Jetchem
化学品作用Chemical Interaction
• 关键因素：Key Factors
International Co., Ltd.
有一点要注意，在有填孔不良时我们分析的添加剂含量可能还是正 常的，即使那时有效成份已经很低了。 因为我们通过分析替代成份 来表示添加剂含量的。
One have to be careful because in this situation, the Additive CVS reading will come out good as we analyze for combination of X-Y and –Y species, even if Additive X-Y is at low level :
• 概述 General • 1, 填孔的机理是 底 部填满
• The BVF Mechanism is based on the <Bottom Filled-up>concept
Jetchem
International Co., Ltd.
• 2, 这就意味着底部的 铜的沉积 要比表面 的快.This means that
Jetchem
International Co., Ltd.
阳极的影响Influence of Anode
为什么不溶性阳极使用频率较高 • This is why Consumption with insoluble anodes is higher !!! • 可溶性阳极 Soluble Anode • 有部分Y 成份会在阳极上附着 Back to bulk solution and in the anodic film • 不溶性阳极 Insoluble Anode • 能够完全去除Y成份 • Complete destruction of the original additive
Jetchem
化学品作用Chemical Interaction • 关键因素：Key Factors
International Co., Ltd.
这一问题的跟本解决方法在于，不要使添 加剂Y 在阳极上富集
the only real solution not to encounter this problem is to avoid the generation and accumulation of the –Y specie at the anode :
化学品作用Chemical Interaction
• 关键因素：Key Factors
Jetchem
International Co., Ltd.
增加 <Original Additive> 成份可以使槽液成分重 新达到平衡。
• increase <Original Additive>XY concentration can reequilibrate the balance between X-Y and –Y :
阳极的影响Influence of Anode
示意图
Jetchem
International Co., Ltd.
工艺参数和操作：
Process parameters and Operation: • 该系填孔流程用直流电
• Our BVF system is operating with DC current.
International Co., Ltd.
Jetchem
International Co., Ltd.
Jetchem
International Co., Ltd.
Jetchem
International Co., Ltd.
Jetchem
International Co., Ltd.
Jetchem
• 酸铜比列对填孔率有很大影响
• The Copper/Sulfuric Acid ratio is very important to maintain to keep good filling ratio.
工艺参数和操作：
Process parameters and Operation:
• 好的循环对提升填孔率有益
• Bath life with insoluble anodes is greatly increased.
Jetchem
International Co., Ltd.
Jetchem
International Co., Ltd.
Jetchem
International Co., Ltd.
Jetchem
International Co., Ltd.
Jetchem
International Co., Ltd.
Jetchem
International Co., Ltd.
Jetchem
International Co., Ltd.
Jetchem
International 两个不同的增长速度是通过两个不同的添加剂的加速调 节来实现的。 • We can manage two different growth speed is by having two different species (Additive) working as accelerator on the via
Jetchem
International Co., Ltd.
• 电流密度据盲孔开口可以在15-30ASF之 间。
• Operating Current Density is depending on via size (especially width) and can range from 15 to 30 ASF
JETCHEM
JETCHEM(WUXI)CHEMICAL TECHNOLOGIES CO.,LTD.
填孔制程
Blind via Copper Filling
超特（無錫）化學科技有限公司
Jetchem
填孔制程
International Co., Ltd.
Acid Copper Blind via Filling plating Process
the growth of copper deposit is<faster>inside the viathan on the surface
Jetchem
International Co., Ltd.
关键因素：Key Factors
• • 添加剂的含量和性质影响沉积量 The rate of deposition is influenced by the Additive concentration and nature(Brightener).
Jetchem
International Co., Ltd.
机理 Mechanism
• 填孔机制 Mechanism for via filling: • 在不同的电场信号下，不同的地方吸附不同的添 加剂来使铜有不同的沉积速度 • the presence of the –Y species be only in the via, so only be generated at the cathode during the Copper deposition process.This is achieved with proper Carrier material
Jetchem
International Co., Ltd.
机理 Mechanism
• 填孔机制 Mechanism for via filling: • 成份Y 在孔底取代成份X+Y 来实现底部填平。 The reason for the <Bottom Filled-up>mechanism to work is because of the creation, at the cathode, of the <broken form>-Y from the original Additive X-Y which has the power to accelerate more of copper deposition
• With increasing via width (over 120 μm), it is required to increase final copper thickness (up to 30 μm) if we want to achieve dimple \< 5 μm.
• 不溶性阳极会延长槽液寿命
International Co., Ltd.
Jetchem
International Co., Ltd.
Jetchem
International Co., Ltd.
Jetchem
International Co., Ltd.
Jetchem
International Co., Ltd.
Jetchem
Jetchem
International Co., Ltd.
化学品作用Chemical Interaction
• 关键因素：Key Factors • 1，添加剂成份在一定的浓度下，不会在不同电 场处富集，槽液成为一般槽液。if the –Y specie becomes present at the surface of plating bath in general at a certain concentration :
Jetchem
International Co., Ltd.
• Good agitation is required to achieve good filling ratio and low dimple