Nov-05 May-05 May-06 Nov-06 Jul-05 Jan-05 Jan-06 Jul-06 Mar-05 Mar-06 Jan-07 Sep-05 Sep-06 Mar-07
Latest (4-May) : 684.8
450 400 350 300 250 200
May-05 May-06 Mar-05 Mar-06 Sep-05 Sep-06 Mar-07
Apr,05
Apr,06
Palladium Pre-plated Frame Pre-plated
镍钯金预电镀框架
Increasing demand 渐成主流
Support green packaging (lead-free) 滿足 ’无铅’ 环保要求 Lower assembly cost due to elimination of solder plating process 省去封装过程中的镀锡工序从而进一步降低封装成本
公用模具的领先者
SOJ SC70
Low Cost
TQFP 14x14 PDIP SOT23 TSSOP TQFP 14x20
TSOP(I) SOP MSOP SSOP
ASM Pacific Technology Ltd. © 2007
Open Tool Advantages
公用模具的优势
• Save cost in expensive precision tooling 节省模具的开发费用 • Low leadframe cost due to economy of scale 规模效益可降低引線框架的制造成本 • Short delivery lead time due to common parts in production 主流产品的交货周期较短 • Perfection in leadframe design as tuned by various customers 吸纳不同客户的反馈使引线框架的设计力臻 完美
ASM Pacific Technology Ltd. © 2007
New Platform For Small Package
小型封裝件的最新框架设计
Standard frame size 70x238mm, easy conversion 统一的框架外形尺寸, 方便产品转换
SO 8L (256unit)
Low Cost
Leadframe base metal
ASM Pacific Technology Ltd. © 2007
Thin Plating Measurement
薄钯电镀层的测量
State-of-the-art capability
顶级的测量能力 Good resolution 微细的分辨率 2.5Å (0.01µ”) Good accuracy 微细的精确度 10nm Pd at +/- 12.5Å 10 纳米厚度的钯层 VXR (精准度达 +/- 0.8纳米) Good applicability 灵活的应用范围 Measurement area 75nm, i.e. any spot on the lead surface 测量区域 > 75纳米,也就是脚表面的任何位置
Vs typical design 140units 与普通型比较 Density 密度: +83% Material consumption: -21% 材料耗用
Low Cost
MSOP 8L/10L (320unit)
Vs typical design 100units 与普通型比较 Density 密度: +220% Material consumption: -51% 材料耗用
Source: IC Packaging Materials 2006 Edition
2009
2010
ASM Pacific Technology Ltd. © 2007
Typical Plating Scheme
典型的电镀规格
3-layer structure (Ni/Pd/Au) 三层结构（镍/钯/金） Pd at min 20nm (0.8µ”) 钯厚度最少20纳米
70000 60000 50000 Units (M)
Low Cost
Leadframe Finish Forecast
Pd PPF
40000 30000 20000 10000 0 2005 2006 2007 Year 2008
Ni/Pd/Au PPF Sn/Pb Matte Tin Sn/Bi Sn/Ag/Cu Sn/Cu
Low Cost
ASM Pacific Technology Ltd. © 2007
High Density Matrix
高密度矩阵
SO 8L (256unit)
Low Cost
TSSOP / MSOP 8L (320unit)
TQFP (7x7) 48L (60unit)
QFN 3L - MCD (8,816unit)
Latest (4-May): 8225.0
Latest (4-May): 52,600
50,000 40,000 30,000 20,000 10,000 Nov-05 Nov-06 Jan-05 Jul-05 Jan-06 Jul-06 Mar-05 Mar-06 Jan-07 May-05 May-06 Sep-05 Sep-06 Mar-07
Shipment (Million Units)
Low Cost
Cumulative Production
Close to 1 billion units!
Oct,05
Feb,05
Feb,06
Mar,05
Mar,06
May,05
May,06
Nov,05
Dec,05
Oct,06
Jan,06
Jun,06
Jul,06
Nov,06
June,05
ASM Pacific Technology Ltd. © 2007
Sep, பைடு நூலகம்6
Aug,05
Aug,06
Dec,06
July,05
Sep,05
1000 900 800 700 600 500 400 300 200 100 0
Start launching to market
ASM Pacific Technology Ltd. © 2007
Power Device
功率器件
较厚的原材料厚度可加快热量的扩散
Thick material (0.50mm) to enhance thermal dissipation
Application Specific
ASM Pacific Technology Ltd. © 2007
内脚反向打凹的产品
Using lead up-bending (reverse downset) to simulate half-material-thickness feature of etched frame 模拟腐蚀片中半腐蚀的特性，将内脚反向打凹 Increasing inquiry with diversified pkg designs 应用于不同的封装类形 TEP 5L DFN 6L
Low Cost
DFN 8L
ASM Pacific Technology Ltd. © 2007
Application Specific 特殊应用
ASM Pacific Technology Ltd. © 2007
Flip Chip Device Forecast
倒装芯片封装体的预测
Application Specific
Trend of LME Nickel Price
60,000
8,000 7,000 6,000 5,000 4,000 3,000 2,000 1,000 May-05 May-06 Mar-05 Mar-06 Nov-05 Nov-06 Sep-05 Sep-06 Mar-07 Jan-05 Jan-06 Jan-07 Jul-05 Jul-06
Leadframe Development For Future Needs
引线框架的未来发展
ASM Pacific Technology Ltd. © 2007
Electronic Component Packaging Needs
芯片封装件的需求
Low Cost 低成本 High Performance 高性能 Application Specific 特殊应用
Series1
Jul-05
Nov-05
Jul-06
Nov-06
Jan-05
Jan-06
Month
Series1
M onth
ASM Pacific Technology Ltd. © 2007
Jan-07
Low Cost 低成本
ASM Pacific Technology Ltd. © 2007
Open Tool Leader
TSSOP 8L (320unit)
Vs typical design 100units 与普通型比较 Density 密度: +220% Material consumption: -51% 材料耗用
ASM Pacific Technology Ltd. © 2007
Field Proven By Volume Production SO 8L 256units
散热型封装件的预测
Low Cost
Source: IC Packaging Materials 2006 Edition