Guide Hole for Electrical Test
丝印定位孔
Guide Hole for Screen Printing
孔环
Lifted Land
渗锡孔
StannizeHole
装配孔
Fitting Hole
制程
Manufacture Procedure
下料
Material Preparation
Bottom Silver Paste
银浆油墨
Sliver Ink
顶层线路
Top Circuits/Conductors
底层线路
Bottom Circuits/Conductors
半固化片
Bonding Film (BOD)
聚酰亚胺
Polyimide(PI)
聚酯
PolyesterFilm (PET)
FPC-专业词汇-中英文对照
FPC名词中英对照
1. 目的
通过对行业标准的FPC工程名词引用及我司标准的整合，旨在为我司FPC名词的中英用语实现使用上的统一化
2. 适用范围
规范FPC相关工程上出现之不良项目，生产使用之材料、设备、治具以及可靠性试验等中英文名词
3. 定义
无
类别一：FPC不良项目名词
工程类别
孔与焊盘的重合性
Registration of Hole to Land
覆盖层与焊盘的重合性
Registration of Coverlay (or Covercoat) to Land
增强板与FPC的重合性
Registration of Stiffener to FPC
孔的重合性
Registration of Holes
丝印字符
Printingof Legend
贴补强板
Back Board Lamination
电性能测试
Electrical Inspection
贴胶纸
Double Faced Adhesive Tape
打孔
Punching
雷射切割
Laser Cut
自动光学检验
Automatic Optical Inspection （AOI）
漏镀
No Plating
表面伤痕
Plating Scratch
电镀粗糙
Rough Plated
药水渗入
Wicking
外形和孔边缘
Visual Inspection of Edges of Outline and Holes
撕裂和缺口
Tears and Nicks
毛刺
Burrs
丝状毛刺
Thready Burrs
外形的重合性
Registration of Outlines
冲外形与导线图形的重合性
Registration of Punched Outline to Conductor Patterns
压敏胶或热固胶与FPC和增强板的重合性
Registration of Pressure Sensitive or Heat Activated Adhesives to FPC and Stiffener
前处理
Pre-treatment
刷板
Brushing
干燥
Dry up
电镀（金、锡、镍）
(Gold、Solder、Nickel) Plating
闪镀
(Gold ) Flash Plating/Strike Plating
局部电镀
Pattern Plate
化学镍金
Immersion Gold
有机保焊膜
Organic Solderability Preservatives(OSP)
钢片
Sheet Steel
玻璃纤维布
WovenGlassCloth
FR4补强板
Fiberboard
液态感光油墨
Liquid Photoimageable Resist Ink
压敏胶
孔
Holes
元件孔
Component Holes
导通孔
Via Holes
导通孔偏移
Via Hole Misalign
安装孔
Mounting Holes
导线宽度
Conductor Widths
导线之间的间距
Clearances Between Conductors
孔中心间距
Distance Between Hole Centers
导线分层
Conductor Delamination
裂纹
Cracks
导线划痕
Scratches on Conductor
凹坑
Dents
变色
Discoloration
基底薄膜
Visual Inspection of Base Film
凹坑
Dents
划痕
Scratches on Base Film
覆盖层和覆盖涂层
Exposure Jig
丝印网框
ScreenPrintingFrame
孔
Hole
曝光定位孔
Guide Hole for Exposure
模具定位孔
Guide Hole for Die
假贴定位孔
Guide Hole for Tacking
贴合定位孔
Guide Hole for Adhesive
电测定位孔
工程类别
中 文
英 文
板
Board Type
单面板
Single Sided Flex Circuits
单面双接触
Double Access or Back-bared Flex Circuits
双面板
Double Sided Flex Circuits
软硬结合板
Rigid-flex Circuits
模具
板边和导线之间的最小距离
Minimum Distance Between Board Edges and Conductors
标记错误
Wrong Marking
字符不清晰
Unclear Letter
定位精度Positional Accuracy
孔的定位精度
Positional Accuracy of Holes
贴保护膜
Tacking Coverlay
粗化
Abrade
层压
Lamination
固化(烘烤）
Curing
黑孔eatment
循环水洗
Cascade Rinse
微蚀
Micro-etch
酸洗
Acid Cleaning
水洗
Water Cleaning
防锈处理
Anti-corrosion Treatment
镀锡
Tin Plating
电镀金属或焊料的渗透
Penetration of Plated Metal or Solder
变暗（变黑）
Darkened Appearance (Blackening Discoloration)
镀铜孔内镀层空洞
Plating Voids in Plated-though Hole
镀通孔的镀铜层厚度
Plating Thickness of Copper Panted-through Holes
其它Other
短装
Shortage
混装
Mixed Stowage/Packing
离型纸脱落
Released Paper Peeled off
材料错误
Wrong Material
类别二：PFC工程用语
弯曲、变形
Warpage
微连筋不良
Poor Micro-joint
外形偏移
Outline Misalign
外形漏冲
NoOutline
反折偏位
Bending Line Misalign
增强板
Visual Imperfections Related to Stiffener Bonding
FPC与增强板之间的外来物
性能测试
ReliabilityTest
包装
Packing
原材料 Material
铜箔
Copper Foil(CU)
电解铜
Electro-deposited Copper Foil (ED)
压延铜
Rolled Annealed Copper Foil (RA)
保护膜
Coverlay (CVL)
基材
Base Material
Visual Inspection of Coverlay and Covercoat
凹坑
Dents on Coverlay and Covercoat
划痕
Scratches on Coverlay and Covercoat
空洞
Void
偏位
CoverlayMisalign
毛刺
CoverlayBurrs
镀金粗糙
Rough Gold
镀金白雾
Gold Discoloration
镀金变色
Gold Discoloration
镀金层龟裂
Gold Crack
镀金针孔
Gold Pinhole
电镀露铜
Plated Expose Wetting
剥离
Plated Peeled Off
电镀渗入
Plated Wicking
不良名称中文
英文
导线
Visual Inspection of Conductors