23
特殊开法 (2605201/301)
0.5pitch
QFN thermal pad
24
特殊开法 (2757401 S2/
2760101 S1)
0.5pitch
QFN thermal pad
25
特殊开法
All
(2605201/301)
QFN
(2666001 S1
26
PU17&PU18) 焊盘形状类似
信号pin:椭圆1.27*0.9mm & Φ1.0mm Lock pin :Φ1.7mm
2.0pitch 信号pin孔径: Φ1.016mm(40mil)
2.55pitch 信号pin孔径: Φ1.0/ Φ1.1
2.5pitch 信号pin孔径: Φ1.0/ Φ1.1
此零件俗称“小椅子” 信号pin孔径: Φ1.0mm& Φ1.3mm &Φ1.4mm
截图案例为2590701 信号pin:Φ1.14mm Lock pin :椭圆4.0*1.8mm VGA P/N: 6012B0253503
信号pin:Φ0.838mm(1.58pitch) Lock pin :椭圆L*W
信号pin孔径：Φ40mil(1.016mm) Post柱孔径 :Φ90.55mil(2.299)(塑胶定位柱不上锡)
于BGA pad,呈方
形或圆形
1.0Pitch
(2666001 S1
26
PU17&PU18) 焊盘形状类似
于BGA pad,呈方
形或圆形
1.0Pitch
DIMM connector 27 (2532001 S1 J6) 0.6Pitch
28
Connector 焊盘类似BGA类 (2691101 S2 J1)
14 (2776301/2795801
2811801/2804001)
PIP CNTR 信号pin:3.0pitch
PIP connector
15
（2588101）
6012B0542901
3.0pitch
16
PIP connector (2451801/2660301)
2.55pitch
VGA connector
2.1mm 0.45
0.4mm
0.13(0.15)
Aperture: 外切0.45mm,防锡珠 中间pad开十字,架桥0.4mm
4.4mm
Aperture: 铜环宽度开孔内缩0.1mm(即中心处架桥直径为(Φ +0.1*2)mm=4.4mm; 外拉1.6~2.0mm 架桥0.6mm(加固连接强度) PS:其背面的铜环不上锡
Thermal pad size:L*W=3.55*3.55mm,5ea via hole 由于thermal pad小,Via hole多,若开斜纹则无法满足 锡量.
此类不规则thermal pad且 via hole数量多，斜纹开孔 导致锡量严重不足.
PAD：0.56*0.56方形 内距：0.44mm
PIP CNTR 信号pin:3.0pitch
32
PIP Connector (2797001)
PIP CNTR 信号pin:2.0pitch
33
PIP Connector (2804201)
PIP CNTR 信号pin:2.0pitch
34
PIP Connector (2776301)
PIP CNTR 信号pin:2.5pitch
0.15(0.18)
Aperture: 1. L*W=2.5*1.5mm方形开孔,开孔间距0.4mm以上, 2.特殊情况:中间孔不插pin针(零件实物为两pin).中间孔则以焊 盘1：1开制，中间架桥0.1mm
0.15(0.18)
Aperture: 开边长为1.6mm的正方形,开孔间距0.4mm ( 防锡珠开法，不易开太长零件塑胶压锡)
17
(2605201/301
2775301/501/601)
1.38pitch
VGA connector
18 (2605301/2775301/
501/601)
1.52pitch
VGA connector
18 (2605301/2775301/
501/601)
1.52pitch
VGA connector
0.15(0.18)
Aperture: 信号pin:2.8*1.9mm方形孔,开孔间距0.7mm 上下两排孔的边缘间距4.5mm ( 防锡珠防呆开法,防止有类似1Opin 的PIP分主替料结构尺寸 差异,存在零件塑胶压锡的risk)
0.15(0.18)
Aperture: 信号pin:2.8*1.9mm方形孔,开孔间距0.7mm 上下两排孔的边缘间距4.5mm ( 防锡珠防呆开法,防止有类似1Opin 的PIP分主替料结构尺寸 差异,存在零件塑胶压锡的risk)
6
PIP connector
1.27pitch
6
PIP connector
1.27pitch
7
PIP part(connector) (2523401)
2.0pitch (6pin针)
8
PIP part(connector) (2761301)
2.55pitch (2pin /4pin针)
9
PIP part(connector) (2523401)
信号pin为1.27pitch(pin W:0.9mm) Lock pin size:孔径1.3mm的圆
Thermal pad size(左图):L*W=1.58*1.58mm,5ea via hole Thermal pad size(右图):L*W=2.40*1.68mm,5ea via hole 由于thermal pad小,Via hole多,若开斜纹则无法满足 锡量.
No.
零件類型
Pitch(mm)
1
DIMM connector (2559401)
1.0Pitch
2
SD card
1.7pitch
3
Switch (2448101)
1.65pitch
3
Switch (2448101)
1.65pitch
4
Battery socket (电池底座)
5
铜柱(螺帽) (2589701)
0.15(0.18)
Aperture: W*L=1.2*(2.2~2.5)mm方形,开孔间距0.30~0.40mm (材料垂直方向无stand-off,不易开太宽,否则塑胶压锡会产生锡 珠issue)
0.15(0.18)
Aperture: L*W=1.8*2.6mm方形,开孔间距0.45mm (此材料为L型弯pin,零件本体不会压到锡膏
34
PIP Connector (2776301)
PIP CNTR 信号pi(2776301)
PIP CNTR 信号pin:2.5pitch
36
PIP Connector (2811401)
PIP CNTR 信号pin:2.55pitch
Pad图形及尺寸(mm)
1.0Pitch 最近两个焊盘
pitch值
29
PIP Connector
PIP CNTR 1.27pitch
30
PIP Connector (2666001/2807301)
PIP CNTR 信号pin:0.5pitch
PIP Connector
31 (2776301/2795801
2811801/2804001)
0.15
Aperture: 信号pin: 2.0*1.0(长外拉0.5mm) Lock pin :2.4*1.72mm (Lock pin上下两侧各外拉0.2mm,外侧外拉0.5mm,内侧不可外 拉防止压锡产生锡珠issue)
0.13(0.15)
0.13(0.15)
0.13(0.15)
Aperture: 1.信号pin: 两外侧pin开孔分别内切0.2mm,X方向外拉1.0mm， Y方向两侧各外拉0.7mm, 2.Lock pin 大pad 内切0.3mm,X方向两侧分别外拉1.8mm,Y方向 外拉1.0mm 开孔间隙加宽防止钢网易变软失去张力
( 防锡珠开法，不易开太长零件塑胶压锡)
2.5pitch (2pin /4pin针
L型弯pin)
9
PIP part(connector) (2523401)
2.5pitch (2pin /4pin针
L型弯pin)
10
PIP part(connector) (2512401)
2.0 &2.5pitch (2pin/3pin)
11
PIP connector (2604901/2761301）
Pad size:2.5mm*0.7mm 此Lock pin在W/S上锡,故SMT未开孔上锡(特殊制程)
信号pin:1.5*1.0mm Lock pin :2.0*1.22mm
信号pin:两pin间隙0.36mm
PAD: 2.55mm
Plate NUT 孔径:Φ166mil(4.2164mm) PAD:铜环宽度2.2mm
19 (2388401/2590701)
(2592501/2706601)
1.52pitch
20
USB CONNECTOR (2605201)
1.58pitch
21
CONNECTOR (2529401)
1.8pitch
22
CNTR (2447701/2660601)
1.27pitch
QFN thermal pad