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•
(
)Conformal Coating
Macroelectronics System Assembly
– 5 – 10 mils
•
– > 125 mils
Encapsulants and Gels Adhesives and Sealant – > 125 mils Thermally Conductive Materials Fluids, Greases & Primers Pre-formed Gel Pads WE HELP YOU INVENT
WE HELP YOU INVENT THE FUTURE.TM
24
•
– – –
• • •
Aug/Sept, 2004
MED I-II-III , A Silicone & Electronics Applications
WE HELP YOU INVENT THE FUTURE.TM
25
RTV
*
• HC 2000, HC 2100,
SE9187L
Aug/Sept, 2004
MED I-II-III , A Silicone & Electronics Applications
WE HELP YOU INVENT THE FUTURE.TM
27
• • • •
• DOW CORNING® 1-4010
Dip Coating
• • •
– – – –
Aug/Sept, 2004
/
MED I-II-III , A Silicone & Electronics Applications
WE HELP YOU INVENT THE FUTURE.TM
22
Spray Coating
• • •
– – – –
WE HELP YOU INVENT THE FUTURE.TM
26
RTV
• • • • •
• DOW CORNING® 3140
* 5 mils (MIL-I-46058C) IPC-CC-830 UL
• DOW CORNING® 3-1944
DOW CORNING® 3-1953 DOW CORNING® 3-1965
WE HELP YOU INVENT THE FUTURE.TM
15
-
Poly-Silicon Production
Semiconductor Fabrication
Device Packaging
Aug/Sept, 2004
ý Systems Assembly
16
MED I-II-III , A Silicone & Electronics Applications
WE HELP YOU INVENT THE FUTURE.TM
35
Aug/Sept, 2004
MED I-II-III , A Silicone & Electronics Applications
• • • •
ý
RTV
:
DOW CORNING® 3110 DOW CORNING® 3112 DOW CORNING® 3120 DOW CORNING® 255
WE HELP YOU INVENT THE FUTURE.TM
33
• • • •
ý
ý
• • • • •
SYLGARD® 160 / 165 / 170 SYLGARD® 182 /184 / 186 SYLGARD® 567 DOW CORNING® 3-6642 DOW CORNING® 3-6121
43
180 Peel Adhesion
Lap Shear Adhesion
Shearing Force
Glue line 0.020 inch
40
•
Aug/Sept, 2004
MED I-II-III , A Silicone & Electronics Applications
WE HELP YOU INVENT THE FUTURE.TM
41
•
Aug/Sept, 2004
MED I-II-III , A Silicone & Electronics Applications
•
Product can be grouped according to their respective application.
•
Products can be grouped according to their respective cure system.
Aug/Sept, 2004
MED I-II-III , A Silicone & Electronics Applications
Aug/Sept, 2004
MED I-II-III , A Silicone & Electronics Applications
WE HELP YOU INVENT THE FUTURE.TM
14
•
Product can be grouped according to their respective industry segment.
• • • •
• DOW CORNING® 1-2577 ,
1-2577 Low VOC DOW CORNING® 1-2620 , 1-2620 Low VOC
* 5 mils (MIL-I-46058C) IPC-CC-830 UL
Aug/Sept, 2004
MED I-II-III , A Silicone & Electronics Applications
WE HELP YOU INVENT THE FUTURE.TM
38
•
Covalent chemical bonding
•
Mechanical interlocking
•
Electrostatic attraction
WE HELP YOU INVENT THE FUTURE.TM
39
Aug/Sept, 2004
31
• • • LED • •
• • • • •
WE HELP YOU INVENT THE FUTURE.TM
32
Aug/Sept, 2004
MED I-II-III , A Silicone & Electronics Applications
Aug/Sept, 2004
MED I-II-III , A Silicone & Electronics Applications
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18
• • •
Aug/Sept, 2004
MED I-II-III , A Silicone & Electronics Applications
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19
• • • • • •
2
3
4
5
6
7
8
9
10
11
12
Number of temperature cycles in high humidity
Aug/Sept, 2004
MED I-II-III , A Silicone & Electronics Applications
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MED I-II-III , A Silicone & Electronics Applications
• •
Si O O O
Si O O
Si O
Aug/Sept, 2004
MED I-II-III , A Silicone & Electronics Applications
WE HELP YOU INVENT THE FUTURE.TM
/
Insulation resistance, ohms
,
,
Coated epoxy-glass board (MIL Spec coating)
Coated epoxy-glass board (lesser quality coating)
Uncoated epoxy-glass board
0
1
WE HELP YOU INVENT THE FUTURE.TM
30
:
:
,
• • • • • •
Aug/Sept, 2004
, /
• • • • • • •
MED I-II-III , A Silicone & Electronics Applications
,
,
/
WE HELP YOU INVENT THE FUTURE.TM
WE HELP YOU INVENT THE FUTURE.TM
34
Aug/Sept, 2004
MED I-II-III , A Silicone & Electronics Applications
Hale Waihona Puke • • • •ýý
• • • • • • • • • •
DOW CORNING® 527 DOW CORNING® 3-4207 DOW CORNING® 3-4219 DOW CORNING® 3-4220 DOW CORNING® 3-4150 DOW CORNING® 3-4154 DOW CORNING® 3-6575 DOW CORNING® 3-6635 DOW CORNING® 3-6636 Fluorogel® 3-6636