QS-JMME-115A(ProfilingWI)回流焊炉测温作业指导书
Reflow Oven Profiling Work Instruction
文件编
号
QS-JMME-115 回流焊炉测温作业指导书版本号A
编
制Ken Chen
核
准
Dick
Lee
日
期17 Feb, 2006
Page 5 of 7
6.1 回流焊测试仪Profile Checker
6.2 高温锡线High Activity Type Solder Wire
6.3 印刷线路板PCB
6.4 铬铁Iron Tip
7.程序PROCEDURE
7.1 回流焊温区分预热、浸润、回焊和冷却四个部份,详细如图1。

Reflow temperature to divide pre-heat, soak, reflow and cooling 4 parts. Detail
see figure 1.
图1
Figure 1
7.2 回流焊测温图规格(适合一般含铅锡浆,如Alpha LR591 / OL107E等)。

Specification of reflow profiling(For general Leaded Solder Paste, such as Alpha
LR591 / OL107E etc).
7.2.1 预热升温速度少于或等于3℃每秒。

(由室温至120℃)
Heat ramp of pre-heat ambient up ≦ 3℃/ sec. (Start from room
temp. to 120℃)
7.2.2 浸润温度达至120~140℃,时间为20~120秒。

Soak ambient to 120~140℃for 20~120sec.
7.2.3 回焊温度达至高于183℃,最高温度为210 ±5℃,时间为1分钟±15秒。

Reflow ambient to above 183℃and peak temperature 210 ±5℃for 1
Reflow Oven Profiling Work Instruction
文件编
号
QS-JMME-115 回流焊炉测温作业指导书版本号A
编
制Ken Chen
核
准
Dick
Lee
日
期17 Feb, 2006
Page 10 of 7
Base on product model, found out Reflow Profile from MI for refer.
7.7.1.1 Profiler测温报告图的简易说明如下:
The simple illustration of Profiler report as below:
7.7.1.2 A项为各测温点的最高温度。

Item A is the maximum temperature of each profiling
channels.
7.7.1.3 B项为各测温点在此温度范围的停留时间, 此区可在软件中
调整温度范围。

Item B is the total time of each channels in this area,
this area can adjust the range of temperature in the
software.
7.7.1.4 C项为各测温点在此温度以上的停留时间, 此区可在软件中
调整温度。

Item C is the total time of each channels above this
temperature, this temperature can adjust in the
software.
7.7.1.5 D项为测温的时间及日期。