altium designer summer 09 新一代电子产品开发平台
目录
第一章 概述：...........................................................................................................................1 1．1 关于altium公司：...........................................................................................................1 1．2 给初学altium designer学员的建议： ...........................................................................1 1．3PCB设计的一般流程： ................................................................................................... 2 1．4 软件的特点：..................................................................................................................2 1．4．1 认识altium designer summer 09 界面：.....................................................2 1．4．2altium designer summer09 能做哪些设计： ..................................................3
第三章 元件库的设计.............................................................................................................10 3．1 新建元件库：................................................................................................................10 3．2 原理图封装制作：........................................................................................................12 3．2．1 在原理图封装库内添加元件：.........................................12 3．2．2 绘图工具的使用方法：..................................................................................14 3．2．3 绘制元件的原理图封装符号：......................................................................23 3．2．4 添加原理图封装管脚：..................................................................................23 3．2．5 设置低电平使能管脚符号的方法：..............................................................24 3．2．6 多门封装的制作方法：..................................................................................25 3．2．7 原理图封装制作实例：..................................................................................29 3．3PCB封装制作：............................................................................................................. 34 3．3．1 在PCB封装库内添加元件：..........................................................................34 3．3．2 放置封装焊盘：..............................................................................................36 3．3．3 绘制封装丝印：..............................................................................................39 3．3．4 绘图工具的使用方法：..................................................................................40 3．3．5 绘制元件的 3D封装：.....................................................................................40 3．4 编辑元件封装属性：....................................................................................................54 3．5 编译封装库：................................................................................................................58 3．6 提取现成库内封装或修改库内封装：........................................................................59 3．7 为元件添加SPICE或IBIS仿真模型。..........................................................................60 3．7．1 添加SPICE模型：............................................................................................60 3．7．2 添加IBIS模型：..............................................................................................61
第二章 altium designer summer09 软件的安装说明： ........................................................3 2．1 系统硬件配置要求：..............................................................................................3 2．2 软件安装方法：......................................................................................................4 2．3 注册方法：..............................................................................................................5