SMD常用术语微组装技术﹕MPT/MicroelectronicPackagingechnology 混装技术﹕MixedComponentMountingTechnology封装﹕Package贴片﹕PickandPlace拆焊﹕Desoldering再流﹕Reflow浸焊﹕DipSoldering拖焊﹕Dragsoldering印制电路﹕PrintedCircuit印制线路﹕PrintedWiring印制电路板﹕printedcircuitboard印制线路板﹕printedwiringboard层压板﹕laminate覆铜薄层压板﹕copper-cladlaminate基材﹕basematerial成品板﹕productionboard印刷﹕printing导电图形﹕conductivepattern印制组件﹕printedcomponent单面印制板﹕single-sidedprintedboard 双面印制板﹕double-sidedprintedboard 多层印制板﹕multilayerprintedboard 电烙铁﹕Iron热风嘴﹕hotairreflowingnoozle吸锡带﹕solderingwick吸锡器﹕tinextractor焊后检验﹕post-solderinginspection目视检验﹕visualinspection机器检验﹕machineinspection焊点质量﹕solderingjointquality焊电缺陷﹕solderingjontdefect错焊﹕solderwrong漏焊﹕solderskips虚焊﹕pseudosoldering冷焊﹕coldsoldering桥焊﹕solderbridge脱焊﹕opensoldering焊点剥离﹕solderoff不润湿焊点﹕solderingnonwetting锡珠﹕solderball拉尖﹕icicle；solderprojection孔洞﹕void焊料爬越﹕solderwicking过热焊点﹕overheatedsolderconnection不饱和焊点﹕insufficientsolderconnection过量焊点﹕excesssolderconnection微组装技术﹕MPT/MicroelectronicPackagingechnology 混装技术﹕MixedComponentMountingTechnology封装﹕Package贴片﹕PickandPlace拆焊﹕Desoldering再流﹕Reflow浸焊﹕DipSoldering拖焊﹕Dragsoldering印制电路﹕PrintedCircuit印制线路﹕PrintedWiring印制电路板﹕printedcircuitboard印制线路板﹕printedwiringboard层压板﹕laminate覆铜薄层压板﹕copper-cladlaminate基材﹕basematerial成品板﹕productionboard印刷﹕printing导电图形﹕conductivepattern印制组件﹕printedcomponent单面印制板﹕single-sidedprintedboard 双面印制板﹕double-sidedprintedboard 多层印制板﹕multilayerprintedboard 电烙铁﹕Iron热风嘴﹕hotairreflowingnoozle吸锡带﹕solderingwick吸锡器﹕tinextractor焊后检验﹕post-solderinginspection目视检验﹕visualinspection机器检验﹕machineinspection焊点质量﹕solderingjointquality焊电缺陷﹕solderingjontdefect错焊﹕solderwrong漏焊﹕solderskips虚焊﹕pseudosoldering冷焊﹕coldsoldering桥焊﹕solderbridge脱焊﹕opensoldering焊点剥离﹕solderoff不润湿焊点﹕solderingnonwetting锡珠﹕solderball拉尖﹕icicle；solderprojection孔洞﹕void焊料爬越﹕solderwicking过热焊点﹕overheatedsolderconnection不饱和焊点﹕insufficientsolderconnection过量焊点﹕excesssolderconnection助焊剂剩余﹕fluxresidue焊料裂纹﹕soldercrazeing焊角翘起﹕fillet-lifting；lift-offAI:Auto-Insertion自动插件AQL:acceptablequalitylevel允收水平ATE:automatictestequipment自动测试ATM:atmosphere气压BGA:ballgridarray球形矩阵CCD:chargecoupleddevice监视连接组件(摄影机) CLCC:Ceramicleadlesschipcarrier陶瓷引脚载具COB:chip-on-board芯片直接贴附在电路板上cps:centipoises(黏度单位)百分之一CSB:chipscaleballgridarray芯片尺寸BGACSP:chipscalepackage芯片尺寸构装CTE:coefficientofthermalexpansion热膨胀系数DIP:dualin-linepackage双内线包装(泛指手插组件)FPT:finepitchtechnology微间距技术FR-4:flame-retardantsubstrate玻璃纤维胶片(用来制作PCB材质) IC:integratecircuit集成电路IR:infra-red红外线Kpa:kilopascals(压力单位)LCC:leadlesschipcarrier引脚式芯片承载器MCM:multi-chipmodule多层芯片模块MELF:metalelectrodeface二极管MQFP:metalizedQFP金属四方扁平封装NEPCON:NationalElectronicPackageand ProductionConference国际电子包装及生产会议ppm:partspermillion指每百万PAD(点)有多少个不良PAD(点) psi:pounds/inch2磅/英寸2PWB:printedwiringboard电路板QFP:quadflatpackage四边平坦封装SIP:singlein-linepackageSIR:surfaceinsulationresistance绝缘阻抗SMC:SurfaceMountComponent表面黏着组件SMD:SurfaceMountDevice表面黏着组件SMEMA:SurfaceMountEquipment ManufacturersAssociation表面黏着设备制造协会SMT:surfacemounttechnology表面黏着技术SOIC:smalloutlineintegratedcircuitSOJ:smallout-linej-leadedpackageSOP:smallout-linepackage小外型封装SOT:smalloutlinetransistor晶体管SPC:statisticalprocesscontrol统计过程控制SSOP:shrinksmalloutlinepackage收缩型小外形封装TAB:tapeautomaticedbonding带状自动结合TCE:thermalcoefficientofexpansion膨胀(因热)系数Tg:glasstransitiontemperature玻璃转换温度THD:Throughholedevice须穿过洞之组件(贯穿孔) TQFP:tapequadflatpackage带状四方平坦封装UV:ultraviolet紫外线uBGA:microBGA微小球型矩阵cBGA:ceramicBGA陶瓷球型矩阵PTHlatedThruHole导通孔IAInformationAppliance信息家电产品MESH网目OXIDE氧化物FLUX助焊剂LGA(LandGridArry)封装技术LGA封装不需植球，适合轻薄短小产品应用。

TCP(TapeCarrierPackage)ACFAnisotropicConductiveFilm异方性导电胶膜制程Soldermask防焊漆SolderingIron烙铁Solderballs锡球SolderSplash锡渣SolderSkips漏焊Throughhole贯穿孔Touchup补焊Briding穚接(短路)SolderWires焊锡线SolderBars锡棒GreenStrength未固化强度(红胶)TransterPressure转印压力(印刷)ScreenPrinting刮刀式印刷SolderPowder锡颗粒Wettengability润湿能力Viscosity黏度Solderability焊锡性Applicability使用性Flipchip覆晶DepanelingMachine组装电路板切割机SolderRecoverySystem锡料回收再使用系统WireWelder主机板补线机X-RayMulti-layerInspectionSystemX-Ray孔偏检查机BGAOpen/ShortX-RayInspectionMachineBGAX-Ray检测机PrepregCopperFoilSheeterP.P.铜箔裁切机FlexCircuitConnections软性排线焊接机LCDReworkStation液晶显示器修护机BatteryElectroWelder电池电极焊接机PCMCIACardWelderPCMCIA卡连接器焊接LaserDiode半导体雷射IonLasers离子雷射Nd:YAGLaser石榴石雷射DPSSLasers半导体激发固态雷射UltrafastLaserSystem超快雷射系统MLCCEquipment积层组件生产设备GreenTapeCaster,Coater薄带成型机ISOStaticLaminator积层组件均压机GreenTapeCutter组件切割机ChipTerminator积层组件端银机MLCCTester积层电容测试机ComponentsVisionInspectionSystem芯片组件外观检查机。