LED照明专业术语中英文对照1 backplane 背板2 Band gap voltage reference 带隙电压参考3 benchtop supply 工作台电源4 Block Diagram 方块图5 Bode Plot 波特图6 Bootstrap 自举7 Bottom FET Bottom FET8 bucket capcitor 桶形电容9 chassis 机架10 Combi-sense Combi-sense11 constant current source 恒流源12 Core Sataration 铁芯饱和13 crossover frequency 交叉频率14 current ripple 纹波电流15 Cycle by Cycle 逐周期16 cycle skipping 周期跳步17 Dead Time 死区时间18 DIE Temperature 核心温度19 Disable 非使能，无效，禁用，关断20 dominant pole 主极点21 Enable 使能，有效，启用22 ESD Rating ESD额定值23 Evaluation Board 评估板24 Exceeding the specifications below may result in perman ent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characte ristics section is not implied.超过下面的规格使用可能引起永久的设备损害或设备故障。

建议不要工作在电特性表规定的参数范围以外。

25 Failling edge 下降沿26 figure of merit 品质因数27 float charge voltage 浮充电压28 flyback power stage 反驰式功率级29 forward voltage drop 前向压降30 free-running 自由运行31 Freewheel diode 续流二极管32 Full load 满负载33 gate drive 栅极驱动34 gate drive stage 栅极驱动级35 gerber plot Gerber 图36 ground plane 接地层37 Henry 电感单位：亨利38 Human Body Model 人体模式39 Hysteresis 滞回40 inrush current 涌入电流41 Inverting 反相42 jittery 抖动43 Junction 结点44 Kelvin connection 开尔文连接45 Lead Frame 引脚框架46 Lead Free 无铅47 level-shift 电平移动48 Line regulation 电源调整率49 load regulation 负载调整率50 Lot Number 批号51 Low Dropout 低压差52 Miller 密勒53 node 节点54 Non-Inverting 非反相55 novel 新颖的56 off state 关断状态57 Operating supply voltage 电源工作电压58 out drive stage 输出驱动级59 Out of Phase 异相60 Part Number 产品型号61 pass transistor pass transistor62 P-channel MOSFET P沟道MOSFET63 Phase margin 相位裕度64 Phase Node 开关节点65 portable electronics 便携式电子设备66 power down 掉电67 Power Good 电源正常68 Power Groud 功率地69 Power Save Mode 节电模式70 Power up 上电71 pull down 下拉72 pull up 上拉73 Pulse by Pulse 逐脉冲（Pulse by Pulse）74 push pull converter 推挽转换器75 ramp down 斜降76 ramp up 斜升77 redundant diode 冗余二极管78 resistive divider 电阻分压器79 ringing 振铃80 ripple current 纹波电流81 rising edge 上升沿82 sense resistor 检测电阻83 Sequenced Power Supplys 序列电源84 shoot-through 直通，同时导通85 stray inductances. 杂散电感86 sub-circuit 子电路87 substrate 基板88 Telecom 电信89 Thermal Information 热性能信息90 thermal slug 散热片91 Threshold 阈值92 timing resistor 振荡电阻93 Top FET Top FET94 Trace 线路，走线，引线95 Transfer function 传递函数96 Trip Point 跳变点97 turns ratio 匝数比，＝Np / Ns。

（初级匝数/次级匝数）98 Under Voltage Lock Out (UVLO) 欠压锁定99 Voltage Reference 电压参考100 voltage-second product 伏秒积101 zero-pole frequency compensation 零极点频率补偿102 beat frequency 拍频103 one shots 单击电路104 scaling 缩放105 ESR 等效串联电阻[Page]106 Ground 地电位107 trimmed bandgap 平衡带隙108 dropout voltage 压差109 large bulk capacitance 大容量电容110 circuit breaker 断路器111 charge pump 电荷泵112 overshoot 过冲印制电路printed circuit印制线路printed wiring印制板printed board印制板电路printed circuit board印制线路板printed wiring board印制元件printed component印制接点printed contact印制板装配printed board assembly板board刚性印制板rigid printed board挠性印制电路flexible printed circuit挠性印制线路flexible printed wiring齐平印制板flush printed board金属芯印制板metal core printed board金属基印制板metal base printed board多重布线印制板mulit-wiring printed board塑电路板molded circuit board散线印制板discrete wiring board微线印制板micro wire board积层印制板buile-up printed board表面层合电路板surface laminar circuit埋入凸块连印制板B2it printed board载芯片板chip on board埋电阻板buried resistance board母板mother board子板daughter board背板backplane裸板bare board键盘板夹心板copper-invar-copper board动态挠性板dynamic flex board静态挠性板static flex board 可断拼板break-away planel电缆cable挠性扁平电缆flexible flat cable (FFC)薄膜开关membrane switch混合电路hybrid circuit厚膜thick film厚膜电路thick film circuit薄膜thin film薄膜混合电路thin film hybrid circuit互连interconnection导线conductor trace line齐平导线flush conductor传输线transmission line跨交crossover板边插头edge-board contact增强板stiffener基底substrate基板面real estate导线面conductor side元件面component side焊接面solder side导电图形conductive pattern非导电图形non-conductive pattern基材base material层压板laminate覆金属箔基材metal-clad bade material覆铜箔层压板copper-clad laminate (CCL) 复合层压板composite laminate薄层压板thin laminate基体材料basis material预浸材料prepreg粘结片bonding sheet预浸粘结片preimpregnated bonding sheer 环氧玻璃基板epoxy glass substrate预制内层覆箔板mass lamination panel内层芯板core material粘结层bonding layer粘结膜film adhesive无支撑胶粘剂膜unsupported adhesive film 覆盖层cover layer (cover lay)增强板材stiffener material铜箔面copper-clad surface去铜箔面foil removal surface层压板面unclad laminate surface基膜面base film surface胶粘剂面adhesive faec原始光洁面plate finish粗面matt finish剪切板cut to size panel超薄型层压板ultra thin laminateA阶树脂A-stage resinB阶树脂B-stage resinC阶树脂C-stage resin环氧树脂epoxy resin酚醛树脂phenolic resin聚酯树脂polyester resin聚酰亚胺树脂polyimide resin双马来酰亚胺三嗪树脂bismaleimide-triazine resin 丙烯酸树脂acrylic resin三聚氰胺甲醛树脂melamine formaldehyde resin 多官能环氧树脂polyfunctional epoxy resin溴化环氧树脂brominated epoxy resin环氧酚醛epoxy novolac氟树脂fluroresin硅树脂silicone resin硅烷silane聚合物polymer无定形聚合物amorphous polymer结晶现象crystalline polamer双晶现象dimorphism共聚物copolymer合成树脂synthetic热固性树脂thermosetting resin [Page]热塑性树脂thermoplastic resin感光性树脂photosensitive resin环氧值epoxy value双氰胺dicyandiamide粘结剂binder胶粘剂adesive固化剂curing agent阻燃剂flame retardant遮光剂opaquer增塑剂plasticizers不饱和聚酯unsatuiated polyester聚酯薄膜polyester聚酰亚胺薄膜polyimide film (PI)聚四氟乙烯polytetrafluoetylene (PTFE)增强材料reinforcing material折痕crease云织waviness鱼眼fish eye毛圈长feather length厚薄段mark裂缝split捻度twist of yarn浸润剂含量size content浸润剂残留量size residue处理剂含量finish level偶联剂couplint agent断裂长breaking length 吸水高度height of capillary rise湿强度保留率wet strength retention白度whitenness导电箔conductive foil铜箔copper foil压延铜箔rolled copper foil光面shiny side粗糙面matte side处理面treated side防锈处理stain proofing双面处理铜箔double treated foil模拟simulation逻辑模拟logic simulation电路模拟circit simulation时序模拟timing simulation模块化modularization设计原点design origin优化（设计）optimization (design)供设计优化坐标轴predominant axis表格原点table origin元件安置component positioning比例因子scaling factor扫描填充scan filling矩形填充rectangle filling填充域region filling实体设计physical design逻辑设计logic design逻辑电路logic circuit层次设计hierarchical design自顶向下设计top-down design自底向上设计bottom-up design费用矩阵cost metrix元件密度component density自由度degrees freedom出度out going degree入度incoming degree曼哈顿距离manhatton distance欧几里德距离euclidean distance网络network阵列array段segment逻辑logic逻辑设计自动化logic design automation 分线separated time分层separated layer定顺序definite sequence导线（通道）conduction (track)导线（体）宽度conductor width导线距离conductor spacing导线层conductor layer导线宽度/间距conductor line/space第一导线层conductor layer No.1圆形盘round pad方形盘square pad菱形盘diamond pad长方形焊盘oblong pad子弹形盘bullet pad泪滴盘teardrop pad雪人盘snowman pad形盘V-shaped pad V环形盘annular pad非圆形盘non-circular pad隔离盘isolation pad非功能连接盘monfunctional pad偏置连接盘offset land腹（背）裸盘back-bard land盘址anchoring spaur连接盘图形land pattern连接盘网格阵列land grid array孔环annular ring元件孔component hole安装孔mounting hole支撑孔supported hole非支撑孔unsupported hole导通孔via镀通孔plated through hole (PTH)余隙孔access hole盲孔blind via (hole)埋孔buried via hole埋,盲孔buried blind via任意层内部导通孔any layer inner via hole全部钻孔all drilled hole定位孔toaling hole无连接盘孔landless hole中间孔interstitial hole无连接盘导通孔landless via hole引导孔pilot hole端接全隙孔terminal clearomee hole准尺寸孔dimensioned hole [Page]在连接盘中导通孔via-in-pad孔位hole location孔密度hole density孔图hole pattern钻孔图drill drawing装配图assembly drawing参考基准datum referan1）元件设备三绕组变压器：three-column transformer ThrClnTrans双绕组变压器：double-column transformer DblClmnTrans 电容器：Capacitor并联电容器：shunt capacitor电抗器：Reactor母线：Busbar输电线：TransmissionLine发电厂：power plant断路器：Breaker刀闸(隔离开关)：Isolator分接头：tap电动机：motor（2）状态参数有功：active power无功：reactive power电流：current容量：capacity电压：voltage档位：tap position有功损耗：reactive loss无功损耗：active loss功率因数：power-factor功率：power功角：power-angle电压等级：voltage grade空载损耗：no-load loss铁损：iron loss铜损：copper loss空载电流：no-load current阻抗：impedance正序阻抗：positive sequence impedance 负序阻抗：negative sequence impedance 零序阻抗：zero sequence impedance电阻：resistor电抗：reactance电导：conductance电纳：susceptance无功负载：reactive load 或者QLoad有功负载: active load PLoad遥测：YC(telemetering)遥信：YX励磁电流(转子电流)：magnetizing current 定子：stator功角：power-angle上限:upper limit下限：lower limit并列的：apposable高压: high voltage低压：low voltage中压：middle voltage电力系统power system发电机generator励磁excitation励磁器excitor电压voltage电流current母线bus变压器transformer升压变压器step-up transformer高压侧high side输电系统power transmission system输电线transmission line固定串联电容补偿fixed series capacitor compensation 稳定stability电压稳定voltage stability功角稳定angle stability暂态稳定transient stability电厂power plant能量输送power transfer交流AC装机容量installed capacity电网power system落点drop point开关站switch station双回同杆并架double-circuit lines on the same tower 变电站transformer substation补偿度degree of compensation高抗high voltage shunt reactor无功补偿reactive power compensation故障fault调节regulation裕度magin三相故障three phase fault故障切除时间fault clearing time极限切除时间critical clearing time切机generator triping高顶值high limited value强行励磁reinforced excitation 线路补偿器LDC(line drop compensation)机端generator terminal静态static (state)动态dynamic (state)单机无穷大系统one machine - infinity bus system 机端电压控制AVR电抗reactance电阻resistance功角power angle有功（功率）active power无功（功率）reactive power功率因数power factor无功电流reactive current下降特性droop characteristics斜率slope额定rating变比ratio参考值reference value电压互感器PT分接头tap下降率droop rate仿真分析simulation analysis传递函数transfer function框图block diagram受端receive-side裕度margin同步synchronization失去同步loss of synchronization阻尼damping摇摆swing保护断路器circuit breaker电阻：resistance电抗：reactance阻抗：impedance电导：conductance电纳：susceptance。