and heatsinkThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beThermal conductivity:Copper: λ ≈ 390 W / mKAluminium: λ ≈ 237 W / mKThermal compound: λ ≈ 1 W / mKCopper=> Thermal barrierTIMAluminiumThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beR th CH metall << R th CH thermal grease mK/W << 1 mK/W << R th CH air << 42 mK/W=> Metal to Metal contact essential=> Thermal grease that fills only the gapes is preferedThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beThermal grease consists of different componentsOily partsOnly needed to adjust the viscosity of the greaseThermal conducting partsNecessary to conduct baseplate and heatsink togetherThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beThermal interface material: Example for better understandingGrain size: Up to 70 µmThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beExample: Thermal grease with 40 µm size in application Temperaturedrop390 W/mKSmall temp. dropBaseplateNo chance to move Oilypart1 W/mKBig temp. drop Heat conductingpart237 W/mKSmalltemp. dropHeatsinkThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beExample of grains of 40 µm sizeGrease workslike distanceBaseplatespacersHeatsink=> R thCH = badThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beExample: Thermal grease with 5 µm size in applicationTemperaturedropBaseplateHeatsinkThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beExample of grains of 5 µm sizeHole to fix module with the heatsinkBaseplateHeatsinkMetal to metal contact possible => R thCH = goodThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beViscosity of thermal grease: High viscosity (hard)Baseplate Dots ofgreaseHeatsinkViscosity of thermal grease: Low viscosity (fluid)BaseplateDots of greaseGrease comes outBaseplateThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beRoughness of heatsinkR Ztyp. = 6 µmR Zmax. = 1 µmHeatsinkPermanent distanceThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beRoughness of heatsinkCrossover possibleThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beConsiderations of thermal foilFoil works like distance keeperPermanent air-> bad RthThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beBefore first heat up (no phase change)F=3NmF=3NmFoil workslike distance keeperThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beAfter heating up(phase change)Foil workslike distancespacersThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beConclusion of considerationsThe grease has to fill only the roughness of the baseplate andthe roughness of the heatsinkThis do not prevent metal to metal contact where possibleThe grease has to be fluid enough to spread and to flow out This guarantees small thickness of grease between baseplateand heatsinkThis guarantees a good thermal contactThe roughness of the heatsink should be under considerationsThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to be。