TM
PCC
R&D
2
Presentation Title
Role & Responsibility
- Wistron Case
Function HW (Hardware Design) Responsibility * Hardware is responsible for Electronic Engineering Design * Co-works with S/W and QT to make sure that the every function works well according to spec. * H/W should conduct technical transfer to PE. * H/W should input, update, and maintain the bugs/issues information in the bug tracking system. * Software is responsible for the design of BIOS, Driver, Utilities, and S/W Preload. * S/W co-works with H/W and QT to make sure that every function works well according to the specification. * S/W has to release the SCD and the Cert. Team Document. * S/W should conduct technical transfer to TE. * S/W has to input/update/maintain the bugs/issues information in the bug tracking system. * ID/ME is responsible for Mechanical Engineering, Thermal and Packing designs. * ID/ME should conduct technical transfer to PME. * ID/ME should input, update, and maintain the bugs/issues information in the bug tracking system used.
1பைடு நூலகம்
Presentation Title
Role & Responsibility
- Wistron Case
Function PM Responsibility 產品經理 - Product Manager (或計畫專案經理 - Project Manager) 為所 負責計畫或產品線成敗之總負責人, 將依產品線之性質指定專人負責某類 產品,必須對所負責產品線專業領域之發展及行銷雙方面皆有相當程度的 了解. 並依照產品之條件及市場狀況,做適當的運用,訂定技術或產品市場 競爭策略,並在適當的時機推出適當之技術或產品. TM is responsible to coordinate technical issues conflict among HW, SW, ID and ME and decision-making. TM has to handle all project technical issues. 為規劃推廣、連絡及控制專案進行的負責人, 掌握專案進行之情況以協助 處理異常狀況, 使新產品能順暢切入工廠且如期推出, 以提高產品競爭力. 協助 R&D RELEASE 開發階段 BOM CHANGE NOTICE. R&D 包括電子部門及工業設計部門,若只寫 HW (Hardware Design) 則指 電子部門,若只寫 ID (INDUSTRIAL DESIGN) 則指工業設計部門; 包括ME, Thermal, Packing design. 若只寫 SW (Software design) 則指軟體設 計部門有負責 BIOS, Driver 及 Pre-load 不同工作性質之軟體開發功能. R&D 人員負責產品之開發、設計、測試規劃，包括 H/W、S/W及ID的開發、 設計、提出新發明及著作權揭露書.
SW (Software Design)
ID/ME (Industrial Design/ Mechanical Engineering)
3
Presentation Title
Role & Responsibility
- Wistron Case
Function PA (EMI/Safety, QT, CE/Reliability, PCB, OS Certification) EMC/Safety Responsibility 為產品保證暨開發支援 Function 之總稱 , 主要負責根據 MRS/PES 執行各 項 產 品 之 測 試 , 諸 如 EMC/Safety : REGULATORY TEST , CE : RELIABILITY TEST 及 KEY COMPONENT APPROVAL , PCB : PCB LAYOUT, DC : BOM , OS : OS 認證 etc;… All products to meet EMC/Safety requirements and guarantee the legality in the international marketing. 申請產品之安規、測試、 Debug.. 為 R&D 轄 下 所 屬 之 測 試 單 位 人 員 , 主 要 負 責 各 項 產 品 之 測 試 , 諸 如 COMPATIBILITY TEST, SOFTWARE TEST, S/W PRELOAD TEST, DIAGNOSTIC PROGRAM TEST ,ETC., 組件承認測試、不良品故障分析及其他附件等材料品質之管制及保證 產品相關之可靠度與環境實驗，以及可靠度工程之研究與制定. PCB Layout之申請、PCB之設計、Orcad library & Mentor library的建 立與管理. 信號品質CAE分析, PCB layout外包廠商之管理，PCB製造廠商之管理. 執行公司各產品之 OS 相容性認證測試及 LOGO 申請. O.S. Beta Site 測試
SQM (Supplier Quality Management) GCSD
FI
5
Legal Presentation Title
Role & Responsibility
- Wistron Case
Function
CFE
Responsibility
CFE acts on behalf of Wistron global manufacturing operation to deal with the customer, and also acts as a representative of the customer when dealing with internal Wistron teams. Based on the C4/C5 checklist, related reports and project status, CFE is responsible to conclude the exit judgment (Ready or Not ready) during C4/C5 Exit meetings to determine whether a product can move on to PD pilot run/MP or not
C-System Introduction will cover
• Role & Responsibility (R&R) • Process
– Cx Stage: • C0: Proposal phase 構想階段 • C1: Planning phase 規劃階段 • C2: R&D Design phase 設計階段 • C3: Lab Pilot Run phase 樣品試作階段 • C4: Eng Pilot Run phase 工程試作階段 • C5: PD Pilot Run phase 試產階段 • C6: Mass Production phase 量產階段
QT
CE/Reliability PCB
OS Certification
PDM
4 Presentation Title
料號編碼及控管,BOM製作
Role & Responsibility
- Wistron Case
Function AM (Account Manager) MM (Material Management) Responsibility 1.爭取訂單與客戶合約協商. 2.協調產品SPEC.工程變更 SAMPLE APPROVAL. 3.適時反應市場需求與趨勢. 1.MM is responsible for new supplier development, parts purchasing 2.Controlling mechanical tooling status including the schedule, capacity, parts readiness, concerns 3.Manage the dependencies, long lead-time items. 4.MM also co-works with SQM and CE for component quality improvement and the key component QVL final version * 零件品質管理及參與分包商之評鑑/管理 (SQRC Plan/Status) * 負責異常材料分析、追蹤與改善. * 負責進行產品 QVL CANDIDATE APPROVAL 作業系統 AT mfg. 1.開發及推動全球客戶服務及支援計劃. 2.各項售後服務及支援作業. 3.參與 Field 品質改善作業 (EWG) 負責評估 Project Cost , 決定 Project 是否可行以及 Project 所花費之 Cost. 合約及專利審核