雷射微盲孔切片常见缺点
Typical Phenomena in Cross Sections of Plated Microvias
1 Folding (Void) 折镀 2 Resin Ablation 树脂过度烧蚀 3 Glass Fiber Protrusions 玻纤突出 4 Plated Pocket 空心包镀 5 Resin Residues (Smear) 树脂残渣 6 Void (PTH) 孔破 7 Wedge Void 楔形孔破 8 Entry Plating 孔口厚镀铜 9 Burr (Molten Copper) 熔铜残瘤 10 Void (Gas Bubble) 气泡型孔破 11 Laser Shoot Through 雷射穿箔 12 Blistering 镀铜起泡 13 Mouse Bites 鼠咬 14 Void (PTH) 失准孔破 15 Registration Fault 对准不良 16 Lifting (Plated WedgeResidues)空洞 31 Burned Plating 镀铜烧焦 32 Starburst星迸 33 Red Rotation 34 Resin Crack 树脂微裂 35 Crazing 玻纤纱束开裂
36 Foreign Inclusion 外來杂物 37 Prepreg Void 胶片空洞 38 Pocket Void 溶剂空洞 39 Measling 白 点 40 Resin Recession 树脂缩陷 41 Weave Texture 织纹隐现 42 Glass-Weave Texture 织纹显露
PTH镀通孔切片常见缺点总览
Typical Phenomena in Cross Section of Plated Through Holes
A Undercut 侧蚀 B Outgrowth 外伸 C Overhang 总浮空 1 Resin Blistering 树脂微裂 2 Laminate Void 基材空洞 3 Delamination 树脂微裂 4 Lifted Land Crack孔环底材微裂 5 Pad lifting浮环 6 Burr毛刺.毛头 7 Pink Ring粉紅圈 8 Negative Etchback 反回蚀 9 Foil Crack 铜箔开裂 10 Void (PTH)孔破 11 Wedge Void 楔型孔破 12 Glass Void 玻纤孔破 13 Microvoid 玻纤微破 14 Arrow Heading 箭尖钉头 15 Nail Heading 钉头 16 Drilling Cracks 钻裂 17 Innerlayer Burning(ICD) 内层烧焦 ICD=Interconnection Defect 18 Pull Away 拉离 19 Corner Crack 角裂 20 Blistering 起泡 21 Glass Fiber Protrusion 玻纤突出 22 D-Effect 除胶渣不足 23 Wicking渗铜 24 Void (Metal Resist) 孔破 25 (Positive) Etchback 正 回蚀 26 Barrel Crack 断孔 27 Shadowing 阴影 28 Nodule 镀瘤 29 Rest Smear (ICD) 胶渣