常见封装形式简介DIP=Dual Inline Package=双列直插封装HDIP=Dual Inline Package with Heat Sink=带散热片的双列直插封装SDIP=Shrink Dual Inline Package=紧缩型双列直插封装SIP=Single Inline Package=单列直插封装HSIP=Single Inline Package with Heat Sink=带散热片的单列直插封装SOP=Small Outline Package=小外形封装HSOP=Small Outline Package with Heat Sink=带散热片的小外形封装eSOP=Small Outline Package with exposed thermal pad=载体外露于塑封体的小外形封装SSOP=Shrink Small Outline Package=紧缩型小外形封装TSSOP=Thin Shrink Small Outline Package=薄体紧缩型小外形封装TQPF=Thin Profile Quad Flat Package=薄型四边引脚扁平封装PQFP=Plastic Quad Flat Package=方形扁平封装LQPF=Low Profile Quad Package=薄型方形扁平封装eLQPF=Low Profile Quad Flat Package with exposed thermal pad=载体外露于塑封体的薄型方形扁平封装DFN=Dual Flat Non-leaded Package=双面无引脚扁平封装QFN=Quad Flat Non-leaded Package=双面无引脚扁平封装TO=Transistor package=晶体管封装SOT=Small Outline of Transistor=小外形晶体管BGA=Ball Grid Array=球栅阵列封装BQFP=Quad Flat Package With Bumper=带缓冲垫的四边引脚扁平封装CAD=Computer Aided Design=计算机辅助设计CBGA=Ceramic Ball Grid Array=陶瓷焊球阵列CCGA=Ceramic Column Grid Array=陶瓷焊柱阵列CSP=Chip Size Package=芯片尺寸封装DFP=Dual Flat Package=双侧引脚扁平封装DSO=Dual Small Outline=双侧引脚小外形封装3D=Three-Dimensional=三维2D=Two-Dimensional=二维FCB=Flip Chip Bonding=倒装焊IC=Integrated Circuit=集成电路I/O=Input/Output=输入/输出LSI=Large Scale Integrated Circuit=大规模集成电路MBGA=Metal BGA=金属基板BGAMCM=Multichip Module=多芯片组件MCP=Multichip Package=多芯片封装MEMS=Microelectro Mechanical System=微电子机械系统MFP=Mini Flat Package=微型扁平封装MSI=Medium Scale Integration=中规模集成电路OLB=Outer Lead Bonding=外引脚焊接PBGA=Plastic BGA=塑封BGAPC=Personal Computer=个人计算机PGA=Pin Grid Array=针栅阵列SIP=System In a Package=系统级封装SOIC=Small Outline Integrated Circuit=小外形封装集成电路SOJ=Small Outline J-Lead Package=小外形J形引脚封装SOP=Small Outline Package=小外形封装SOP=System On a Package=系统级封装WB=Wire Bonding=引线健合WLP=Wafer Level Package=晶圆片级封装常用文件、表单、报表中英文名称清除通知单Purge notice工程变更申请ECR(Engineering Change Request)持续改善计划CIP(continuous improvement plan)戴尔专案Dell Projec t收据Receipt数据表Data sheet核对表Check list文件清单Documentation checklist设备清单Equipment checklist调查表，问卷Questionnaire报名表Entry form追踪记录表Tracking log日报表Daily report周报表Weekly report月报表Monthly report年报表Yearly report年度报表Annual report财务报表Financial report品质报表Quality report生产报表Production report不良分析报表FAR(Failure analysis report)首件检查报告First article inspection report 初步报告（或预备报告）Preliminary report一份更新报告An undated report一份总结报告A final report纠正与改善措施报告(异常报告单)CAR(Corrective Action Report)出货检验报告Outgoing Inspection Report符合性报告（材质一致性证明）COC(Certificate of Compliance)稽核报告Audit report品质稽核报告Quality audit report制程稽核报告Process audit report5S稽核报告5S audit report客户稽核报告Customer audit report供应商稽核报告Supplier audit report年度稽核报告Annual audit report内部稽核报告Internal audit report外部稽核报告External audit reportSPC报表(统计制程管制)Statistical process control工序能力指数(Cpk)Process capability index（规格)上限Upper limit（规格）下限Lower limit规格上限Upper Specification Limit(USL)规格下限Lower Specification Limit(LSL)上控制限（或管制上限）Upper Control Limit(UCL)下控制限（或管制下限）Lower Control Limit(LCL)最大值Maximum value平均值Average value最小值Minimum value临界值Threshold value/critical value MRB单(生产异常通知报告)Material Review Board Report工艺流程图Process Flow Diagram物料清单（产品结构表/用料结构表）BOM(Bill of Materials)合格供应商名录AVL(Approved Vendor List)异常报告单CAR工程规范报告通知单（工程变更通知）ECNTECN自主点检表Self Check List随件单（流程卡）Traveling Card(Run Card)压焊图Bonding diagram晶圆管制卡Wafer inspection card晶圆进料品质异常反馈单Feedback Report for Wafer Incoming Quality Problems订购单PO(Purchase Order)出货通知单Advanced Ship Notice送货单/交货单DO(Delivery Order)询价单RFQ(Request for quotation)可靠性实验报告Reliability Monitor Report产品报废单PSB特采控制表CRB返工单PRB异常处理行动措施OCAP减薄：Wafer[‘weifə]n.威化饼干、电子晶片（晶圆薄片）Grind[ɡraind]vt.&vi.磨碎;嚼碎n.磨,碾Crack[kræk]vt.&vi.(使…)开裂,破裂n.裂缝,缝隙Ink[iŋk]n.墨水,油墨Die[dai]vt.&vi.死亡（芯片）Dot[dŋt]n.点,小圆点Mounting[‘mauntiŋ]n.装备,衬托纸Tape[teip]n.带子；录音磁带;录像带Size[saiz]n.大小,尺寸，尺码Thick[θik]adj.厚的，厚重的Thickness[‘θiknis]n.厚(度),深(度)宽(度)Position[pə‘ziŋən]n.方位，位置Rough[rŋf]adj.粗糙的;不平的Fine[fain]adj.美好的,优秀的,优良的,杰出的Speed[spi:d]n.速度,速率Spark[spɑ:k]n.火花;火星Out[aut]adv.离开某地,不在里面；(火或灯)熄灭Grindstone[‘ɡraindstəun]n.磨石、砂轮Mount[maunt]vt.&vi.装上、配有Mounter装配工;安装工;镶嵌工Mounting[‘mauntiŋ]n.装备,衬托纸Magazine[,mæɡə‘zi:n]n.杂志,期刊，弹药库（传递料盒）Cassette[kə‘set]n.盒式录音带；盒式录像带Inspect[in‘spekt]vt.检查，检验，视察Inspection[in‘spekŋən]n.检查，视察Card[kɑ:d]n.卡,卡片,名片划片：Saw[sŋ:]n.锯vt.&vi.锯，往复运动Sawing['sŋ:iŋ]n.锯,锯切,锯开Film[film]n.影片,电影（薄膜，蓝膜）Frame[freim]n.框架，骨架，构架Clean[kli:n]adj.清洁的,干净的；纯净的Cleaner[‘kli:nə]n.作清洁工作的人或物Oven[‘ŋvən]n.烤箱,炉Cassette[kə‘set]n.盒式录音带；盒式录像带Handler[‘hændlə]n.(物品、商品)的操作者Scribe[skraib]n.抄写员,抄书吏Street n.大街,街道Blade[bleid]n.刀口,刀刃,刀片Cut[kŋt]vt.&vi.切,剪,割,削Speed[spi:d]n.速度,速率Spindle[‘spindl]n.主轴，(机器的)轴Size[saiz]n.大小,尺寸,尺码Cooling['ku:liŋ]adj.冷却(的)Kerf[kə:f]n.锯痕,截口,切口Width[widθ]n.宽度,阔度,广度Chip[tŋip]n.碎片、缺口Chipping[‘tŋipiŋ]n.碎屑,破片Crack[kræk]vt.(使…)开裂,破裂n.裂缝,缝隙Missing[‘misiŋ]adj.失掉的,失踪的,找不到的Die[dai]vt.&vi.死亡（芯片）Saw[sŋ:]n.锯vt.&vi.锯，往复运动Street[stri:t]n.大街,街道Film[film]n.影片,电影（薄膜，蓝膜）Frame[freim]n.框架，骨架，构架Tape[teip]n.带子；录音磁带;录像带Bubble['bŋbl]n.泡,水泡,气泡mount---贴wafer---晶圆frame---框架blade---刀片tape---膜cassette---盒子completion---完成loader---上料un-loader---出料initial---初始化open---打开air---空气pressure---压力failure---失败vacuum---真空alignment---校准ink---黑点die---芯片error---错误limit---限制cover---盖子device---产品data---数据saw---切割water---水elevator---升降机spindle---主轴sensor---感应器wheel---轮子setup---测高rotary---旋转check---检查feed---进给cutter---切割speed---速度height---高度new---新shift---轮班pause---暂停clean---清洗center---中心chip---崩边change---变换enter---确认Off center---偏离中心broken---破的alarm---报警上芯：Attach[ə‘tætŋ]vt.&vi.贴上;系;附上Bond[bŋnd]n.连接,接合,结合vt.使粘结,使结合Bonder[‘bŋndə]n.联接器,接合器,粘合器Die attach material epoxy粘片胶Epoxy[e‘pŋksi]n.环氧树脂（导电胶）Material[mə‘tiəriəl]n.材料,原料Non-conductive epoxy绝缘胶Conductive[kən‘dŋktiv]adj.传导的Dispenser[dis‘pensə]n.配药师,药剂师Nozzle[‘nŋzl]n.管嘴,喷嘴Rubber[‘rŋbə]n.(合成)橡胶，橡皮Tip[tip]n.尖端,末端Die pick-up tool吸嘴Tool[tu:l]n.工具,用具Collect[kə‘lekt]vt.收集,采集（吸嘴）Ejector[i‘dŋektə]n.驱逐者,放出器,排出器Pin[pin]n.针,大头针,别针Lead Frame引线框架Lead[li:d]vt.&vi.带路,领路,指引Frame[freim]n.框架，骨架，构架Magazine[,mæɡŋ‘zi:n]n.杂志,期刊（料盒）Curing[‘kjuŋriŋ]n.塑化,固化,硫化,硬化Oven[‘ŋvŋn]n.烤箱,炉Scrap[skræp]n.小片,碎片,碎屑Dent[dent]n.凹痕,凹坑Die Lift-off晶粒脱落（芯片脱落，掉芯）Skew[skju:]adj.歪,偏,斜Misorientation[mis,ŋ:rien‘teiŋŋn]n.定向误差,取向误差Pre squeeze del写胶前气压延时Post squeeze del写胶后气压延时Squeeze[skwi:z]vt.榨取,挤出n.挤,榨,捏Eject[i‘dŋekt]vt.&vi.弹出,喷出,排出Delay[di'lei]n.延迟Height[hait]n.高度,身高Level[‘levl]n.水平线,水平面;水平高度Head[hed]n.头部，领导,首脑Eject up delay顶针延迟Eject up heigh t顶针高度Bond level粘片高度Pick Level捡拾芯片高度Head pick delay粘接头拾取延迟Head bond delay粘接头粘接延时Pick delay捡拾芯片延时Bond delay粘接芯片延时Index[‘indeks]n.索引;标志,象征;量度Clamp[klæmp]vt.&vi.夹紧;夹住n.夹具Index clamp delay步进夹转换延时Index delay框架步进延时Shear[ŋiŋ]vt.剪羊毛,剪n.大剪刀Test[test]n.测验,化验,试验,检验Die shear test推晶试验Thickness['θiknis]n.厚(度),粗Coverage[‘kŋvŋridŋ]n.覆盖范围Epoxy thickness&coverage导电胶厚度和覆盖率Orientation[,ŋ:rien‘teiŋŋn]n.方向,目标Die Orientation芯片方向Void[vŋid]adj.空的,空虚的n.太空,宇宙空间;空隙,空处;空虚感,失落感Epoxy void导电胶空洞Chip[tŋip]n.碎片Damage[‘dæmidŋ]vt.&vi.损害,毁坏,加害于n.损失,损害,损毁Chip damage芯片损伤Backside[‘bæksaid]n.臀部,屁股，背面Chip backside damage芯片背面损伤Tilt[tilt]vt.&vi.(使)倾斜Tilted die芯片歪斜Epoxy on die芯片粘胶Crack[kræk]vt.&vi.(使…)开裂,破裂n.裂缝,缝隙Crack die芯片裂缝/芯片裂痕Lift[lift]vt.&vi.举起,抬起n.抬,举Lifted die翘芯片Misplace[,mis‘pleis]vt.把…放错位置Misplaced die设置芯片NO die on L/F空粘Insufficient[,ŋnsŋ‘fiŋŋnt]adj.不足的,不够的Insufficient epoxy导电胶不足Epoxy crack导电胶多胶Epoxy curing银浆烘烤Edge[edŋ]n.边,棱,边缘Partial[‘pɑ:ŋŋl]adj.部分的,不完全的Mirror[‘mirŋ]n.镜子Missing[‘misiŋ]adj.失掉的,失踪的,找不到的Edge die/partial die边缘片/边沿芯片Mirror die光片/镜子芯片Missing die掉芯/漏芯/掉片Splash[splæŋ]vt.使(液体)溅起vi.(液体)溅落Splatter[‘splætŋ]vt.&vi.(使某物)溅泼Diagram[‘daiŋɡræm]n.图解,简图,图表Ink splash/ink splatter墨溅Die bonding diagram上芯图Die shesr test推片实验/推晶试验Die shear tester推片试验机Die shesr tool推片头Metal corrosion晶粒腐蚀/芯片腐蚀Wafer mapping system芯片分级系统System['sistŋm]n.系统;体系wafer---晶圆die---芯片attach---粘贴glue---银胶substrate---基板magazine---盒子inspection---检查parameter---参数manual---操作手册reset---重设enter---确定error---错误input---输入speed---速度stop---停止pressure---压力vacuum---真空sensor---传感器back side---背面pin---针statistics---统计calibration---校正bond---贴片conversion---改机thickness---厚度tilt---倾斜度shape---形状adjust---调整contact---接触cover---覆盖device---产品chip---崩边pause---暂停elevator---升降机initial---初始化alignment---校准cassette---盒子tape---膜frame---框架ring---铁圈temperature---温度rubber tip---吸嘴frame type---框架型号nozzle---点胶头writer---划胶头压焊：Wire[‘waiŋ]n.金属丝,金属线;电线,导线Bond[bŋnd]n.接合,结合vt.使粘结,使结合Wire bond/Wiring bonding压焊/焊丝/球焊Gold wire金丝Pad[pæd]vt.给…装衬垫,加垫子n.垫,护垫Bond pad焊点、铝垫1st bond第一焊点Pad size焊点尺寸/铝垫尺寸Capillary[kŋ‘pilŋri]n.毛细管;毛细血管（劈刀）Pitch[pitŋ]程度;强度;高度Pad pitch铝垫间距/焊点间距Elongation[i:lŋŋ‘ɡeiŋŋn]n.延长;延长线;延伸率Breaking[‘breikiŋ]n.破坏,阻断Load[lŋud]n.负荷;负担;工作量,负荷量Breaking Load破断力Pull[pul]vt.&vi.拉,扯,拔Shear[ŋiŋ]vt.剪羊毛,剪n.大剪刀Wire pull/ball pull（焊丝）拉力Wire shear/ball shear（焊丝）推力Ultrasonic[,ŋltrŋ‘sŋnik]adj.(声波)超声的Power[‘pauŋ]n.功力,动力,功率Force[fŋ:s]n.力;力量;力气Ultrasonic power超声功率Bonding force压力Bonding time时间Temperature[‘tempŋritŋŋ]n.温度,气温Bonding temperature温度Ultrasonic wire bonding超声波压焊EFO打火烧球loop[lu:p]n.圈,环,环状物Loop height孤高Wire pull test拉力试验Ball shear test金球推力试验PIN1第一脚Ball height球高Ball diameter球径Cratering[‘kreitŋriŋ]n.缩孔;陷穴（弹坑）KOH etching test KOH腐蚀试验Bond Cratering test压焊腐蚀试验(弹坑试验)Thermal[‘θŋ:mŋl]adj.热的，热量的Compression[kŋm‘preŋŋn]n.挤压,压缩TCB（Thermal Compression Bond）热压焊Bonding Diagram压焊图/布线图Wrong Bonding布线错误Incomplete[,ŋnkŋm‘pli:t]adj.不完全的,未完成的Incomplete bond焊不牢No bonding无焊N2BOX氮气柜RTPC实时过程监控Tray[trei]n.盘子,托盘Handing Tray产品盘FBI压焊后目检FBI insp-M/C压焊检验机Microscope[‘maikrŋskŋup]n.显微镜Low Power Microscope低倍显微镜Flux[flŋks]n.熔剂、焊剂；助熔剂，助焊剂Hook[huk]vt.&vi.钩住,吊住,挂住Wire pull hook线钩（测拉力）Ball shear tool推球头（测推力）Metal[‘metl]n.金属Discolor[dis‘kŋlŋ]v.使脱色;(使)变色,(使)褪色Oxide[‘ŋksaid]n.氧化物Metal Discolor铝条变色Bond Pad Discolor铝垫变色Bond Pad Oxide铝垫氧化Stick[stik]vt.&vi.粘贴,张贴Peeling[‘pi:liŋ]n.剥皮,剥下的皮Cratering[‘kreitŋriŋ]n.缩孔;陷穴（弹坑）Nonstick bond on pad铝垫不粘Bond pad peeling铝垫脱落Bond pad cratering铝垫弹坑Limit[‘limit]vt.限制;限定Scratch[skrætŋ]vt.&vi.抓,搔，刮伤Over rework limit超过返工数Bond remove/scratch剔球划伤Ball bond non-stick金球脱落Ball to large（small）金球过大（小）Ball bond short金球短路Non-stick on lead引脚脱落（鱼尾脱落）misplace[,mis‘pleis]vt.把…放错位置connection[kŋ‘nekŋŋn]n.连接,联结Misplaced bond on LD压焊打偏Wire broken断线Missing wire漏打Wrong connection错打defective[di‘fektiv]adj.有缺陷的，欠缺的Defective looping弧度不良Sagging[‘sæɡiŋ]n.下垂[沉,陷],松垂,垂度Loop sagging弧度下陷Low loop弧度太低High loop弧度太高Loop short弧度短路Overhang[,ŋuvŋ‘hæŋ]vt.伸出;悬挂于…之上Residue[‘rezidju:]n.剩余,余渣Distortion[dis‘tŋ:ŋŋn]n.歪曲,曲解Wire overhang on LD跨越引线框架Wire residue残丝LF distortion引线框架变形Quantity[‘kwŋntiti]n.数目,数量Mismatch[‘mis’mætŋ]vt.使配错,使配合不当Scrap[skræp]n.废料vt.废弃,丢弃Scratch[skrætŋ]vt.刮伤Quantity Mismatch数量不符Empty M.not scrap空粘未报废Gold Wire Scratch金丝受损Parameter---参数Statistics---统计Utility---应用Teach---教习Bond tip offset—焊线点纠偏Contact search---接触测高Zoom off center---放大倍数偏心校准Calibration---校准BQM---焊接质量控制PR—patterrecognition—图像识别Alignment tolerance—对点偏差PR indexing—图像控制下的步进Capillary---焊线劈刀Wire spool—送线卷轴Window clamp—窗口夹板Transducer—功率换能器FTN---功能键Wire threading—送线器EFO---电子打火Linear power---线性马达Vacuum sensor---真空感应器Step driver—步进驱动Post bond inspection—焊接后检查Wire pull—拉线Ball shape—推球Ball size—焊球大小Ball thickness—焊球高度Loop height—线弧高度Loop shape—线弧形状Neck crack—线颈折损Fine adjust–精确调整Conversion–换产品1st bond non stick—第一点不粘2nd bond non stick—第二点不粘peeling---拔铝垫（扯皮）Bond off---脱焊Ball deformation—焊球变形servo motor—伺服电机weld off---管脚脱焊crater---裂缝gold wire---金线missing ball---球未烧好weak bond---虚焊塑封：Mold[mŋuld]n.模子,铸型vt.浇铸,塑造Molding[‘mŋuldiŋ]n.成型（塑封）Compound[‘kŋmpaund]n.复合物,化合物Moiding M/C；Mold Press塑封机Press[pres]n.印刷机Heater[‘hi:tŋ]n.加热器;炉子Pre-heater预热机Chase[tŋeis]n.追捕,追猎Mold die/Mold chase塑封模具MGP mold MGP多缸模具Auto mold自动包封机load[lŋud]vt.&vi.1把…装上车[船]2装…loader['lŋudŋ]n.装货的人,装货设备,装弹机Auto L/F loader自动排片机handler[‘hændlŋ]n.(动物)驯化者（抓手）temperature[‘tempŋritŋŋ]n.温度,气温Pre-heat Temperature料饼预热温度Mold Temperature模具温度Clamp[klæmp]vt.&vi.夹紧;夹住n.夹具Pressure[‘preŋŋ]n.压(力),压强Clamp Pressure合模压强Transfer pressure注塑压强Transfer[træns‘fŋ:]vt.&vi.转移;迁移n.转移Curing[‘kjuŋriŋ]n.塑化,固化,硫化,硬化Curing time固化时间Curing temperature固化温度Pre-heat Time（料饼）预热时间Transfer speed注塑速度Transfer time注塑时间PMC time(Post Mold Cure Time)后固化时间Load/unload上料/下料Sweep[swi:p]vt.&vi.扫,打扫,拂去Wire Sweep冲丝Open开路Short短路Fill[fil]vt.&vi.(使)充满,(使)装满,填满Underfill['ŋndŋfil]n.(孔型)未充满Body underfilled胶体未灌满Incomplete[,ŋnkŋm‘pli:t]adj.不完全的,未完成的Incomplete mold未封满Chip[tŋip]n.碎片，缺口Chip package/body chip-out崩角Porosity[pŋ:‘rŋsiti]n.多孔性,有孔性Porosity Body胶体麻点Bubble[‘bŋbl]n.泡,水泡,气泡Blister[‘blistŋ]n.气泡vt.&vi.(使)起水泡Smear[smiŋ]vt.弄脏,弄污n.污迹,污斑Surface[‘sŋ:fis]n.面,表面Roough surface不均匀（表面）Delaminate[di:‘læmŋneit]v.将…分层,分成细层Delaminating分层Void[vŋid]adj.空的,空虚的PKG Void胶体空洞Deep[di:p]adj.深的Scratch[skrætŋ]vt.刮伤Body deep scratch胶体刮痕Dimension[di‘menŋŋn]n.尺寸,度量Mold PKG dimension塑封体尺寸BTM width/length背面宽/长Top width/length正面宽/长PKG thick塑封体厚度Mismatch[‘mis’mætŋ]vt.使配错,使配合不当Mold mismatch/PKG mismatch包封偏差(胶体错位) Offset[‘ŋfset]vt.抵消,补偿Misalignment[‘misŋlainmŋnt]n.未对准Mold offset/PKG misalignment偏心PMC（post mold cure）后固化Dummy[‘dŋmi]n.人体模型Strip[strip]vt.剥去,剥夺,夺走Dummy molded strip空封Mold flash废胶Gate[ɡeit]n.门,栅栏门Mold gate注浇口、进浇口Remain[ri‘mein]n.剩余物;残余Gate remain小脚Compound[‘kŋmpaund]n.复合物,化合物Aging[‘eidŋiŋ]n.老化,成熟的过程Compound Aging料饼醒料（回温过程）Locator[lŋu‘keitŋ]n.表示位置之物,土地Block[blŋk]n.大块(木料、石料、金属、冰等) Locator Block定位块Ejector[i‘dŋektŋ]n.驱逐者,放出器Pin[pin]n.大头针,别针，针Depth[depθ]n.深,深度Ejector Pin顶针E-pin Depth顶针深度Storage[‘stŋ:ridŋ]n.储藏处,仓库Cold room/compound storage冷藏库/料饼存放库Air[ŋŋ]n.空气Gun[ɡŋn]n.枪,炮Coating[‘kŋutiŋ]n.涂层,覆盖层Material[mŋ‘tiŋriŋl]n.材料,原料,素材,资料Air Gun气枪Die Coating芯片涂胶Auto die coating M/C芯片涂胶机Die Coating Material覆晶胶Cart[kɑ:t]n.手推车ASS’YB Cart后站推车Tablet[‘tæblit]n.药片、胶囊Loader[‘lŋudŋ]n.装货的人,装货设备,装弹机Preheater[‘pri:’hi:tŋ]n.预热器Fixture[‘fikstŋŋ]n.(房屋等的)固定装置Auto Tablet Loader自动排胶粒机Compoud Preheater高频预热机Load/Unload Fixture上料/下料架Tablet Magazine胶粒盒Compoud Tablets塑封料饼Molding Cleaning Compoud洗模饼misorientation[mis,ŋ:rien‘teiŋŋn]n.定向误差,取向误差PKG Misorientation胶体压反Mold flash on lead塑封溢胶Mold crack胶体裂痕Semiconductor---半导体Molding–模封Onload---上料Offload–出料Belt—皮带Preheater turntable–预热转盘Transfer---传送Safety Door---安全门Pick and place–机械手Motor---马达Station–模腔Cleaning brush—清洁刷Cylinder---气缸Sensor---传感器Solenoid---电磁阀Turn over–翻转器Degate–切料口Bearing---轴承Picker---爪子Pusher–推动器Cull bin–垃圾箱Pin---针Vacuum pump—真空泵Mornitor–显示器Cable–导线Profile---温度曲线Alarm---报警Error---错误Driver---驱动Sensor–感应器Inspection---检查Parameter---参数Manual---手动,手册Reset---复位Initialing---初始化Guide–导轨Substrate---基板Device---产品种类Lot Traveller---随工单Magazine---盒子Cylinder–汽缸Bearing–轴承Stop---停止Emergency Stop---紧急停止Gripper--夹子Heat–加热器Pipe–管子Temperature---温度Hopper–漏斗Compress air–压缩空气Over flow—反面漏胶Semiconductor---半导体Molding–模封Operation–操作Flange–法兰盘Pump–泵Chamber–腔体Vent–气孔Value–值Alarm---报警Error---错误Inspection---检查Parameter---参数Manual---手动,手册Reset---复位Initialing---初始化Incomplete fill模封不全inching---扭曲Overflow---漏胶Misalignment---模封错位Package mismatch---模封错位Resin Hole/Void---气孔Foreign materials---外来物Wire sweep---线弯曲Rough surface---表面粗糙Wrong Orientation---模封方向反Eng.Sample---工程师样品Stain/Dirty on package---表面脏污Resin burr---树脂有毛刺Resin flashes---毛刺Damage frameFRAME---损坏Scratch on package---树脂表面划伤Evaluation----评估Crack package---树脂开裂SPC sample---SPC样品切筋Trim-Form1切筋Trimming Dambar cut2切筋模Trim die3成形模Form die4分离模singulate5冲废De-junk6检测Inspection外观检测7再成型机模具Reform Die8再成型机Reform system9料盘Plastic tray10连筋Uncut dambar11毛刺burr14溢料Junk15裂纹Crack16离层（分层）Delaminating17管脚反翘Lead tip bend18筋未切Dam-bar uncut19筋凸出Dam-bar protrusion 20筋切入Dam-bar cut in打印Marking1打印Marking2印章Marking layout3激光打印Laser marking4油墨打印Ink(UV)marking5正印Top side mark6背印Back side mark7镜头Lens8打印不良\模糊Illegible marking9漏打No marking10断字Broken character11缺字Missing character12印字倾斜Slant marking13印记错误Wrong marking14重印Remark15印字模糊（褪色）Fade mark16印字粘污Smear19电流current21字体（字形）Font22定位针Location pin23胶皮打印机Pad printer24激光打印机Laser Marking M/C25后固化PMC(Post Mold Cure)26后固化烤箱PMC Oven27打印污斑Marking stain28印记移位Marking shift电镀Plating1电镀Plating2来料Incoming3冲废Dejunk4热煮软化槽Socking Tank7检验Inspection外观检测8烘烤Curing/Baking150℃;60-90ms9出料Unload10高速线电镀High-speed Plating Line11统计过程控制SPC12搭锡Solder bridge13锡丝、锡须Solder flick/Whisker14镀层不良Plating defects15发黄Yellowish16发黑Blacken17变色Discolor18露底材（露铜）Expose copper19粘污Smear20镀层厚度Plating thickness7-20um21镀层成分Plating composition电镀成分,Sn 22外观Outgoing23易焊性Solder ability24无铅化Pb-free/lead free25结合力Adhesive force26可靠性Reliability27电解Electrolytic deflash28清洗（自来水）City water29高压清洗High pressure rinse30脱脂Descale31清洗（纯水）DI water32活化（合金）Activation33预镀、预浸Pre-dip34电镀Plating35吹风Air blow36中和Neutralization37褪镀Stripper38拖出Drag out39上料机Loader40下料机Unloader41纯锡Tin42纯水(去离子水)DI water43水压Water pressure44理化分析Physical and chemical analysis45测厚仪Plating Thickness Meter/Electroplated CoatingThickness Test46离子污染度测试仪Ion Contamination Tester Contamino CT10047C含量测试仪Carbon Tester51去氧化HSCU Descale52预浸Pre-dip53电镀电流Current54镀液温度Temperature电镀液plating solution 55电镀槽plating tank56中和Neutralization59烘干Curing60锡球Solder ball61锡厚度和成分Sn thickness&composition62冲废De-junk去胶渣63去溢料Degate冲塑，冲胶64去飞边Deflash去胶(塑封工序)65锡铅电镀Tin lead plating66无铅电镀Lead free plating;Pure tin plating67镀层起泡Solder bump68镀层剥落Solder peel off69镀层偏厚或偏薄Thick or Thin Plating70退锡Solder remove71电镀报废Plating scrap72锡渣Solder peeling73电镀锡块Solder bump74电镀桥接Plating bridge75电镀变色SP Discoloration76电镀污染SP Contamination77电镀锡攀爬SP adhere78电解除油Electro-degreasing测试Testing1测试Testing2打印Laser mark3编带机Tape&Reel Machine4编带Reel5测试机Tester6分选机Tray Test Handler7Vision检测Direction vision8划伤Scratch9打错Wrong mark10断字Broken character11漏字No marking12模糊Fade mark13脚长Lead length14脚宽Lead width15站立度Stand up16脚间距Lead pitch17共面性Coplanarity18跨度Row space19电性能测试Electrical test20塑料管Plastic tube21编带Reel/Tape22托盘，盘装Tray23扫描测脚Leads Scan/Inspection 24扫描测脚机Leads scanner25投影仪Profile Projector测试TestingLaser激光Lamp灯管Lamp current灯管电流Marking layout打印内容Power supply电源Frequency频率On-loader上料部分Off-loader下料部分Marking box打印区域Track轨道Location pin定位针Scanner扫描器Beam光束Beam path光路Bar code条形码Sensor传感器Motor马达Driver驱动器Index步进Tool模具Press模具Punch刀具Jam卡料Forming成型Cylinder气缸Laser head光头Magazine盒子Tube管子Tray板子Arm机械臂Safety door安全门Reset复位Lamp灯管Keyboard键盘Alarm报警Error错误Open/Short(O/S)开路／短路Function Reject功能失效Parameter Reject参数失效Retention Reject保持力失效Icc Reject电流失效Test Program测试程序Cold test冷测Retest重新测试Rework返工Sample抽样Resample重新抽样Black box盛放未测试产品的黑盒子Testing area测试区域Test chuck测试平台Device Interface Board(DIB)芯片测试接口板DUT正在测试芯片A/D(analog-to-digital)converter模/数转换模块EOT测试结束信号SOT测试开始信号BIN signal分BIN信号Socket测试座JIG/Test Head测试盒/测试头Interface Card接口通讯卡Interface Cable接口通讯线Coaxial Cable同轴线Test parameter测试参数Tester Computer测试机主机Test limit测试结果的上下限AC Multiplexer多路交流信号板Digital Driver and Detector数字输入/输出装置Dual Voltage/Current Source双路电压/电流源Station Monitor显示测试结果的窗口Checker检测程序High-Speed Digital(HSD)Instrument高速数字测试设备High-Current-Voltage-Source高电流电压源Finger金手指Contactor金手指动作模块Convey motor变送马达Contact side测试位置General Control Panel总控制面板Ionizer离子风扇Capacitor box电容盒。