Secondary process system introductionWorking characteristics1. Wafer factory2. Fab features and capabilities of the gas required3. Chemical substances and their properties required for fab4. Work contents1. Wafer factoryFAB is a modern plant producing chips, the main workplace for the cleanroom. Clean room is a constant temperature and humidity, temperature is 21 ° c. Relative humidity 65%. Fab clean rooms divided into the diffusion zone (furnace batch), yellow, etching, thin film areas.2. Fab features and functionality of the gas requiredDue to the manufacturing process on the need and use of many kinds of gases in semiconductor factories. We generally are based on gas properties to distinguish words. Specialty gases and gas can be divided into two broad categories. The former to use less gas. Such as SiH4, and NF3 . Which use large amounts of gas. Such as N2, and CDA . Due to a larger amount; General gas often in " bulk gas " call. The Bulk Gas. Specialty gas -Specialty Gas.2-1 Bulk Gas In the semiconductor manufacturing process, need to provide a variety of high purity gas used in pneumatic equipment power, chemicals or pressure medium is used as an inert environment, or take part in the reaction or to remove impurities, such as different functions.Because of increasingly sophisticated semiconductor production, its requests for gas purity is ever mentioned. Semiconductor factory will be briefly described below the general quality requirements and the necessary equipment for gas and its functions.2-1-1Bulk gas products:Bulk gas Semiconductor plants can use, there are generally CDA 、GN2 、PN2 、PAr 、PO2 、PH2 、PHe 7 Species.2-1-2 Bulk gas manufacturing:<1> CDA/ICA(Clean Dry Air)Clean, dry air.CDA Sources taken from the air compressed by compressor dehumidifier, then by a filter or activated carbon adsorption to remove dust and hydrocarbons to supply the clean room CDA/ZCD 。

CDA System:Air compressor Buffer storage tank cooling dryerFilter CDA<2> GN2Compressed using compressor cooling gas into liquid gas. Catalytic converter, CO reaction to CO2, H2, reaction to H2O, then sieve absorption of CO2, and H2O And then slip separation O2&CnHm.N2=-195.6°C O2=-183°CPN2GN2 Through the Purifier (Purifier) Purification, producing high purityN2 。

Liquid original nitrogen purity99.9999%After purification for purification of nitrogen purity99.9999999%GN2&PN2 System(See attached map)<3> PO2Compressor compressed cooled gas into liquid gas, awarded by second slip 99% Above in purity O2 And then drop N2 、Ar 、CnHm 。

Another by electrolytic dissociation H2&O2PO2 System(See photos)<4> PArCompressor compressed cooled gas into liquid gas, awarded by second slip 99.0% More purity argon. Ar content in the air is only 0.93%. Production costs are relatively high.PAr System (See attached map)<5> PH2Compressor compressed cooled gas into liquid gas, awarded by second slip 99.0% Above in purity H2 。

Also by H2O electrolytic dissociation H2&O2. High hazard manufacturing cheap but easy to trigger explosions.PH2 System (See attached map)<6> PHeRare and rich He Extracted from natural gas, its main origin for the United States, and Russia. Air compressors compressed cooled gas in liquid, easily obtained from the slip.He lium=-268.9°C Methane (Methane)= -161.4°CPHe System (See attached map)2-1-3 Use of bulk gases in semiconductor plantsCDA Main supply FAB Pneumatic device powered air source and blowing (Purge),Local Scurruber Fuel it.ICA Main facility system pneumatic equipment-powered gas source and blowing.N2Main supply part of the pneumatic equipment air supply or supply blowing and dilute source of pressure of inert gas and chemical delivery.O2Supply ETCH -Process oxidizer needed and CPCVD Supplies oxidation process with business routine supply O3 Generator Required O2 Supplies and other processes required.Ar Supply Sputter Manufacturing process and ion sputtering heat transfer media Chamber Dilution and inert gas environment.H2Feeding tube devices burning mix of oxygen, POLY Manufacturing process H2 BAKE Purposes. W-PLUG manufacturing process as WF6 for the reduction of gas and other processes.He Pressure medium supply chemicals and processing chips cool.Bulk Gas Although not as Specialty Gas , Some with highly toxic and corrosive. But we still need to pay attention to safety using a bulk gas. GN2, and PN2, and PAr, and PHe has the danger of suffocating, that gas is colorless and odorless, massive emission of lead in the air contain O2 ( Usually 21%), decreased to 16% below, namely, headaches and nausea. Dang O2 less to 10% Shi, who will be in a State of the will is not clear,6% , instantly Faints, unable to breathe,6 minutes less than death. PH2 due to leakage or when mixing, concentration of his own as long as the H2 of the blast RADIUS (4%-75%) (air), if they got the fire burning this gas is mixed. PO2 will make material easily oxidized to yield burning, causing fire mishap. Therefore, our works in the semiconductor, in the design, construction, and how to avoid leaks, and how to protect themselves from, you are one of our hard work.2-2 Specialty GasUsed by the semiconductor factory Specialty Gas A wide range of about 40 or 50, according to risks can be divided into the following categories:2-2-1 Flammable gasesWhen some leaks gas when mixed with, as long as his own concentration in a certain range (air), if they got the fire, this gas is burning from the mix. This called the explosion of the gas range. Such as:SiH4 1.35%-100% SiH2CL2 4.1%-98.8% PH3 1.32%-100%2-2-2 Low pressure gasSome gases under normal for the viscous liquid gas at room temperature of saturated vapor pressure is less than 10Psi , Can also interfere with pipeline blocked, need to pack heat, improving the air vapor pressure can be an adequate supply of gas. For example:DCS, and CLF3, and WF62-2-3 Toxic gasSome gases due to its strong reaction of animals (including humans)respiratory and mucous membranes, skin and other features with a strong impact. Such as:NF3,PH32-2-4 Corrosive gasesSome gas and water effects, that is produced by hydrolysis HCL HF Acidic substances such as, the human body (including eyes, nose, skin, respiratory system, etc) and equipment (such as piping and valves) havea corrosive effect. This gas has the following:<1> HCL、CL2 、SiH2CL2 、BCL3 CL Elements of gas---HCL<2> BF3、SiF4 、WF6 F Element---HF<3> NH3---Ammonia water Very irritating2-2-5 Asphyxiant gasesSuch as: CO2 、CF4 、C2F6 Such gases, odorless and tasteless. If a large number of emission of air caused by O2 content reduced to 16% when the headache and nausea. Dang O2 less to 10% Shi, who will be in a State of the will is not clear,6% , instantly Faints, unable to breathe,6 minutes less than death.2-2-6 Spontaneous combustion gasesSome of the gases, mixed with the air, even without the fire catches fire spontaneously burst into flames. This is called spontaneous combustion gases. Its fire at room temperature. This gas are:SiH4、PH3 、B2H6Though we cannot exclude these gases can cause various adverse effects on us. But we working in semiconductor plants, may be included in the design, construction, and stop loss. To avoid leaks, he stressed. 3． Fabs require chemical substances and their properties3-1 Types of chemicals (solvents)C260、EKC-270 、NMP 、OK-73 、A515 、IPA In addition to EKC-270 PFA/304 BA Tube, others use 316L EP Tube. Take over the way with VMB outlet and themachine inlet side takes over.3-2 Chemical species (pH class)HF1%、HF49% 、H2O2 、NH4OH29% 、DEVELOPER 、M1 、BOE 200:1 、BOE 500:1、BOE 50:1 、HNO3 、HCL 、H3PO4 、H2SO4 。