连接器基础知识◆1、连接器的定义◆2、连接器的结构◆3、连接器的主要性能◆4、连接器的分类◆5、连接器的应用技术◆6、连接器的制造◆7、连接器的MPN解释举例◆8、连接器的电镀指导1、连接器的定义连接器是电路中连接两个导体的装置,能够让电流和光波(光学纤维)从一个导体流向另一个导体。
2、连接器的结构连接器一般由三部分组成,即接触件、基座和外壳;外壳基座接触件也有很多连接器由两部分组成,即接触件和基座。
连接器有没有外壳由使用情况所决定,需要完全屏蔽或者使用环境非常恶劣的情况下一般需要使用外壳接触件接触件的作用是导通信号,一般所用材料为铜,因为铜同时具有优良的导电性能、导热性能及机械加工性能。
基座基座的作用是支撑接触件及绝缘,一般所用材料为各种树脂,树脂具有优良的电性能、热性能、质量轻。
外壳外壳的作用是屏蔽及保护基座,所用材料比较多,有铜、钢、铝等。
3、连接器的主要性能连接器的主要性能有电气性能、机械性能、环境性能1、电气性能2、机械性能3、环境性能电气性能◆*接触电阻(Contact resistance)◆*额定电流(Current rating)◆*最大电压(Max.voltage)◆*绝缘电阻(Insulation resistance)◆*端子接触顺序(Contact sequencing(hat pluging))◆*噪音(Noise)◆*信号延迟(Delay)◆* 阻抗(Impedance)◆*串扰(Screw)◆*插入及拔出力(Insertion force and withdraw force)◆*矫正能力(Alignment◆*保持力(Retentions)◆*刮痕(Wiping)◆*振动及冲击(Shock and vibration exposure)◆*防误插(Polarization capabilities)◆*耐久性(Durability)◆*工作温度(Operating temperature)◆*耐高温性(High temperature resistance)◆*湿度(Humidity)◆*化学腐蚀(Atmospheric contamination)◆*焊锡性(Solderability)◆*塑胶焊锡抵抗(Soldering heat resistance)◆*耐溶性(Solvent resistance)◆*防锈保护(Corrosion protection)4、连接的种类(Type of interconnection)连接器的分类◆连接器分为六种不同的工业等级。
等级划分的两个主要原因如下:◆连接器功能的差异性◆市场分类(供应商可能仅提供一种等级)第1级:设备到封装连接器这是FCI-CDC唯一没有包括在内的等级。
这种连接器被安装在芯片内部第2级:元件引线到电路连接器第2级连接器用于将处理器和存储器芯片连接到接槽中。
以下是第2级连接器的一些举例。
第3级:板到板连接器对于FCI来说,这个等级非常重要。
由于基板的应用范围不同,因此采用了不同的终端式样和不同的触点技术。
在实践中,电子设备的制造采用多种不同的方法,有些用户设备采用多种制造方法。
因而,对于使用新型连接器来提高模块性和升级可能性的需求不断增加。
根据下图,我们可以了解基板相互连接的不同方式。
在这里可以了解直线式和角度式连接方向的应用情况第4级:组件到组件连接器第4级连接器由电缆组件和用于电子设备内部子架相互连接的插接线组成。
您经常会看到使用光纤或其它高速互连技术的高速电缆连接。
下图显示了某些使用光学纤维的电缆。
下图显示了某些电缆组件:内部电缆简易型电缆钳夹型电缆第5级:组件到输入/输出端口连接器组件到输入/输出端口连接器与第4级连接器极为相似。
由于暴露在外和使用频率更大,该等级的连接器通常更为坚固,因此,它们必须具有较好的耐磨损性。
下图右侧的连接器属于第5级(暴露在设备外部)。
左侧的连接器属于第4级(位于设备内部)。
第6级:系统到系统连接器输入/输出连接器和电缆组件用于设备到设备的连接。
例如笔记本电脑和打印机、外接硬盘、单独的显示器和其它设备的连接,或者如图所示,电脑和显示器的连接*一个可分割的连接器系统应具备以下的性能: (A separable connector system must have the followingcapabilities)----有足够的空间连接那些需要连接的成分。
----(Fit/align the element to be connected)----符合技术要求----(Satisfy the performance specifications)----有足够的强度----(Resist the force which could degrade the connection)----在正确的操作步骤下有较长的适用寿命----(Survive in good operating order for the product life)成本(Cost)----可靠性(Reliability)----大小及密度(Size/density)----质量(Quality)5、应用技术—线缆连接◆刺破式线缆连接(IDC—Insulation Displacement Connection)◆IDC is a form of termination method between the conductor (wire) and theterminal◆ 2 cutting blade design that pierce into the insulator and come in contact with theconductor .Can terminate both insulated and uninsulated wire◆ 2 or 4 contact point design◆Common wire size (awg) : 24, 26, 28 or 30 (solid or stranded wire)◆With or without the strain relief feature◆Eliminate complicated wire preparation processes◆Tolerance problems do exist (mainly in cable) in large connectors where end position maynot terminate properly.◆Strain relief recommended.Advantages of IDC.•Eliminating the wire stripping operation.•Low termination force as compared to crimping.•Low defect rates.•Low applied cost.•High reliabilityIDC application tooling Semi automatic cable terminatorHand pistol toolingField repair tool应用技术—线缆连接Crimping◆Crimp terminations are generallyremovable type contacts.◆High pressure type termination.◆Requiring crimping tool(automatic to hand),insertion and extraction tools.◆Wire wrap◆Solder to wireFFC&FPC&CIC◆Press-fit is a form of terminationmethod between the pc boardand the terminal◆Type of press-fit pin◆Spring-action clean the platedthrough hole on the pcb reduces the problem causesby the pcb assembly◆Process easy repairabilityImpress 500E Electro-Servo Insertion Press压接摸具(Insertion Tooling)◆Solder to board◆-through mount◆-surface mountTypical soldering methods ◆.•hand soldering ◆.•wave soldering ◆.•dip soldering ◆.•reflow soldering-infrared reflow soldering-vapor phase reflow soldering -laser reflow soldering◆Critical areas in SMT ◆.•plastics ◆.•lead configuration ◆.•lead to padrelationship ◆.•thermal mismatch ◆.•mechanicalattachment◆. •automated handlingSMT 工艺流程和设备◆SMT-surface mount–表面贴技术◆典型的SMT温度曲线Lead Free Project Project targets:♦remove lead from all FCI products♦provide customers with reliablelead-free solutions♦provide customers with data toverify the reliability♦maintain cost levels for plating♦assure products are processable in standard solder process (with lead) as well as in Lead-Free solderprocess♦qualify technology and process♦provide implementation path♦provide guidelines to manage the change of products to Lead-Freeprocessable Project elements Communication PlatingResinsAssemblyQualificationTimingCostResin Specifications◆Lead-Free solders have an increased melting point.As process temperatures increase all resins need to be re-qualified for use in Lead-Free processing conditionsFCI is using a peak-temperature of 245 ºC and 260ºC for testing lead-free reflow process conditions◆In case resins do not meet Lead-Free processingconditions the use of alternative resins will betaken in consideration◆Business case analysis is required for eachindividual partnumber if resins change is requiredPlating SpecificationsPlating of choice:♦For SMT, PIP and Press-Fit recommended to useMatte Pure Tin on Nickel underplate (min 1.27 m)●Simplex plating can provide solution in some situations♦For BGA use industry standard SnAgCu spheres●Continue to use SnPb for special situations onlyLead Free Priority List Priority ItemsRecommendation 559METRAL1 578DUBOX / PV / BERGSTIK1 558HIGH SPEED BACKPLANE1 560MILLIPACS1 569D-SUB PROFESSIONAL1 543PC CARD/HEADER1 580MODULAR JACKS1 549MEG-ARRAY1 557DIN SYSTEM 121 538FFC / FPC SYSTEMS1 507MEMORY CONNECTORS1 511USB1 552PWRBLADE1 596POWER DISTRIBUTION SYSTEMS2 556DIN PCB2 599MISCELLANEOUS/OTHER2 522IDC QUICKIE2 561HE-17 AND HPC2 545BERGSTAK 0.8MM2 510SOCKETS2 526LOW COST D-SUB2 571D-SUB ACCESSORIES2 509MICROPAX2 584SMART CARD2 579RF COAX2 539BTFN / BTFW / BTEM / BTMK2 530HDD COMBO / SATA2 521BUMP COMPRESSION2 553SCA22 550GIG-ARRAY2 546BTVM 0.5MM2 512P13942 551FASTECH3 504NORCON3 577MINITEK3 587FIBER OPTICS3◆Green:♦A.S.A.P.◆Yellow:♦A.S.A.P. + 6 months ◆Red:♦A.S.A.P. + 12 monthsExisting FCI Lead-Free ProductsGroup Product PlatingBoard-To-Board BergStik Simplex - 30u Au, 15u AuQuickie Headers Simplex - 30u Au, 15u AuShunts Simplex - 30u Au, 15u AuDubox Simplex - 30u Au, 15u AuCard Connectors Simplex - 30u Au, 15u AuBergCon Headers Simplex - 30u Au, 15u AuQuickie IDC Simplex - 30u Au, 15u AuPV Simplex - 40u Au, 30u Au, 15u AuMinitek Simplex - 30u Au, 15uAuSocket - Screw Machine Simplex - 30u AuGroup Product PlatingI/O Products SATA Duplex - 50u Au (Mate) 30uSnCu (Tail) Modjack Simplex - 30u Au, 30u GXT, 50u AuClincher Simplex - 30u AuGroup Product PlatingBackpanel HPC Simplex - 50u Au, 30u Au, 30u GXTBergPin Simplex - 50u Au, 30u Au, 15u Au6、连接器制造技术(Production technology)Connector system components◆Mating area :Au or GXT Plating◆Termination area:Solder, Crimping, Pressfit,◆Wire-wrap, Insulation, Displacement connection连接器制造技术基座射出成型技术(Molding technology)接触件制造技术◆常用端子材料(Commom contact material ):◆Performance price铍铜berrylium copper best high磷青铜phosphor bronze good fair黄铜brass fair low◆常用加工方法◆车制成型、冲压成型、冲压+卷曲成型等连接器制造技术(Production technology)射出成型技术(Molding technology)◆射出成型技术(Molding technology)◆冲压技术(Stamping technology)◆装配技术(Assembly technology )◆喷塑成型技术(Molding technology)◆1)塑胶材料(Plastic resins)◆2)喷塑机(Molding machine)◆3)射出模具(Injection mold)◆4)喷塑参数(Molding parameter)◆ 3.11喷塑材料(Injection molding plastic resins)◆*塑胶料种类(Resin types)◆*热变形温度(HDT:heat deflection temperature)◆*成本因素(Cost considerations)◆*线膨胀系数(Tce considerations)◆*材料特性(Material characteristics)连接器制造技术(Production technology)射出成型技术(Molding technology)连接器制造技术(Production technology)射出成型技术(Molding technology)。