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韩国科技公司英文简介PPT模板CompanyProfile
> COMPANY NAME : Sekwang Technologies Co.,Ltd.
> PRESIDENT
: D. W. Kim (金東佑)
> ESTABLISHMENT : 20.JAN.1995
> CORPORATION REGISTERED No. : 184511-0026557
> EMPLOYEES
FACTORY BUNDANG
OFFICE (SEOUL)
HONG KONG BRANCH
SHENZHEN BRANCH (CHINA)
351, BUKJUNG DONG, YANGSAN,KYUNGNAM KOREA
8F MIDO PLAZA BLDG, #158 GEUMGOK-DONG, BUNDANG-GU, SEONGNAM-SI, GYEONGGI-DO KOREA.
2) Innovative Technical (INNO-BIZ) Company Certificate - Small and Medium Business Administration
3) Certificate of Registration - TQCS International (Group) Pty Ltd.
SEKWANG TECHNOLOGIES CO., LTD
5p
4. ORGANIZATION
SEKWANG TECHNOLOGIES CO., LTD
6p
5. CERTIFICATION
1) Environment Management System Certificate - KMA Registrations & Assessments Inc.
1999. JAN. Established Panel Line Equipment manufacturing factory for STN LCD line. (Pol Attach M/C, Scribe M/c. Break M/C, End Seal M/C, LC Cleaning M/C, LC Filling M/C)
2004. JUN. Developed IN LINE FOG Bonding M/C. MAY. Acquired ISO-9001 Certificate for LCD Equipment & LCD BLU Assembly. FEB. Developed IN LINE COG Bonding M/C.
SUZHOU BRANCH (CHINA)
YING XIANG HUA YUAN 3 –1401ROOM XINGHAI STREET SUZHOU CHINA
86-512-6763-4211
FAX 82-55-372-3154 82-31-716-6416
852-2997-7588
MOBILE PHONE
SEKWANG TECHNOLOGIES CO., LTD
4p
3. COMPANY HISTORY
2006. OCT. OCT. JUL.
MAY.
Developed FPC Cutting M/C Developed Auto Pol Attach M/C Developed Auto Trace Tester ( 3.5 SEC) Start to Develop Middle size(3”~7”) COG+FOG bonding M/C (Tact time 3.9sec) ( Planed to finish within Oct.)
COMPANY PROFILE
2006. 07
“ High Technology for Display Devices ”
INDEX
1. OFFICE AND ADDRESS 2. COMPANY PROFILE 3. COMPANY HISTORY 4. ORGANIZATION 5. CERTIFICATION 6. DEALING ITEM
END SEAL, COG INSPECTION M/C, FPC CUTTING M/C, INLINE AUTO COG/FOG BONDING M/C
- LCD MODULE ASSEMBLY PRODUCTS : Design, Assembling & Sales For BACK LIGHT MODULE
BackNOLOGIES CO., LTD
7p
6-1. MODULE ASS’Y PRODUCT
> COG (Chip on Glass)
- It is most cost effective design. And it makes a module thinner and lighter. - It need a larger contact edge of the LCD glass and protection against IR-light. - It is useful for LCD modules in mobile phone and MP3 application.
6-1. MODULE ASS’Y 6-2. LCD ASS’Y MACHINE
7. FACTORY APPEARANCE 8. LOCATION
SEKWANG TECHNOLOGIES CO., LTD
2p
1. OFFICE AND ADDRESS
OFFICE
ADDRESS
TEL
HEAD OFFICE &
2003. JUN. Developed Camera Module Bonding M/C For SAMSUNG TECHWIN. FEB. Establish R & D Center at YANGSAN Factory
2002. JAN. Move to YANGSAN New Factory
M/C for Panel (POL Attach M/C, End seal M/C , Hot press, Scribe M/C, Break M/C. Seal Cure Oven, LC Filling M/C, POL Cutting M/C,)
LCD Module Ass,y Product
6) The R&D Center Certificate - Korea Industrial Technology Association
7) Certificate - Gyeongnam Export Center, SMBA.
SEKWANG TECHNOLOGIES CO., LTD
13p
2005. AUG. JUL. JUN.
MAR.
Developed Semi Auto COF Bonding M/C. (Tact time 6.5sec) Developed Loading & Cleaning M/C. Developed Auto Trace Tester. Patent Application about In Line type COG+FOG Bonding M/C. Delivered In Line type COG+FOG Bonding M/C. (Tact time 4.5sec)
ROOM10, 6F., WAH SHING IND.CENTRE, 11-13 SHING YIP STREET,KWUN TONG, KOWLOON,HONG KONG.
82-55-372-3151~3 82-31-713-5710 852-2997-7176~8 86-755-2609-7641
1998. AUG. Establish Module Line Equipment manufacturing factory for STN LCD line. (TCP Bonder. ACF M/C, COG M/C, COF M/C, TAB cutting M/C, Hot Bar M/C, Clean booth)
Start to Develop auto Pol attach M/C. (3.5sec) ( Planed to finish within Sep.) APR. Start to Develop small size(1”~4”) COG+FOG bonding M/C (Tact time 3.5sec) ( Planed to finish within Sep.) MAR. Acquired ISO14001:2004 Certificate for LCD Equipment & LCD BLU assembly.
: 130
> CAPITAL
: USD 800,000
> ADDRESS
: 351, Bukjung Dong, Yangsan, Kyungnam,Korea
TEL) 055-372-3151~3. FAX) 055-372-3154
E-MAIL) sktech@sklcd.co.kr
> PLANT SIZE
4) Export Prospective Company Certificate - The Centre of Supporting Kyoungnam Regional Small and Medium Company
5) Certificate of Venture Business - Kyoungnam Regional Small and Medium Business Administration
SEKWANG TECHNOLOGIES CO., LTD
5p
3. COMPANY HISTORY
1996. MAR. Make a Representative Agreement with PUCKA for FPCB. Start to Assembly Back Light(640*480) for Large size of Colour STN Module.