Output:
A set of locations on the chip: one location for each cell.
Goal:
The cells are placed to produce a routable chip that meets timing (lowpower, …)

Pin assignment Early analysis: timing, congrestion, …
微电子学系
Chap07 P.10
Floorplan(3)－Flatten or Hierarchical

假设一个设计包含10000个单元，以下是两种方法的 区别； Flatten design
微电子学系
Global Placement Detailed Placement
Chap07 P.18
Bi-Partitioning/tion
微电子学系
Chap07 P.19
Placement(quadratic + partitioning)
微电子学系
Chap07 P.20
标准单元详细布局
Back End
Detail Routing
微电子学系
Chap07 P.6
物理设计流程

Floorplan

估算ASIC的面积，确定block的划分、I/O的位置、宏单元的 位置方向，IP块的放置，确定放置单元平面的大小、形状， 预留布线通道，电源、地线位置等。 将所有的宏单元和单元放置到适当的位置；手动加自动。 根据约束条件产生所需的时钟buffer，并将这些buffer放置到 合适的位置。 连接所有的连线，包括电源、地，时钟线，全局连线和局部 连线。
statistical wire-load models Wirelength in placement
微电子学系
Chap07 P.14
Constraint of Placement




Area Would like to pack all the modules very tightly Wire length (half-perimeter of the net bbox) Minimize the average wire length Would result in tight packing of the modules with high connectivity Overlap Could be prohibited by the moves, or used as penalty Keep the cells from overlapping (moves cells apart) Timing Not a 1-1 correspondent with wire length minimization, but consistent on the average Congestion Measure of routability Would like to move the cells apart

P&R iteration：at least 1 time； Memory usage：large Computing time：long Die size：relative small； Partition into 5 soft blocks，each contains 2000 cells； P&R iteration: at least 6 times； Memory & computing time: relative small & short; Die size: relative large Design reuse potential
•Cell: a circuit component to be placed on the chip area. In placement, the functionality of the component is ignored. •Net: specifying a subset of terminals, to connect several cells. •Netlist: a set of nets which contains the connectivity information of the circuit.
深亚微米互连线复杂性
18
Risk Factors: Interconnect Delay Signal Integrity Electromigration Process Variations
14 12 10 8 6 4 2 0.13 0.18 0.25 0.35
0
Technology ()
微电子学系
第7章 后端物理设计
西安交通大学电信学院 微电子研究所 程 军 2012/10/12
微电子学系
Chap07 P.2
CMOS工艺中的互连线
Tiny devices buried under a multilevel structure of wires and vias.
微电子学系
Chap07 P.3
Logic Partitioning Die Planning
Global Placement
Detail Placement Simulation Floorplanning Clock Tree Synthesis and Routing Design Verification Timing Verification Global Routing Test Generation LVS DRC ERC Extraction and Delay Calc. Timing Verification
L
D
M N
E
O P Q
F
Floorplanning 第一种方法
{L,M,N} {O,P,Q} {F} {I, J, K} {G,H} {Q} {C}
第二种方法
{L,M,N} {P} {C}
第三种方法
{O,P,Q}
{G,H}
{O}
{F}
{I, J, K}
{G,H}
{I, J, K}
{L,M,N}
微电子学系
Detail Routing
微电子学系
Chap07 P.13
Placement－Prediction
What is prediction ?



Allows quick space exploration, localizes the search For example:

every system has some critical cost functions: Area, wirelength, congestion, timing etc. Prediction aims at estimating values of these cost functions without having to go through the time-consuming process of full construction.

Chip Area Total Wire length Critical path delay Routability Others, noise, heat dissipation etc.
微电子学系
Chap07 P.12
Placement
IO Pad Placement
Definitions:
Chap07 P.4
At-Risk Nets (millions)
Estimated Number of Nets At-Risk
16
0.5
连线延迟和门延迟的变化趋势
在0.25m，Al连线延时超过门延时，在0.13m，Cu连线延 时超过了门延时。在设计方法学上，由关注晶体管转变成 关注互连线。”Interconnect is everything: Timing, power, noise, design functionality and reliability”

Placement


Clock Tree Generation


Routing

微电子学系
Chap07 P.7
物理设计流程(2)
Floorplan
Placement
Routing
微电子学系
Chap07 P.8
Floorplan
A
G H I
Design Hierarchy TOP B
J K
C
Power/Ground Stripes, Rings Routing
Global Placement Detail Placement
Clock Tree Synthesis and Routing Extraction and Delay Calc. Timing Verification
Global Routing
Challenge:
•The number of cells in a design is very large (> 1 million). •The timing constraints are very tight.
微电子学系
Chap07 P.16
Placement Problem
A bad placement
Chap07 P.9
{C,F}
Floorplan(2)—Contents

Soft macros, Hard macros, IP and floorplan groups Block placement Interactive adjustment and edit