Sputtering/Plating process
• Roughness of Microflex
Sputtering/Plating process
• Initial peel strength of substrates with tiecoat metal
Peeling Strength（lb/in） Tiecoat（Thickness） 5µm copper Microflex（100Å） Cr（150Å） NiCr（100Å） NiCr（200Å） Monel（100Å） None 5.2 4.5 4.0 4.6 4.2 2.4 12µm copper 6.5 5.7 5.1 6.0 5.3 2.8
Sputtering/Plating process
•Structure of sputtering 2-layer
Plating Cu 2~8um Sputter Seed Layer 0.1~0.4um Sputter tie layer PI 35um (25um) 5nm~50nm
Carrier Film
Etching
Developing
Introduction of FPC
• Structure
Introduction of FPC
• Quick Press
Introduction of FPC
• Application
Introduction of FPC
• Application
應用於照相頭
Sputtering/Plating process
• Peel strength after thermal aging in air at 150℃
7 6 Peel(lb/in) 5 4 3 2 1 0 0 25 50 Time(hours) 75 100
Microflex（100Å）
NiCr（200Å） Cr（150Å） NiCr（100Å） Monel（100Å） None
Introduction of FPC
• Material
FCCL (3-layer) Coverlayer
FCCL (2-layer) PI film Adhesive Copper foil
Introduction of FPC
• Process
Laminating
Stripping
UV Exposure
1’st layer PAA coating
PAA
Drying heater
Cu Foil
UW RW
TPAA
2’nd layer TPAA coating
Drying heater
Cu Foil
UW RW
Future Development
• PSPI
感光性聚 亞醯胺系
材 料 種 類
非感光性聚 亞醯胺系 自身感光性 環氧系 自身感光性壓 克力系
Sputtering 2-layer(PSTC1081) of Microcosm
• Peel strength
IPC-TM650.2.4.9。
k g f/ c m 1 . 2
0.9 0.6 0.3 0 原始拉力 Sa m p l e 1 0.98 Sa m p l e 2 0.95 Sa m p l e 3 0.98 Sa m p l e 4 0.94 Sa m p l e 5 0.99 AVE 0.96
․Peel Strength Reliability
(kgf/ c m)
0.6 0.5 0.4 0.3 0.2 0.1 0 PC T TC T HT A
Test Item PCT: pressure cooker test TCT: thermal cycle test HTA: High temperature aging
Sputtering 2-layer(PSTC1081) of Microcosm
․Ionmigration Test Pitch:30um
10 8
>
1010 hrs(全部測試時間:1010小時)
Log(R)
6
4
2 3 0 u m P itc h 0 0 100 200 300 400 500 600 700 800 900 1000 1100 M icrocosm T-Com any Tim e(H r)
0.036 0.035
0.46 0.36
Sputtering 2-layer(PSTC1081) of Microcosm
• IPC Test
Sputtering 2-layer(PSTC1081) of Microcosm
• MIT Test
Sputtering 2-layer(PSTC1081) of Microcosm
A B ′ − AB C D ′ − CD + AB CD × 100 % 2
Sample 1
Sample 2
Sample 3
Sample 4
Sample 5
Sample 6
AVE 0.047 0.037
TD (%) MD (%)
0.053 0.038
0.055 0.043
0.049 0.036
0.041 0.034
材料耐熱性
Future Develoቤተ መጻሕፍቲ ባይዱment
• Heat Conduction Dielectric Layer
軟性印刷電路板的應用及發展趨勢
演講人 : 張漢茂 E-mail : hunschang@
律勝科技股份有限公司
（MICROCOSM TECHNOLOGY CO.,LTD）
Contents
．Introduction of FPC
(I). Material (II). Process (III). Application
Cu Foil
UW
RW
Casting process
• Thermal imidization
Temp.
Polyimide
Time
Polyamic acid varnish
-H2O
Casting process
• Monomer
Dianhydride / Diamine = 1 PMDA + BPDA > 60wt% dianhydride PDA > 50wt% diamine
• Hinge of clamshell mobile phone
Multi-Flex with 5 layers
Category 2-layer 3-layer (standard RA)
Item no. PSTI 0912
FCCL Structure ½ oz RA Cu Single sided ½ mil PI ½ oz RA Cu Single sided ½ mil PI
．Introduction of Polyimide
(I). Sputtering/Plating process (II). Casting process (III). Lamination process
．Future Development
․Introduction of FPC ․Introduction of Polyimide
Sample 5 Sample 6 Sample 7 Sample 8
1.0009E+15Ω 1.2865E+16Ω 5.4538E+15Ω 1.8551E+16Ω
Sputtering 2-layer(PSTC1081) of Microcosm
• Dimensional stability
IPC-FC-241/2 CLASS1 Method B。
• Crystal orientation of copper foil
Casting process
• Crystal orientation of copper foil
Casting process
• Compare with ED and RA
資料來源：三井金屬
Casting 2-layer of Microcosm
Coverlay ½ mil PI 15 um AD ½ mil PI 15um AD
Cycles 150~160 K 50~60K
PSBR1209
Lamination process
• Compare PI & TPI
差異性 種類 單體 價格
高分子結構
加工性
耐熱性
PI
O N
O C C O O
O C N C O CF3 C CF3
Testing condition:85℃ / 85%RH / 60V
Sputtering 2-layer(PSTC1081) of Microcosm
․Smaller pitch line without side etching
30um Pitch Circuit：
45um Pitch Circuit：
Lamination process
• Process introduction-Film type
Heat Pressure Roll
Cu
Pre-heating Annealing
TPI
UW
Cu
W-helical Roller
RW
Lamination process
• Process introduction-Casting Type
Condition 120℃ .85%RH . 1 & 7atm .100Hr - 40℃ & 85℃. Steady Temperature. 50cycle 160℃. 24Hr