电子生产线作业指导书
• Final test – 产品测试(功能性)
A BOARD (TOP)
INST.
W/S
POST SOLDER
PRE B/I TEST
• Packing – 产品包装作业
HANDLING
B BOARD (BOTTOM)
INST.
W/S
POST SOLDER
PRE B/I TEST
B/I (ESS)
Speed: 1.65 ~ 2.00 sec/pcs
SMT 生产程序
Jobname: 18193r3/18193r3
Side: TOP Units: 10 Micro-meters
Date: Fri Aug 8
CD PN OR
X
Y
BX
BY
SD
MT
------------------------------------------------------------------------------------------------------------------------------------------------------
•允收(Acceptable) (1) 零件接着面在焊垫范围内,且50%以上
脚宽位于锡垫范围内。
•拒收(Rejected) (1) 焊锡未全部充满于零件接着面与焊垫上,
且零件50%以上脚宽超出焊垫范围。
SMT 检验标准
PreferredFra bibliotekAcceptable
SMT制程控制流程
表面黏着制造流程
•制程变异监控 •修正措施施行
电子产品与制程趋势
电子产品
PCB 基板 (Printed Circuit Board)
SMT 电子零件
电子构装组织模型
表面黏着制程 (Surface Mount Technology)
SMT
FORM ING
SMT
FORM ING
SMT
FORM ING
电子产品生产制程 (PCBA) • Final ass’s – 产品组装作业
作业指导书 (Working Instruction)
作业指导书类型
作业指导书乃用于指导作业员从事加工/组装作业程 序之文件,作业员须依据此文件进行作业。
电子业作业指导书一般包含:
DIP
TYPE III
Glue dot
Chip Components DIPs
Chip Components
SMT 生产作业网络
SMT 生产线布置
High Speed Chip Shooter - Fuji
Speed: 0.09 ~ 0.45 sec/pcs
Multi-purple chip shooter - Fuji
电子生产线作业指导书
电子产品与制程趋势
多重应用功能(Multi-purpose Applications) 携带式与缩小化(Portable and Miniature)
. Mobile phone . PDA . Notebook …
可制性(Manufacturability) 构装自动化 (Automation in Assembly Process) 重复性与再现性(Repeatability and Reliability) 生产力与及时供货能力(Time to Market) 效率(Efficiency)
FINAL ASS'Y
FINAL TEST
PACK ING
POST B/I TEST
HANDLING
SUB ASS'Y
SHIP
C BOARD (OPTIONAL)
INST.
W/S
POST SOLDER
Terms: • SMT – 表面黏着技术(制程) • Forming – 零件成型 • INST. – 人工插件 (Insertion) • W/S - 波焊制程 (Wave soldering) • Post solder – 接接后作业 (Such as touch-up, rework) • B/I – 烧机测试 (Burn-in)
37,CRS1011J1M,R17,-6827,5732,90, 57,CTRRMPP01M,Q4, 195,12410,90, 21,CICA07474M,U1,-8338,12641,
零件黏贴
Ball screw
基版
传感器
送料器
取置头
焊性检验标准 (IPC STANDARDS) •标准(Preferred) (1) 零件脚位于焊垫中央。 (2) 零件端点与焊垫间皆充满足够的焊锡, 且呈平滑圆弧形。 (3) 零件脚与焊接面平贴于焊垫上。
R17
2
90
-6827 5732 -6727
5732
TOP
S
Q4
3
90
195 12410 195 12410 TOP
S
U1
16 180
-8338 12641 -8338 12641 TOP
S
.
.
.
ACM FILE CONTENT
Device No. Part NO
X- axis
Y-axis
Orientation
SMT生产线影像-1
SMT生产线影像-2
手焊与修检站
人工插件生产线
TYPE I
Solder paste SMT Complex FPT Simple
TYPE II
Spoaldsteer
电子构装类型 PLCC
Chip Components
SOIC
PLCC
Chip Components
SOIC
SMT制程缺点与修护成本趋势
FUJI
MPM
Screen Printer AOI system High-speed Chip shooter
Multi-purpose Chip shooter
Reflow oven
制程缺点 50% ~70%
修护成本/缺点
SMT 生产线布置
MPM
LOADER
MPM UP2000
Screen printer
FUJI
GL-541
Glue dispenser
FCP-642 1.6M GATE
FIP-III
1M C/V
High-speed placer
Multi-purpose places
KOKI REFLOW
Reflow Oven
1M C/V UNLOADER
Line Layouts: • 1 x High-speed + 1 x Multi-purpose • 2 x High-speed + 1 x Multi-purpose • 2 x High-speed + 2 x Multi-purpose