• • • •
Mask Substrate and Photoresis (negative photoresist in the example) UV light Developer
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Reference: Notsu H, et al. Journal of Materials Chemistry, 2005, 15(15): 1523-1527.
Two Main Clues

Modify a rough surface by materials with low surface free energy Create a rough structure on a hydrophobic surface(CA>90°)
Template method of printing; Vapor induced phase separation (VIPS)； microwave plasma-enhanced chemical vapor deposition(MWPE-CVD); anodic oxidization; ……
C. Spin-coating Process
• The LPMA64 resin was spin-coated onto the duplicated PDMS mold at 3000 rpm for 30s.
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Ultraviolet Lithography Technology
3.Print: 4.Detaching: • pressure =5 bar • Remove PDMS • room temperature • Keep LPMA64 • UV light • Vacuum • 20 min
1.Pretreatment
ABOVE dried in air dipped in a activation solution
（350 ml/L HF (40% V/V)）
washed with 6-10min deionized water 15 ℃ washed with deionized water
A. Prepare Mold material
I. PDMS：nano-patterned polydimethylsiloxane
（聚二甲基硅氧烷）
Reason：good conformal contact with the substrate, low surface energy, and high permeability for many solvents.
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Reference: Lin Feng, et al. Advanced Material, 2002, 14: 1857-1860.
A New Classification of Fabrication Methods
A new classification according to our investigation.
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Ultraviolet Lithography Technology
B. Prepare pattern material
I. LPMA64(聚倍半硅氧烷) II. Method • A mixture of 3% LPMA64, 1.5% Irgacure184, and 95.5% Xylene solvent was sonificated for 20 min • Purpose: To improve the homogeneity of the resin.
Super-hydrophobic Surface:
Reporter: Dong
Background, Methods and Applications
Xu
Partnerships: R.X. Deng, Q. Lin, W.J. Lin, W.L. Liu, J. Shang, R.G. Su, Q.Y. Sun, J.J. Wang, S.J. Xiao, D. Xu, Y.G. Xu, J. Zou. 2015.12
Content
2
Content
3
What’s Super-hydrophobic Surface?
Super-hydrophobic phenomena : It’s first observed in the nature
Self-cleaning
Plants: lotus, candock, rose, silver ragwort and so on never get dirty.
85 ℃ 60 min
degreased in a special solution, pH≈ 5.5~6.5
15g/L NiSO4· 6H2O, 20g/LC6H8O7· H2O, 25g/LNaH2PO2· H2O, 40mL/L NH3· H2O, 18ml/L HF (40% V/V), 10g/L NH4NF2, 0.5mg/Lthiourea (CN2H4S)
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5.Washing: • CF4 and O2 plasma • 150 W • 1 min 40 s
Ultraviolet Lithography Technology
6. Annealing: • 110℃，20 min 7.Deposition: • 20 nm SiO2 layer (PECVD, 50℃) • a self-assembled monolayer of trichlorosilane（三氯甲硅烷）
ultrasonically degreased in an alkaline solution
（45 g/L NaOH 10 g/L Na3PO4· 12H2O）
washed with 30-40s deionized water 15 ℃ NEXT
immersed in an acid solution
Chemical growth VIPS; MWPE-CVD; electrochemistry；
……
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Combination of both Laser ablation and electrodeposition; ……
Ultraviolet Lithography Technology
Schematic diagram of ULT
Preparation process Pretreatment
Electrodeposition
Modification
Reference: Zhuang et al Adv. Mater. 2014, 26, 3950–3955 .
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Electrochemical Method
1.Pretreatment →must be pre-treated before electrodeposition of Ni
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Ultraviolet Lithography Technology
Some important results:
Advantages
Simplicity Large areas
High throughput
High fidelity of transferred patterns
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Electrochemical Method
（125 g/L CrO3 100 mL/L HNO3）
65 ℃ 10 min
Rinsed with deionized water
Reference: Yan Liu ,et al. Electrochimica Acta ,2014,125,395–403..
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Electrochemical Method
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Electrochemical Method
Formation Machanisim
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Electrochemical Method
3. Modification with stearic acid
• polished with SiC paper • grit down to 2000 grit AZ91D • ultrasonically degreased 10 min in acetone • dried in air
AZ91D：with high chemical and electrochemical activity
dried in air END
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Electrochemical Method
2.Electrodeposition of Ni
• Bath composition: 1.0 mol/L NiCl2· 6H2O 0.5 mol/L H3BO3 • Temperature: 55℃ • pH: 4.5-5.0 • The current densities : 15 mA/cm2.
II. Method： • Burdening: 1:10 mixture of Sylgard(硅酮树脂) 184A and Sylgard 184B onto the Si master mold. • The mold was maintained under vacuum conditions at room temperature for 30 min. • After the degassing process, the mold was cured at 80℃ for 2h and finally detached from the Si master mold.
What’s Super-hydrophobic Surface?
Definition: The contact angle between the surface and the water droplet is bigger than 150°.