Analysis tech Phase 11 半导体热阻分析仪一、Analysis Tech Phase11 Phase10概述ANALYSISTECH半导体热分析仪Semiconductor Thermal Analyzer热阻测试仪中国MICOFORCE米力光CO供应,由美国Analysis Tech Inc公司的PHASE10 PHASE11 热阻测试仪电子封装器件，符合美军标和JEDEC标准. Analysis Tech Inc.成立于1983年，坐落于波士顿北部，是电子封装器件可靠性测试的国际设计，制造公司。
他的创始人是John W.Sofia，美国麻省理工的博士，并且是提出焊点可靠性,热阻分析和热导率理论的专家. 发表了很多关于焊点可靠性,热阻分析和热导率论文. Analysis Tech Inc.在美国有独的实验室提供技术支持.。
热阻分析仪Phase 11主要用于二极管、三极管、线性调压器、可控硅、LED、MOSFET、MESFET、IGBT、IC等分立功率器件的热阻测试和分析。
二、Analysis Tech Phase 11 Phase10工作原理及测试过程Phase 11采用油浴法测定热敏参数校正曲线。
在通以感应电流结还没有明显产生热量时，如果给定足够的时间，结温和壳温将达到热平衡，壳温非常接近结温。
将热电偶直接连接到器件表面采集数据时，油浴将充分保证器件的温度稳定并且使热电偶采集的温度等于感应结温。
在这个环节中，感应电流大小的选择是很重要的。
感应电流过大，会导致结温明显变化；感应电流过小，会导致正向压降值测量误差较大。
Phase 11 感应电流的可选范围是0.1mA~50mA，完全符合JEDEC标准。
在加热器件的过程中，Phase 11 采用了脉冲加热方式，如下图所示：加热电流和感应电流通过电子开关切换的方式轮流工作。
每加热15秒，测量1次热敏参数，即获得1个结温值，测量完之后继续加热，加热15秒，再次测量结温值，如此反复工作。
在这个过程中，系统将每次测量到的结温值和前面7个结温值进行比较，如果连续8个结温值相同，系统会判定器件达到热平衡，并计算出稳态热阻值。
如果用户需要得到热阻热容曲线，只需要将电子开关锁定在测量端即可。
此时，因为没有了加热电流，器件开始降温，通过监测器件电压可以得到一条温度下降的曲线，进而通过一系列数学变换得到热阻热容曲线以及瞬态热阻抗曲线。
三、Analysis Tech Phase 11Phase10 技术指标Ø加热电流测量精度（低电流测量：0.2A,1A和2A测量）2A系统：±1mA，10A系统：±5mA，20A系统：±10mAØ加热电流测量精度（高电流测量：2A,10A和20A测量）2A系统：±4mA，10A系统：±20mA，20A系统：±40mAØ加热电压测量精度：±0.2%读数±0.025%量程Ø热电偶测量精度（T型）：典型±0.1℃，最大±0.3℃Ø结温测量精度：典型±0.1℃Ø结温测量延迟时间：1usØ设备工作电压：220VAC，3A，50/60HzØ器件的最大供电电压：5V（选配Power Booster可以扩展到100V）Ø器件的最大供电电流：2A，10A，20A（选配Power Booster可以扩展到1000A）Ø结温的感应电流：1mA，5mA，10mA，20mA，50mA，0.1~50mA可设定四、附件介绍1、Nuova校准浴锅用来得到节电压和结温的函数关系即K值。
产品特点：1）由集成在热阻分析仪中的模块直接进行温度控制2）使用有陶瓷镀层的磁力搅拌器3）带有冷却风扇的坚固底盘能够控制升温速率并保证安全性4）有盖的四升不锈钢水浴锅5）悬挂结构支持部件被校准6）四升绝缘良好的导热矿物油，对环境无害并能重复使用2、EVN-12静止空气测试箱EVN-12是用于在标准化的静止空气环境中测试元件。
自然对流条件下的热阻测量会对实验室里的不期望的空气流动非常敏感。
这套静止空气测试箱可以排除这种潜在的产生测试错误的因素。
3、风洞相对于静止空气测试箱，伺服控制风洞提供了一个强制对流、均匀一致的测试环境。
在测试对气流比较敏感的器件时，我们能够更加准确地测量出器件在不同风速下的热阻。
4、Rjc测试夹具（风冷型）风冷型Rjc测试夹具是一个高性能的风冷型热沉，可以很方便地固定被测器件，是测量JEDEC标准定义Rjc的理想夹具。
Rjc测试夹具采用了一种特殊的装置可以准确的测量壳温。
5、Rjc测试夹具（水冷型）水冷型Rjc测试夹具需要配合循环冷水机使用，具有散热迅速的特点，通常用来测试IGBT和MOSFET等功率较大的器件。
6、Rjb测试夹具完全按照JEDEC JESD51-8的要求设计，用来测试结到电路板的热阻。
7、LED高压放大器当被测LED的正向压降高于5V，可以选择LED高压放大器，提供28V的测试电压。
8、功率放大器提供高达200A，400A和1000A的加热电流。
9、热阻分析仪校准仪溯源到NIST，可以用于热阻分析仪的故障诊断，建议每半年对热阻分析仪做一次校准。
10、热电偶校准仪溯源到NIST，用于对热电偶接口进行校准。
五、Analysis Tech Phase 11主要特色Ø所有测试数据、图像全屏显示Ø高速数据采集和分析，能对各种类型器件进行测试Ø能够输出常规的数据和文件类型，能将设置参数和数据存储在硬盘上Ø能对操作人员的错误和测试数据的有效性进行连续监测Ø四线制测试方法排除测试导线电阻的影响Ø兼容IEEE488和RS-232C通讯方式，测试方法遵循MIL&JEDEC标准Ø根据电流、功率或ΔTj对器件的功率进行自动控制，用户选择热平衡的监测方法Ø对附属设备进行自动控制，对集成电路和多芯片模块有多结探测能力Ø三个内部参考热电偶，能通过红外线对器件表面的温度进行测试Ø有标准和常规的测试夹具，设备校准方便Analysis Tech Thermal Analyzers measure semiconductor junction temperatures using the electric method of junction temperature measurement for testing all types of semiconductor devices. This capability is the foundation of numerous test methods including: thermal resistance, transient thermal impedance, die attach screening and functional power cycling. The convenient flexibility of the analyzer also facilitates interconnected control of other laboratory test equipment.Semiconductor Thermal Analyzers perform thermal measurements on all types of packaged semiconductor devices including diodes, LEDs, bipolar transistors, MOSFETs, functional analog/digital integrated circuits, ACSICS, IGBTs, SCRs, TRIACs, and thermal-test-dies. All products offered conform to applicable JEDEC and MIL Standards.Using the electrical method of junction temperature measurement, Analysis Tech Thermal Analyzers accurately measure component thermal parameters - essential for design and implementation of thermally reliable electronics. In addition to equipment sales, Analysis Tech offers Component Test Services for thermal characterization of semiconductor devices at our factory test-laboratory.This type of test equipment is alternately known as: semiconductor thermal resistance testers, semiconductor thermal impedance testers, component thermal resistance testers, component thermal impedance testers, die attach testers, die attachment testers.The Analysis Tech Thermal Analyzer Phase 11 provides comprehensive automated control of semiconductor thermal measurements for production and development testing with powerful features such as:All Test Modes:▪Test capabilities for all device-types: diodes, LEDs, bipolars, MOSFETs, IGBTs, functional ICs, thryistors, thermal test dies▪Automated high speed data collection, reduction, and analysis▪Compatible with all 750E Mil Stds and JEDEC 51 Series methods▪Data plots for all test parameters in all tests modes▪Simple, automated "in-lab" instrument-calibration procedures ▪Various text and graphics file formats for convenient exporting ▪Continuous intelligent monitoring for errors and data validity▪Kelvin (4-wire) connections to eliminate test cable resistances effects▪Compatibility with USB, IEEE 488, and RS-232C communications▪10/100 Ethernet NIC interface▪Test methods compatible with MIL & JEDEC test standards▪Selection of automatic power-control by current, wattage, and ΔTj▪Standard and custom test fixturing available ▪Windows XP Pro operating systemSteady State Thermal Resistance Mode:▪Multi-junction temperature sensing capability for ICs & multi-die devices▪User-selectable thermal equilibrium criteria▪Batch-mode for determining power level and air flow effects▪Control of accessory laboratory equipment for integrated testing ▪Infrared case temperature measurement capability▪Capability for automatically switching the device under testDie Attach or Power Pulse Mode:▪Pass/Fail or bin sorting based on die-attach quality▪Serialized part testing▪Data plots of all parameters including die-attach histogram▪Extended-life testing with interspersed die-attach testing▪Interface for mechanized device handlers▪Batch mode die-attachment production testing multi-chip modulesHeating Characterization / Transient Thermal Impedance Mode:▪Heating and cooling curve time-resolution: 1 microsecond▪Heating and cooling curve span: 1 microsecond - 10,000 seconds▪Heating and cooling curve points-per-decade plotted: 15▪Utilizes time-constant-spectrum and structure function analyses ▪Optimized compact dynamic RC models with 2-8 discrete stagesMultiple Sense-Junction ChannelsUp to eight junction temperatures can be simultaneously sensed for testing devices with multiple junctionsand for characterizing multi-chip packages or modules. In multiple-die packages, the die-to-die heating (thermal cross-coupling) must be measured to accurately characterize these type of packages. For testing functional integrated circuits (ICs), multiple sense junctions offer validation of the junction temperature (Tj) readings in instances where some of the Tj sense connections are subject to the spurious electrical effectsof other portions of the IC circuitry. When testing hybrids and large-die ICs, multiple sense junctions canreveal temperature distributions that occur when substantial temperature variations exist within the test device. Multiple sense channel applications include:▪Multi-die devices where multiple heat sources may exist▪Thermal cross-coupling associated with multi-chip devices▪Larger devices which may exhibit substantial temperaturegradients during normal powered operationMultiple sense channels also permit the calibration of up to 8 sense junctions simultaneously for faster calibration through-put.Batch Mode and Bin Sorting for Power Pulse TestingAccurate and rapid screening of device thermal characteristics can dramatically enhance production-device reliability. Die Attachment testing provides an excellent gauge of the chip attachment-quality in terms of the device impedance. The Phase 11 Thermal Analyzer provides programmable relay drivers for controlling external devices during Power Pulse Testing. These drivers offer the following capabilities:▪switching between test points in hybrid circuit test fixtures for multiple sequenced tests▪manual or automatic handler controls bin sorting based on die attachment test resultsThe test switching capability of the Thermal Analyzer allows one test fixture to carry all the test connections or test-point probes for a batch of tests required for testing complex hybrids. Thus all significant die attachments on a hybrid can be tested with one insertion and one test initiation.Bin sorting is utilized in die attach testing to rapidly sort devices based on die-attachment quality. The bin sorting control can be used with manual insertion testing or with automatic component transfer systemswhich would insert devices to be tested into test fixtures and subsequently eject the tested device into oneof up to eight bins. (see Die Attach Testing in Production Environments)Accessory Equipment Control PortsFrequently, device thermal performance must be evaluated over a range of external conditions. Such conditions might include cooling air flow, ambient operating temperature, coolant flow rate, or the heating supply voltage. The Thermal analyzer can control accessory test equipment via USB, IEEE, or serial communication toachieve integrated batch testing under a wide range of external conditions. The Analysis Tech accessoryBatch Switching Module provides a convenient means to switch the device-under-test so that many devices can be tested sequentially in batch mode.The simple setup and control procedures of the Thermal Analyzers allow the test engineer to initiate up to 200 tests in batch mode. Tests are successively executed automatically: as a test reaches completion,the external condition is incremented and the test cycle repeated until the batch of tests is completed.Once these batch tests have begun, data reporting and accessory equipment control are automatically coordinated.The Analysis Tech Phase 11 Thermal Analyzer performs a variety of semiconductor thermal tests controlled from a powerful Windows based operating program and continuous-display front panel meters.The convenient user-interface facilitates complete thermal characterization for any type of semiconductor device or package type according to Mil Std 750E and JEDEC 51 Series methods..The Phase 11 Thermal Analyzer can be easily configured to perform tests on a wide range of device types including digital or analog functional integrated circuits, thermal test dice, bipolar transistors, diodes, MOSFETS, IGBTS, thyristors, and ASICs. During testing, comprehensive graphic data-displays offer superb detail on all test data, thus promoting confidence and understanding of the test results.All semiconductor junction temperatures are accurately measured using the electrical method.Parts can be tested by simply selecting the part-specific Setup File which includes all of the necessarytest parameters for the desired test method. Test data is stored on the PC hard disk including final numerical data such as thermal resistance, power levels, reference temperatures, as well as data plots, and pass/fail evaluations. Text and graphic files can be stored in various file formats as needed forexport to other Windows applications. A network connection (NIC) is provided so that test data canbe archived to your LAN.The Analysis Tech Phase 11 Thermal Analyzer provides manual or automatic heating power control.Three thermocouples reference temperatures ports are provided for measurement of external package temperatures such case, lead, etc. Thermal equilibrium is automatically detected based on a varietyof user-selectable criteria. Real-time data plots and tabular displays are readily accessible as testing proceeds. Batch Mode testing offers automatic sequencing of tests with alternate power levels,different test-devices, or varied environmental conditions such as ambient air flow speed or temperature.The Phase 10/11 Calibrator offers a powerful and convenient method for annual or biannual instrument calibration without the expense and "down-time" associated with typical "cal-lab" procedures. Thermocouple calibration is comprehensive and automated with the Phase 10/11 Tc Calibrator.Die attachment bin-sorting offers an efficient means to sort devices according to the thermal quality of the die attachment. Power Pulse Batch Mode performs a rapid sequence of die-attachment tests on up toeight separate devices. With this capability, multiple active devices on a multi-chip module can be tested for die-attachment with one insertion of the device-under-test.The Analysis Tech Phase 11 Thermal Analyzer uses an external DC supply for the heating power source, coupled to the Thermal Analyzer via a rear-panel connection. In all test modes, the external supply is controlled by the Thermal Analyzer to provide the desired heating-power level. The external power supply is not included with the Thermal Analyzer but can be purchased as part of the Discount Accessory Package or separately.The maximum power handling capacity of the Analysis Tech Phase 11 Thermal Analyzer is 100W, 500W, and 1000W for the 2A, 10A, and 20 A analyzers, respectively. The Power Booster accessory offers heating currents up to 1000 amps and heating power levels up to 6000 watts.All Thermal Analyzer sales include free training at our factory-based test lab facilities.。