50
Formation of a loop
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pad
lead
51
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pad
lead
52
WIRE CLAMP ‘CLOSE’
Calculated Wire Length
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pad
24
CA800-IR Glue Dispense
CA800-IR
IR Glass Attach
Glue
Holder
IR cut Glass
Glue
Holder IR Glass
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25
CA800-HA Glue Dispense
CA800-HA Holder Attach
3
Part I 产品的应用
手机摄像模组
拆解
拆解
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4
Part II 产品的类型
◆ 软板定焦模式(FF)
1. B-To-B 2.Gold Finger
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5
Part II 产品的类型
◆ 软板变焦模式 1.手动变焦(MF)
OK
OK
+
dispense IR Glass
CM800
Holder Attach Process
N/A
OK
+
dispense
CM800
Barrel Insert Process
N/A
OK
+
Lens Barrel 19
CM800
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Part IV 产品的制作工艺
38
Free air ball is captured in the chamfer
SEARCH SPEED1
SEARCH TOL 1
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pad
lead
39
Formation of a first bond
SEARCH SPEED1
SEARCH TOL 1
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14
Part IV 产品的制作工艺
3. 镜座(Holder)
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15
Part IV 产品的制作工艺
4. 镜头(Lens)
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Part IV 产品的制作工艺
5. 软板(FPC)
Sensor Area Chip
Wire Bonding
Au Wire
Wet Clean
Au Wire Chip Sensor Area
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23
IR Glass Mount
IR Glass SAW
IR Glass
Wafer Ring
IR Glass
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Barrel Fixation
Achromatic Lens ND4（Adjustment of Light Quantity）
Laser
Barrel
Motor
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28
Part V 问与答
Q&A
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29
Part VI 专业名词介绍
Die Bonding:使芯片 与PCB粘合。 注意点：1.芯片方向 2.胶量 3.顶针和吸嘴印 4.芯片角度 5.芯片位置 6.芯片倾斜
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Part IV 产品的制作工艺
Wire Bonding: 通过金线焊接 使芯片与PCB线路导通。 注意点：1.接线是否正确 2. 线弧 3.金球大小 4.金球厚度 5.金线拉力 6.金球推力
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pad
lead
57
TRAJECTORY
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pad
lead
58
TRAJECTORY
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pad
lead
59
TRAJECTORY
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pad
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pad
lead
46
Capillary rises to loop height position
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pad
lead
47
Capillary rises to loop height position
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43
Capillary rises to loop height position
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pad
lead
44
Capillary rises to loop height position
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pad
lead
45
Capillary rises to loop height position
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21
Screen Print
Solder Paste
Passive Placement
Passive
For Die Attach
Solder Paste
Passive
Substrate
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22
Die Attach
CA-800-BI Barrel Insert
Barrel
Holder
Glue
Glue
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26
Singlation
cut
cut
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27
Focus adjust
Lighting
（Percolation Method) chart
Flexible Circuit Board软性印制电路是以聚酰亚胺 或聚酯薄膜为基材制成的一种具有高度可靠性绝佳的可 挠性印刷电路。
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17
Part IV 产品的制作工艺
★ 工艺流程
Wafer清洗 Plasma清洗 固晶 固晶烘烤
DAM烘烤
DAM邦定
金线检查
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12
Part IV 产品的制作工艺
★ 材料 1. 晶圆(Wafer)
主要是由硅和锗组成,是摄像头模组的核心部分,称 之为影像传感器。
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13
Part IV 产品的制作工艺
2. 线路板
Printed Circuit Board印刷电路板,是电子元器 件的支撑体,是电子元器件电气连接的提供者,简称PCB.
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8
Part III 产品的构造
● CSP (Chip Scale Package)
IR Filter Lens Barrel
Glass
Holder
Solder Ball FPC stiffener Chip
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9
Part III 产品的构造
SEARCH SPEED1
SEARCH TOL 1
lead
35
Free air ball is captured in the chamfer
pad
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SEARCH SPEED1
SEARCH TOL 1
lead
36
Free air ball is captured in the chamfer
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30
END Thanks !
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31
Bonding Process
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32
Free air ball is captured in the chamfer
pad
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2.自动变焦(AF)
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6
Part II 产品的类型
◆ 插槽模式(Socket)
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7
Part II 产品的类型
■ 像素分类
CIF (352*288) 10万像素 (0.1M) VGA (640*480) 30万像素 (0.3M) SXGA (1280*1024) 130万像素 (1.3M) UXGA (1600*1200) 200万像素 (2.0M)
CCM产品工艺知识培训
制作:陈建文 日期:2011.8.20
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产品的应用 产品的类型 产品的构造 产品的制作工艺 问与答 附录:专业名词介绍
2
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