metal cosmetic defect cosmetic inspect defective to staking defective-products deficient manufacturing procedure deficient purchase discoloration easily damaged parts excesssive gap scratch mixed color painting peel off poor processing lack of painting lots of production manufacture procedure reverse angle = chamfer to storage delivery deadline delivery, to deliver monitor horizontal frequency brightness contrast resultion respones time front bezel rear bezel stand base contral key panel lift swivel pivot tilt motherboard Platform development plan DVT(SDV) DVT design Schematic design Schematic check Placement Placement check
中文对照名 Chinese Name Contrasted 英文全称 Full Description Item/Content 分类/部件 System board 系统主板 芯片组 Chipset 处理器 Processor 内存 memory 内存插槽数 DIMM slot I/O Ports 接口 串行口 COM port 并行口 Parallel port 主机前面板USB接口 Front USB port 主机后面板USB接口 Rear USB port 其它位置USB接口 Other USB port PS/2接口 PS/2 port 前置Audio Front Audio 后置Audio Rear Audio Graphics Processor 图形处理器 显示卡 Graphics Card Drive Disk 驱动器 硬盘 Hard Drives 光盘驱动器 Optical Drives 软盘驱动器 Floppy Drives Other components 其他部件 声卡 Sound 网卡 Ethernet 无线网卡 WLAN card 调制解调器 Modem 鼠标 Mouse 键盘 Keyboard 耳麦 MIC 音箱 Speakers 机箱结构 Form Factor 电视卡 TV card 读卡器 Media card reader Extended Slots Count 扩展槽数量 最大插卡数量 Slots Total Count AGP AGP ISA ISA PCI PCI PCI Express*16 PCI Express*16 PCI Express*1 PCI Express*1 AMR AMR Bays 驱动器托架
Layout Layout check DVT design close meeting DVT layout modify&gerber out Creat BOM v0.1 BOM check DVT PCB return DVT assemble First samples shipping(5~10pcs) PCB test Designer decided Supplier DVT test Reliability test Compatibility test Signal test EMC test BIOS fuctiong test DVT samples shipping(100pcs) DVT test(SDV) EVT(SIT) EVT design Schematic design Placement&Layout Design check EVT design close meeting DVT design modify&Gerbor out Creat BOM v1.0 BOM check EVT PCB return EVT assemble Supplier EVT test EVT samples shipping(250~350pcs) EVT test(SIT) PCB Confirm Test Electronic signal test Bug Fix PCB verification report perpare MVT order MVT design&check(TBD) MVT PCB return MVT plan MVT assemble MVT test MVT samples Shipping Manufacturer kickoff
system project kick off ID mock-up checkpoint(look and feel) ME mock-up chechpoint planning checkpoint design checkpoint system sample test function sample checkpoint system bath test test report publishied engineering checkpoint mechanical drawing color chip rendering 3D surfacing structure design ID mock-up ME mock-up function sample tooling thermal noise check die(mould) repair die(mould) concave convex gauge(or jig) location lump, locating piece, block stop bezel panel chassis HDD tray back panel I/0 baffle bolt spray-paint plate silk-screen bronzing polishing sand blasting polishing/surface processing plastic
批量测试 Logo文件提供 主板开发评审会 文件发布 应用 公板阶段 老应用测试－公板 BIOS标准测试（不包含联想双模规格） 标准的liunix测试 windows安装测试 应用确认测试 一键恢复 数码家电（LEOS） 一键杀毒 驱动/应用自动安装 文件管理 系统自修复 Bug 统计 在公板上开发 LEOS内核开发 新DM开发 提供Alpha（样品评测阶段）版本 Alpha1测试 Alpha1 Bug 修改 第一轮质评（Beta1测试） 第三次系统测试－－第一次预封样 封样 测试 模块功能验证 跨品牌配置中心 并行产品设计流程 加拿大标准协会 用户仿真可靠性测试 决策检查点 设计方案更改请求 工程（方案）更改 电子工业协会 产品早期寿命执行性能 电磁兼容性 工程维护有效性测试 静电释放措施 环境压力分析 联邦通讯委员会 如期上市有效性 保护频带
金属 外观不良 外观检查 铆合不良 不良品 制程不良 来料不良 异色 易损件 间隙過大 刮傷 雜色 掉漆 制程不良 烤漆不良 生產批量 制程 倒角 入庫 交货期 交货 显示器 行频 亮度 对比度 分辨率 响应时间 前框 后壳 支架 底座 按键 液晶屏 升降 旋转 垂直转 倾斜 主板 平台开发计划 设计样品测试 DVT设计 主板电路原理图设计 主板原理图审核 布局 布局检查
Batch test Logo file apply project close meeting Documents published SW application CRB Phasis Old App Version Test on new CRB BIOS Test Without DM Stantard Linux Test Windows Install Test App Verification Test One key recover LEOS DMP One key Antivirus Driver & Application Auto-installation File Management System Self-Recover BUG Summary App New Version Develop on CRB LEOS Kernel Update DM New Version Develop Alpha Version provided Alpha 1 Test Alpha 1 BUG Summary and Fixed System Test 1 --Beta 1 System Test 3 -- RC 1 App Development Finished test Building Block Functional Validation Cross Brand Configuration Center Concurrent Product Design (process) Canadian Standards Association Customer Simulated Reliability Testing Decision Checkpoint Design Change Request Engineering Change Electronics Industry Association Early Life Performance Electromagnetic Compatibility Engineering Maintenance Effectiveness Test Electro Static Discharge Environmental Stress Analysis Federal Communication Commission General Availability Guardband