ICBGABall Grid ArrayEBGA 680LLBGA 160LPBGA 217L Plastic Ball GridArraySBGA 192LQFP Quad FlatPackageTQFP 100LSBGASC-70 5LSDIPSIPSingle Inline PackageSO Small OutlineTSBGA 680LCLCCCNRCommunicationand NetworkingRiserSpecificationRevision 1.2CPGACeramic Pin GridArrayDIPDual InlinePackagePackageSOJ 32LSOJSOP EIAJTYPE II 14LSOT220SSOP 16LSSOPDIP-tabDual InlinePackage withMetal HeatsinkFBGAFDIPFTO220Flat PackHSOP28ITO220TO18TO220TO247TO264TO3TO5TO52ITO3pJLCCLCCLDCCLGALQFPPCDIPPGAPlastic Pin GridArrayTO71TO72TO78TO8TO92TO93TO99PLCCPQFPPSDIPLQFP 100LMETAL QUAD100LPQFP 100LQFPQuad FlatPackageTSOPThin SmallOutlinePackageTSSOP orTSOP IIThinShrinkOutlinePackageuBGAMicro BallGrid ArrayuBGAMicro BallGrid ArrayZIPZig-ZagInlinePackageTEPBGA 288L TEPBGASOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343C-BendLeadCERQUADCeramicQuad FlatPackCeramicCaseLAMINATECSP 112LChip ScalePackageGull WingLeadsLLP 8LaPCI 32bit 5VPeripheralComponentInterconnectSOT523SOT89SOT89Socket 603FosterLAMINATETCSP 20LChip ScalePackageTO252PCI 64bit3.3VPCMCIAPDIPPLCCSIMM30SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSIMM72TO263/TO268SO DIMMSmall OutlineDual In-lineMemory ModuleSOCKET 370For intel 370 pinPGA Pentium III& Celeron CPUSOCKET 423For intel 423 pinPGA Pentium 4CPUSOCKET462/SOCKET AFor PGA AMDAthlon & DuronCPUSOCKET 7For intel Pentium& MMX PentiumCPUSingleIn-lineSLOT 1For intelPentium IIPentium III& CeleronCPUSLOT AFor AMDAthlon CPUSNAPTKSNAPTKSNAPZPSOHBGABQFP132BGABGABGABGABGACLCCCNRPGADIPDIP-tabBGADIPTOFlat PackHSOP28TOTOJLCCLCCCLCCBGALQFPDIPPGAPLCCPQFPDIPLQFPLQFPPQFPQFPQFPTQFPBGASC-70 5LDIPSIPSOSOHSOJSOJSOPTOSOPSOPCANTOTOTOTO3CANCANCANCANCANTO8TO92CANCANTSOPTSSOP or TSOPBGABGAZIPPCDIPDIM MH88500QUIP NEC7810DBGA BGA EP20K400FC672-3CBGA BGA EP20K300EBC652-3 MODULE LH0084RQFP QFP EPF10KRCDIMM LCC X28C010DIP-BATTERY SRAM SRAMAV/TV CPUAM/FMMPEG RF1 BGA(ball grid array)LSI (PAC) 200 LSI QFP( ) 1.5mm 360 BGA 31mm 0.5mm 304 QFP 40mm BGA QFP Motorola BGA ( ) 1.5mm 225 LSI 500 BGA BGA , Motorola OMPAC GPAC( OMPAC GPAC)2 BQFP(quad flat package with bumper)QFP ( ) ASIC 0.635mm 84 196 ( QFP)3 PGA(butt joint pin grid array)PGA ( PGA)4 C (ceramic)CDIP DIP5 CerdipECL RAM DSP( ) Cerdip EPROM EPROM 2.54mm 8 42 DIP G(G )6 CerquadQFP DSP LSICerquad EPROM QFP 1. 52W QFP 3 5 1.27mm 0.8mm 0.65mm 0. 5mm 0.4mm 32 3687 CLCC(ceramic leaded chip carrier)EPROM EPROM QFJ QFJ G( QFJ)8 COB(chip on board)COB TAB9 DFP(dual flat package)SOP ( SOP)10 DIC(dual in-line ceramic package)DIP( ) ( DIP).11 DIL(dual in-line)DIP ( DIP)12 DIP(dual in-line package)DI P IC LSI 2.5 4mm 6 64 15.2mm 7.52mm 10.16mm skinny DIP slim DIP( DIP) DI P DIP cerdip( cerdip)13 DSO(dual small out-lint)SOP ( SOP)14 DICP(dual tape carrier package)TCP( )TAB( ) LSI 0.5mm LSI EIAJ( ) DICP DTP15 DIP(dual tape carrier package)DTCP ( DTCP)16 FP(flat package)QFP SOP( QFP SOP)17 flip-chipLSI LSI LSI18 FQFP(fine pitch quad flat package)QFP 0.65mm QFP( QFP)19 CPAC(globe top pad array carrier)Motorola BGA ( BGA)20 CQFP(quad fiat package with guard ring)QFP LSI (L ) Motorola 0.5mm 20821 H-(with heat sink)HSOP SOP22 pin grid array(surface mount type)PGA PGA 3.4mm PGA 1.5mm 2.0mm PGA 1.27mm PGA (250 528) LSI23 JLCC(J-leaded chip carrier)J CLCC QFJ ( CLCC QFJ)24 LCC(Leadless chip carrier)IC QFN QFN C( QFN)25 LGA(land grid array)227 (1.27mm ) 447 (2.54mm ) LGA L SI LGA QFP LSI26 LOC(lead on chip)LSI 1mm27 LQFP(low profile quad flat package)QFP 1.4mm QFP QFP28 L QUADQFP 7 8 LSI W3 208 (0.5mm ) 160 (0.65mm ) LSI 1993 1029 MCM(multi-chip module)MCM L MCM C MCM D MCM L MCM C ( ) IC MCM LMCM D ( ) Si Al30 MFP(mini flat package)SOP SSOP ( SOP SSOP)31 MQFP(metric quad flat package)JEDEC( ) QFP 0.65m m 3.8mm 2.0mm QFP( QFP)32 MQUAD(metal quad)Olin QFP 2.5W 2.8W 199333 MSP(mini square package)QFI ( QFI) MSP QFI34 OPMAC(over molded pad array carrier)Motorola BGA ( BGA)35 P (plastic)PDIP DIP36 PAC(pad array carrier)BGA ( BGA)37 PCLP(printed circuit board leadless package)QFN( LCC) ( QFN)0.55mm 0.4mm38 PFPF(plastic flat package)QFP ( QFP) LSI39 PGA(pin grid array)PGA LSI 2.54mm 64 447 64 256 PG A1.27mm PGA( PGA) ( PGA)40 piggy backDIP QFP QFN EPROM41 PLCC(plastic leaded chip carrier)64k DRAM 256kDRAM LSI DLD( ) 1.27mm 18 84 J QFP PLCC LCC( QFN) J ( LCC PC LP P LCC ) 1988 J QFJ QFN( QFJ QFN)42 P LCC(plastic teadless chip carrier)(plastic leaded chip currier)QFJ QFN( LCC) ( QFJ QFN)LSI PLCC P LCC43 QFH(quad flat high package)QFP QFP ( QFP)44 QFI(quad flat I-leaded packgac)I I MSP( MSP) QFP IC Motorola PLL IC 1.27mm 18 6845 QFJ(quad flat J-leaded package)J J 1.27mmQFJ PLCC( PLCC) DR AM ASSP OTP 18 84QFJ CLCC JLCC( CLCC) EPROMEPROM 32 8446 QFN(quad flat non-leaded package)LCC QFN QFP QFP QFP 14 100 LCC QFN 1.27mmQFN 1.27mm 0.65mm 0.5mm LCC PCLC P LCC47 QFP(quad flat package)(L) QFP QFP LSI LSI VTR LSI 1.0mm 0.8 mm 0.65mm 0.5mm 0.4mm 0.3mm 0.65mm 304 0.65mm QFP QFP(FP) QFP QFP(2.0mm 3.6 mm ) LQFP(1.4mm ) TQFP(1.0mm )LSI 0.5mm QFP QFP SQFP VQFP 0.65mm 0.4mm QFP SQFP QFP 0.65mm QFP BQFP( BQFP) GQFP( GQFP) TPQFP( TPQFP) LSI QFP 0.4mm 348 QFP( Gerqa d)48 QFP(FP)(QFP fine pitch)QFP 0.55mm 0.4mm 0.3mm 0.65mm QFP( QFP)49 QIC(quad in-line ceramic package)QFP ( QFP Cerquad)50 QIP(quad in-line plastic package)QFP ( QFP)51 QTCP(quad tape carrier package)TCP T AB ( TAB TCP)52 QTP(quad tape carrier package)1993 4 QTCP ( TCP)53 QUIL(quad in-line)QUIP ( QUIP)54 QUIP(quad in-line package)1.27mm2.5mm DIP 6455 SDIP (shrink dual in-line package)DIP DIP (1.778mm) DIP(2.54 mm)14 90 SH DIP56 SH DIP(shrink dual in-line package)SDIP57 SIL(single in-line)SIP ( SIP) SIL58 SIMM(single in-line memory module)SIMM 2.54mm 30 1.27mm 72SOJ 1 4 DRAM SIMM 30 40 DRAM SIMM59 SIP(single in-line package)2.54mm 2 23 ZIP SIP60 SK DIP(skinny dual in-line package)DIP 7.62mm 2.54mm DIP DIP( DIP)61 SL DIP(slim dual in-line package)DIP 10.16mm 2.54mm DIP DIP62 SMD(surface mount devices)SOP SMD( SOP)63 SO(small out-line)SOP ( SOP)64 SOI(small out-line I-leaded package)I I 1.2 7mm SOP IC( IC) 2665 SOIC(small out-line integrated circuit)SOP ( SOP)66 SOJ(Small Out-Line J-Leaded Package)J J DRAM SRAM LSI DRAM SOJ DRAM SIMM 1.27mm 20 40( SIMM )67 SQL(Small Out-Line L-leaded package)JEDEC( ) SOP ( SOP)68 SONF(Small Out-Line Non-Fin)SOP SOP IC NF(non-fin) ( SOP)69 SOF(small Out-Line package)(L )SOL DFPSOP LSI ASSP 10 40 SOP 1.27mm 8 441.27mm SOP SSOP 1.27mm SOP TSOP( SSOP TSOP) SOP70 SOW (Small Outline Package(Wide-Jype))SOP71 COB(Chip On Board)bonding IC PCB PCB COB Wire BondingMolding (IC Chip) IC (Wire Bonding) (Flip Chip) (Tape Automatic Bonding TAB) I/O72 COG(Chip on Glass)COG(Chip on Glass) (LCD)。