Panacol胶粘剂在电子组装中的应用来自德国的胶粘剂专家Panacol(隶属Hoenle Group)，专注于胶粘技术的工业应用，自1976年成立以来在电子、汽车、医疗器械等领域获得广泛的认同。
下面大致介绍一下Panacol胶粘剂在PCB电子组装中的应用。
∙Application Items 应用项目- Conformal coating 保形涂层(三防漆)- SMD adhesives 表面器件贴装胶粘剂- Glop-top 包封胶- Flip-chip underfill 倒装底填充胶- Silicones 硅胶- UV/UV LED lamps 紫外/紫外LED灯- Dispensing device technology 点胶设备技术- Heat sealing/Hot bar soldering/Heat staking 热封/热压焊/热熔焊技术∙Advantages 优势- Thermally and electrically conductive 可提供不同类型的导热和导电胶粘剂；- UV and/or thermally curing 紫外固化和(或)热固化可选；- Isotropic and anisotropic adhesives 可提供各向同性和各向异性的导电胶粘剂；- Leading equipment technology 领先的设备技术水平；- Expertise from a single source 一站式的专业服务。
∙Conductive adhesives, die bonding, anisotropic bonding导电胶粘剂，芯片键合，各向异性导电接合- Panacol-Elsol supplies a range of superior electrically and thermally conductive adhesives.Their applications range from die bonding, antenna contacting,flip-chip through anisotropic bonds and bonding of heatsinks to HF shielding and 3D-MID.Panacol提供一系列性能优越的导电导热胶粘剂，其产品应用包括从芯片键合、天线连接、通过各向异性结合实现的倒装、散热片贴合到高频屏蔽罩及三位模塑互连器件的应用。
- Typical products information 典型产品信息Product No.产品型号Adhesive Types 胶粘剂类型Application Field应用领域Elecolit® 6604Therm. Conductive导热胶measuring instrument sensors 测量仪器感应器Vitralit® 6138Therm. Conductive导热胶die-attach, heatsink bonding 芯片贴合，散热片贴合Elecolit® 3653Electr. Conductive导电胶flexible parts bonding 柔性部件的贴合Elecolit® 3043 Electr. Conductiveantenna print, ceramic fuses天线印刷，陶瓷保险丝Elecolit® 3061Anisotropic conductive各向异性导电胶LCD, flexible circuits 液晶显示屏，柔性电路Elecolit® 3063Anisotropic conductive各向异性导电胶UV-curing, for flexible circuits 可紫外固化，应用于柔性电路∙SMD adhesives, flip-chip underfills贴装元件胶粘剂, 倒装底填胶粘剂- Panacol SMD adhesives are ideal for attaching both large and small components on printed circuit boards.不管对于PCB板上的大器件还是小器件，Panacol贴片粘合剂都是非常是重视对大型和小型印刷电路板组件的理想选择。
- Panacol underfillers are perfect choice for components such as FC CSPs and FC BGAs for ASICs. Panacol underfillers在用于ASIC的芯片级封装(CSP)、BGA封装等的贴装上有着非常出色的表现。
- Advantages: fast flow behaviour; spread readily under large chips; no cracking, even after thermal shock.优点：流动迅速；大尺寸芯片下容易扩散；即使在热冲击之后也无裂痕。
- Typical products information 典型产品信息Product No.产品型号Application Field应用领域Vitralit® 6104VTMounting large components on PCBs, corner bondingPCB大尺寸元件贴装，边角贴合Structalit® 5604SMD, fast curing, excellent adhesion表面贴装器件，快干，出色的结合力Vitralit® 2665Flip-chip underfill, very low CTE, Nano-Filler倒装底填充，非常低的膨胀系数，纳米级填料Vitralit® 2675Flip-chip underfill, high chemical/physical resist.倒装底填充，出色的抗化学品及物理冲击能力Vitralit® 2685Flip-chip underfill, very low shrinkage,ideal for parts subjected to impact testing倒装底填充，低收缩率，是需要进行冲击测试元件的理想选择Conformal coating, glob-top, dam & fill保形涂层(三防漆)，包封，围堰及填充- To protect PCBs and chips from environmental factors, Panacol has developed special conformal coatings. These have already been proven in many applications in the automotive, electronics, medical systems and other industries. Our product expertise also covers glob-top sealants and dam& fill.为了保护印刷电路板和各种chip元器件，Panacol开发了一系列具有针对性的保形涂层。
经过多年的应用，Panacol的保形涂层产品已经在汽车、电子、医疗系统和其它行业获得广泛认同。
另外，Panacol专长的产品还包括glob-top密封胶和围堰及填充胶。
- Typical products information 典型产品信息Product No.产品型号Application Field应用领域Conf. coating, flexible, UV- and thermally curingVitralit® 2009 F保形涂层，柔软性好，紫外及热固化Conf. Coating, foil bonding, low shrinkageVitralit® 4451保形涂层，箔材贴合，低收缩率Glob-top, black, high temperature resistanceVitralit® 1691包封应用，黑色，耐高温Glob-top, for large/tall parts, thixotropicVitralit® 1657大尺寸元件的包封应用，有触变性Glob-top, black, excellent adhesionStructalit® 5892包封应用，黑色，极好的结合力Dam, stable, can be used wet-in-wetVitralit® 1671围堰胶，稳定，可在不干面应用Liquid sealant, dry surface, elasticVitralit® 2583液态密封胶，表面干燥，弹性好Heat sealing, hot bar soldering, heat staking热封/热压焊/热熔焊技术- Panacol supplies intelligent compatible systems designed specifically for use in LCD and PCBproduction.> Optimised production processes for best quality> Minimised defect rates, low production costsThe design and equipment of each device type can be tailored to customers' specific productionrequirements.Naturally they can also be integrated within existing production processes.Panacol为PCB和LCD生产应用设计了高智能兼容性系统：> 优化生产流程以达到最好品质；> 减少坏品率，降低生产成本。
每个应用单元可以根据客户的需求提供个性化的设计及设备。
当然，这些应用单元被集成于现有的生产流程当中。
∙Dispensing 点胶工艺Panacol have the perfect dispensing devices for all your needs – from standard machines to highly specialised equipment. Ideal for precisely dispensing application of various low- and high- viscosity materials. And we also have the suitable accessories.为满足客户的需求，Panacol可提供非常优良的点胶设备——从标准机到高度个性化的设备，为客户精确各种高低粘度胶粘剂的点胶流程提供了理想选择。